Abstract: A printed wiring board includes a core substrate and first and second build-up layers. The substrate includes a core layer, through-hole conductors formed in through holes such that each through hole has first opening tapering from first toward second surface of the core layer, and second opening tapering from second toward first surface of the core layer, and first and second through-hole lands directly connected to the through-hole conductors. Each build-up layer includes an insulating layer, via conductors, via lands, an outermost insulating layer, an outermost conductor layer, and outermost via conductors. Each of the through-hole lands, via lands and outermost conductor layers includes a metal foil, a seed layer and an electrolytic plating film. The foils have mat surfaces such that the mat surfaces of the via lands has ten-point average roughness smaller than ten-point average roughness of the mat surfaces of the through-hole lands and outermost conductor layers.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

Abstract: A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.

Abstract: A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings.

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.

Abstract: A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

Abstract: A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract: A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

Abstract: A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

Abstract: A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.

Abstract: An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, the third surface is perpendicular to the first surface, the fourth surface is on the opposite side of the third surface, and the insulating layers are laminated on the third surface, and conductor layers formed in the insulating plate such that each conductor layer is interposed between adjacent insulating layers and includes straight conductors having first electrodes exposed from the first surface and second electrodes exposed from the second surface, respectively.

Abstract: A method for manufacturing an electronic component attached board includes preparing a first support plate, forming aggregate wiring boards on the first plate such that the aggregate boards each including wiring board side by side are formed in connected state on surface of the first plate, separating the first plate from the aggregate boards, dividing the aggregate boards into individual aggregate boards each including the wiring boards, bonding a second support plate to surface of each individual aggregate board such that each individual aggregate board is bonded to surface of the second plate, mounting electronic components on the wiring boards on the second plate such that each wiring board has an electronic component thereon, dividing the wiring boards into individual wiring boards, and separating the second plate from the individual wiring board. The surface of the first plate has size larger than size of the surface of the second plate.

Abstract: A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.

Abstract: A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an electronic component, second pads formed on a periphery portion of the first surface of the buildup wiring layer and positioned to connect an external wiring board, a solder layer including a plating material and formed on the first pads such that the solder layer is formed on each of the first pads, conductive posts including a plating material and formed on the second pads, respectively, and a seed layer including first seed layer portions formed between the first pads and the solder layer and second seed layer portions formed between the second pads and the conductive posts.