Patents by Inventor Takenori Fujiwara

Takenori Fujiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200233037
    Abstract: According to one embodiment, an evaluation device for an energy storage device includes first processing circuitry and second processing circuitry. The first processing circuitry acquires data items including an amount of charge and a voltage value measured in a measurement period from the energy storage device, the energy storage device being charge-discharge-controlled according to charge-discharge command values. The second processing circuitry generates a representative data item of voltage values for amounts of charge, based on the data items acquired for the measurement period; and evaluates a degradation state of the energy storage device, based on a relative change between a plurality of the representative data items corresponding to a plurality of the measurement periods.
    Type: Application
    Filed: September 11, 2019
    Publication date: July 23, 2020
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Takahiro YAMAMOTO, Hisaaki Tatano, Kenichi Fujiwara, Masatake Sakuma, Kaoru Koiwa, Yasuhiro Ogura, Takenori Kobayashi, Kenji Mitsumoto
  • Publication number: 20200217896
    Abstract: According to one embodiment, a device for evaluating an energy storage device includes first processing circuitry and second processing circuitry. The first processing circuitry detects a plurality of times at which an amount of charge of the energy storage device satisfies a threshold condition, based on measurement data on the energy storage device in operation, selects a plurality of time intervals, calculates a charge-discharge efficiency in each of the time intervals based on charge-discharge command values belonging to the time interval, and divides a set of the charge-discharge efficiencies into a plurality of clusters and generates characteristic information on the clusters based on at least one of the measurement data and the charge-discharge command values. The second processing circuitry generates output data for displaying: transition data indicating transition of the charge-discharge efficiency belonging to the cluster; and characteristic information on the cluster.
    Type: Application
    Filed: September 11, 2019
    Publication date: July 9, 2020
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Energy Systems & Solutions Corporation
    Inventors: Hisaaki Hatano, Takahiro Yamamoto, Kenichi Fujiwara, Masatake Sakuma, Takenori Kobayashi, Yasuhiro Ogura, Kenji Mitsumoto
  • Patent number: 10573941
    Abstract: In one embodiment, a temperature management device is provided with a plurality of battery cells, power sensor(s) each of which detects the charge/discharge power of battery cell(s) at a prescribed time interval, a power representative value calculation section which calculates a power representative value of a time lapse data of the charge/discharge power(s) detected by the power sensor, temperature sensor(s) each of which detects the temperature of battery cell(s) at a prescribed time interval, a temperature representative value calculation section which calculates a temperature representative value of a time lapse data of temperature(s) detected by the temperature sensor, a radiation characteristic identification section which identifies a radiation characteristic from the temperature representative value and the power representative value, and an air conditioning setting calculation section which calculates an air conditioning setting for the battery cell(s) corresponding to the power representative value
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 25, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenichi Fujiwara, Takahiro Yamamoto, Ryosuke Takeuchi, Masatake Sakuma, Tomohiro Toyosaki, Takenori Kobayashi
  • Patent number: 10553909
    Abstract: A battery pack includes a plurality of battery modules that includes a plurality of battery cells, a battery cell holder, a second-electrode assembly including a plurality of second-electrode bus bar plates, a first-electrode assembly, and a cover. The first-electrode assembly includes a plurality of first-electrode bus bar plates, a first-electrode terminal, a second-electrode terminal connected to one of the plurality of second-electrode bus bar plates, and an inter-electrode bus bar connecting the second-electrode bus bar plate and one of the first-electrode bus bar plate and the first-electrode terminal. The first-electrode assembly is in a first pattern or a second pattern. An arrangement of the first-electrode terminal and the second-electrode terminal in the battery module differs according to the pattern of the first-electrode assembly.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: February 4, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takenori Kobayashi, Nobuyoshi Fujiwara, Kiyonari Kojima
  • Publication number: 20200003839
    Abstract: According to one embodiment, an evaluation device includes first processing circuitry and second processing circuitry. The first processing circuitry calculates a feature value of an energy storage device based on voltage values measured from the energy storage device being subjected to charge-discharge-control according to charge-discharge command values. The second processing circuitry derives an evaluation function of a degradation state of the energy storage device according to a difference between a distribution of the charge-discharge command values and a reference distribution. The second processing circuitry evaluates the degradation state of the energy storage device, based on the evaluation function and the calculated feature value.
    Type: Application
    Filed: September 11, 2019
    Publication date: January 2, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takahiro YAMAMOTO, Hisaaki HATANO, Masatake SAKUMA, Kenichi FUJIWARA, Takenori KOBAYASHI, Tomohiro TOYOSAKI, Yoshiyuki SAKAMOTO
  • Patent number: 10451969
    Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: October 22, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takenori Fujiwara, Yugo Tanigaki
  • Patent number: 10409163
    Abstract: To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: September 10, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yugo Tanigaki, Takenori Fujiwara
  • Publication number: 20190080952
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Application
    Filed: November 12, 2018
    Publication date: March 14, 2019
    Applicant: Toray Industries, Inc.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Patent number: 10177022
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: January 8, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Publication number: 20180281361
    Abstract: The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.
    Type: Application
    Filed: October 24, 2016
    Publication date: October 4, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takuro ODA, Shinji ARIMOTO, Takenori FUJIWARA
  • Publication number: 20180164683
    Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).
    Type: Application
    Filed: April 20, 2016
    Publication date: June 14, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takenori Fujiwara, Yugo Tanigaki
  • Publication number: 20170285477
    Abstract: To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6). 7.5?(X)?75??(4) 2.5?(Y)?40??(5) 1.
    Type: Application
    Filed: September 18, 2015
    Publication date: October 5, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yugo TANIGAKI, Takenori FUJIWARA
  • Publication number: 20170243737
    Abstract: Disclosed is a method for manufacturing a semiconductor device, including a step of yielding a pattern 2a of a polysiloxane-containing composition over a substrate 1, and a step of forming an ion impurity region 6 in the substrate, wherein, after the step of forming an ion impurity region, the method further includes a step of firing the pattern at a temperature of 300 to 1,500° C. This method makes it possible that after the formation of the ion impurity region in the semiconductor substrate, the pattern 2a of the polysiloxane-containing composition is easily removed without leaving any residual. Thus, the yield in the production of a semiconductor device can be improved and the tact time can be shortened.
    Type: Application
    Filed: March 18, 2015
    Publication date: August 24, 2017
    Applicant: Toray Industries, Inc.
    Inventors: Yugo Tanigaki, Takenori Fujiwara
  • Publication number: 20170221746
    Abstract: The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.
    Type: Application
    Filed: August 5, 2015
    Publication date: August 3, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
  • Patent number: 9704724
    Abstract: Disclosed is a photosensitive resin composition which exhibits positive or negative photosensitivity and is used as a mask in an ion implantation step, the photosensitive resin composition including, as a resin, (A) a polysiloxane. The photosensitive resin composition of the present invention has high heat resistance and is capable of controlling a pattern shape, and also has excellent ion implantation mask performance, thus enabling application to a low-cost high-temperature ion implantation process.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: July 11, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takenori Fujiwara, Yugo Tanigaki, Mitsuhito Suwa
  • Patent number: 9377686
    Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: June 28, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Takenori Fujiwara, Yugo Tanigaki, Ichiro Masuda, Yusuke Fukuzaki
  • Publication number: 20150205203
    Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).
    Type: Application
    Filed: June 6, 2013
    Publication date: July 23, 2015
    Inventors: Takenori Fujiwara, