Patents by Inventor Takehiro Ui
Takehiro Ui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10816164Abstract: A lamp reflector (10a) includes a mirror surface (11) and a laminate (12a). The mirror surface (11) is a surface for reflecting light from a light source (30) to guide the light in a predetermined direction. The laminate (12a) covers at least a part of the mirror surface (11) to absorb an electromagnetic wave having a specific frequency of 20 GHz to 90 GHz. The laminate (12a) allows the light from the light source (30) to transmit therethrough toward the mirror surface (11).Type: GrantFiled: June 12, 2018Date of Patent: October 27, 2020Assignee: NITTO DENKO CORPORATIONInventors: Hiroichi Ukei, Takehiro Ui, Ryosuke Aoki, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
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Publication number: 20200214181Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.Type: ApplicationFiled: March 27, 2018Publication date: July 2, 2020Applicant: NITTO DENKO CORPORATIONInventors: Kazuto Yamagata, Hironobu Machinaga, Yuuki Takeda, Hiroichi Ukei, Takehiro Ui
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Publication number: 20200207059Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600?/?. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100?/?.Type: ApplicationFiled: March 27, 2018Publication date: July 2, 2020Applicant: NITTO DENKO CORPORATIONInventors: Kazuto Yamagata, Hironobu Machinaga, Eri Ueda, Hiroichi Ukei, Takehiro Ui
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Patent number: 10701848Abstract: For the purpose of providing an electromagnetic wave absorber capable of holding excellent performance over a long period of time, the electromagnetic wave absorber includes: a dielectric layer B including a polymer film and having a first surface and a second surface; a resistive layer A formed on the first surface of the dielectric layer Band containing indium tin oxide as a main component; and an electrically conductive layer C formed on the second surface of the dielectric layer B and having a sheet resistance lower than that of the resistive layer A, wherein the indium tin oxide in the resistive layer A contains 20 to 40 wt. % of tin oxide based on the total weight of the indium tin oxide.Type: GrantFiled: December 14, 2016Date of Patent: June 30, 2020Assignee: NITTO DENKO CORPORATIONInventors: Kazuto Yamagata, Hironobu Machinaga, Takehiro Ui, Hiroichi Ukei, Yuya Kitagawa, Kazuaki Sasa
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Publication number: 20200178426Abstract: An electromagnetic wave absorber includes an electromagnetic wave-absorbing layer (10) and an adhesive layer (20). The adhesive layer (20) is disposed on at least one surface of the electromagnetic wave-absorbing layer (10). The electromagnetic wave absorber is capable of being adhered to a surface having a step in such a manner that the adhesive layer (20) is in contact with the surface. The adhesive layer (20) has a thickness equal to or greater than a reference height determined by subtracting 0.1 mm from the height of the step. In the electromagnetic wave absorber, a return loss ?R defined by ?R=Rt?Rr is 15 dB or more. Rt is a reflection amount of a 76-GHz electromagnetic wave and is measured for a reference specimen. Rr is a reflection amount of a 76-GHz electromagnetic wave and is measured for a specimen obtained by adhering the electromagnetic wave absorber.Type: ApplicationFiled: June 12, 2018Publication date: June 4, 2020Applicant: NITTO DENKO CORPORATIONInventors: Takehiro Ui, Hiroichi Ukei
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Publication number: 20200161771Abstract: An electromagnetic wave absorber (1a) includes a first layer (10) and an electrically conductive layer (20). The first layer (10) is a dielectric layer or a magnetic layer. The electrically conductive layer (20) is provided on at least one surface of the first layer. A product of a Young's modulus of the first layer (10) and a thickness of the first layer (10) is 0.1 to 1000 MPa · mm. The first layer (10) has a relative permittivity of 1 to 10.Type: ApplicationFiled: January 23, 2018Publication date: May 21, 2020Applicant: NITTO DENKO CORPORATIONInventors: Hiroichi Ukei, Takehiro Ui, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
