Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.

Abstract: A controller of a multi-phase electric motor has a drive section having an upper arm switching element and a lower arm switching element for driving the multi-phase electric motor, a single current detection section for detecting a current value of the multi-phase electric motor, a pulse width modulation signal generation section for generating plural pulse width modulation of each phase within one control period based on the current value detected by the current detection section and a carrier signal, and a phase movement section for moving the pulse width modulation signal of a predetermined phase generated by the pulse width modulation signal generation section by gradually changing a movement amount of the phase in one control period, and outputting the resultant pulse width modulation signal to the drive section.

Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.

Abstract: A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 ?m or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract: An electric motor 10 for an electric power steering system, in which a board mounting portion 23 of aluminum for partitioning an electric motor body 10A and a circuit board 40 is formed all over the inner side of a motor case 20 and in which a bearing 25 of an output shaft 11 of the electric motor body 10A is supported on the board mounting portion 23 to release the heat effectively from FETs 43 mounted on the circuit board 40 and the output shaft 11. On the other hand, pigtail wires 36 from brushes 33 are welded to brush leads 27 having a wide surface area so that the circuit board 40 may be prevented from rising to a high temperature at the welding time.