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Publication number: 20200128705Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrical conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrical conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) includes indium oxide as a main component, has a polycrystalline structure, and has a sheet resistance of 260 to 500?/? and a specific resistance of 5×10?4 ?·cm or more.Type: ApplicationFiled: March 27, 2018Publication date: April 23, 2020Applicant: NITTO DENKO CORPORATIONInventors: Kazuto Yamagata, Hironobu Machinaga, Yuuki Takeda, Eri Ueda, Hiroichi Ukei, Takehiro Ui
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Publication number: 20200116332Abstract: A lamp reflector (10a) includes a mirror surface (11) and a laminate (12a). The mirror surface (11) is a surface for reflecting light from a light source (30) to guide the light in a predetermined direction. The laminate (12a) covers at least a part of the mirror surface (11) to absorb an electromagnetic wave having a specific frequency of 20 GHz to 90 GHz. The laminate (12a) allows the light from the light source (30) to transmit therethrough toward the mirror surface (11).Type: ApplicationFiled: June 12, 2018Publication date: April 16, 2020Applicant: NITTO DENKO CORPORATIONInventors: Hiroichi Ukei, Takehiro Ui, Ryosuke Aoki, Hironobu Machinaga, Kazuto Yamagata, Yuuki Takeda
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Patent number: 10512200Abstract: An electromagnetic wave absorber (1a) includes: a first layer (10a) being a dielectric layer or a magnetic layer; and a conductive layer (20a) provided on at least one surface of the first layer (10a). The conductive layer (20a) has a sheet resistance of 100?/? or less after the electromagnetic wave absorber (1a) is exposed to an environment having a temperature of 85° C. and a relative humidity of 85% for 1000 hours. The electromagnetic wave absorber (1a) has a flexural rigidity of 7000 MPa·mm4 or less.Type: GrantFiled: December 11, 2017Date of Patent: December 17, 2019Assignee: NITTO DENKO CORPORATIONInventors: Hironobu Machinaga, Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuuki Takeda
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Publication number: 20190380232Abstract: An electromagnetic wave absorber (1a) includes: a first layer (10a) being a dielectric layer or a magnetic layer; and a conductive layer (20a) provided on at least one surface of the first layer (10a). The conductive layer (20a) has a sheet resistance of 100?/? or less after the electromagnetic wave absorber (1a) is exposed to an environment having a temperature of 85° C. and a relative humidity of 85% for 1000 hours. The electromagnetic wave absorber (1a) has a flexural rigidity of 7000 MPa·mm4 or less.Type: ApplicationFiled: December 11, 2017Publication date: December 12, 2019Applicant: NITTO DENKO CORPORATIONInventors: Hironobu Machinaga, Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuuki Takeda
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Publication number: 20180332742Abstract: For the purpose of providing an electromagnetic wave absorber capable of holding excellent performance over a long period of time, the electromagnetic wave absorber includes: a dielectric layer B including a polymer film and having a first surface and a second surface; a resistive layer A formed on the first surface of the dielectric layer Band containing indium tin oxide as a main component; and an electrically conductive layer C formed on the second surface of the dielectric layer B and having a sheet resistance lower than that of the resistive layer A, wherein the indium tin oxide in the resistive layer A contains 20 to 40 wt. % of tin oxide based on the total weight of the indium tin oxide.Type: ApplicationFiled: December 14, 2016Publication date: November 15, 2018Applicant: NITTO DENKO CORPORATIONInventors: Kazuto Yamagata, Hironobu Machinaga, Takehiro Ui, Hiroichi Ukei, Yuya Kitagawa, Kazuaki Sasa
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Publication number: 20180319138Abstract: For the purpose of providing an electromagnetic wave absorber usable for radar having a high revolution and sufficiently adaptable to a plurality of radars different in frequency, the bandwidth of a frequency band in which an electromagnetic wave absorption amount is not less than 20 dB is not less than 2 GHz, within a frequency band of 60 to 90 GHz.Type: ApplicationFiled: December 14, 2016Publication date: November 8, 2018Applicant: NITTO DENKO CORPORATIONInventors: Hiroichi Ukei, Takehiro Ui, Kazuto Yamagata, Yuki Takeda, Hironobu Machinaga, Yuya Kitagawa, Kazuaki Sasa
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Publication number: 20150014934Abstract: A foamable sealing material contains a polymer, a foaming agent, and a fire retardant. The fire retardant contains 5 to 110 parts by mass of metal hydroxide and 5 to 110 parts by mass of a halogen organic compound relative to 100 parts by mass of the polymer. The foamable sealing material is foamable for sealing a space.Type: ApplicationFiled: March 15, 2013Publication date: January 15, 2015Applicant: NITTO DENKO CORPORATIONInventor: Takehiro Ui
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Publication number: 20140142208Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.Type: ApplicationFiled: January 22, 2014Publication date: May 22, 2014Applicant: NITTO DENKO CORPORATIONInventors: Takehiro UI, Youhei HAYASHI
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Publication number: 20140088211Abstract: A thermally foamable resin composition includes a base resin, foamable resin particles, and a cross-linking agent, wherein each of the foamable resin particles contains a solid resin and a thermally expandable substance contained in the solid resin.Type: ApplicationFiled: April 3, 2012Publication date: March 27, 2014Applicant: NITTO DENKO CORPORATIONInventors: Youhei Hayashi, Yoshiaki Mitsuoka, Takehiro Ui
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Patent number: 8673423Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.Type: GrantFiled: March 22, 2011Date of Patent: March 18, 2014Assignee: Nitto Denko CorporationInventors: Takehiro Ui, Youhei Hayashi
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Publication number: 20140030539Abstract: A foaming composition for filling and sealing contains a vinyl copolymer having an ester bond in a side chain thereof, an organic peroxide, a foaming agent, a hydrophobic resin, and a hydrophilic resin. A content ratio of the hydrophobic resin is in a range of 5 to 25 parts by mass based on 100 parts by mass of the vinyl copolymer. A content ratio of the hydrophilic resin is in a range of 1 to 20 parts by mass based on 100 parts by mass of the vinyl copolymer.Type: ApplicationFiled: April 13, 2012Publication date: January 30, 2014Applicant: NITTO DENKO CORPORATIONInventors: Takehiro Ui, Youhei Hayashi
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Patent number: 8225569Abstract: A foam filling member that can hold a foam sheet in a looped shape stably, without increasing the number of components, to provide improved vibration suppression and sound insulation. The strip-like foam sheet is formed in a looped shape by bending round it, so that both end portions of the foam sheet are overlapped with each other in a thickness direction thereof to form an overlapped portion therein. Then, insertion shafts of a clip are inserted through the overlapped portion, so that the overlapped portion is held in sandwich relation between a base portion and a head portion to form a foam filling member. Then, a supporting portion of the fixing portion of the clip is inserted in a fixing hole of an inner panel and fixed to the inner panel.Type: GrantFiled: August 27, 2010Date of Patent: July 24, 2012Assignee: Nitto Denko CorporationInventors: Kazuhiko Kinpara, Shinji Muto, Shinpei Nishikawa, Takehiro Ui
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Publication number: 20110244212Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.Type: ApplicationFiled: March 22, 2011Publication date: October 6, 2011Applicant: Nitto Denko CorporationInventors: Takehiro Ui, Youhei Hayashi
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Patent number: 7994230Abstract: Filling foam composition capable of providing excellent rustproofing and also suppressing reduction of a foam ratio of the filling foam composition even when reusing unwanted parts thereof and inferior goods thereof; a foam filling member using the same filling foam composition; and a filling foam produced by foaming the filling foam composition. The filling foam composition is prepared by mixing foamable polymer, a foaming agent, and a basic oxide in such a mixing ratio that a ratio of the basic oxide can be in the range of 0.05-70 parts by weight per 100 parts by weight of foaming agent. The mounting member for the filling foam composition to be mounted in an internal space of a hollow member is produced by mounting a mounting member on the filling foam composition obtained. The filling foam is formed by fitting the foam filling member in the internal space of the hollow member and, then, foaming the filling foam composition by the application of heat.Type: GrantFiled: October 26, 2009Date of Patent: August 9, 2011Assignee: Nitto Denko CorporationInventors: Takehiro Ui, Manabu Matsunaga, Mitsuo Matsumoto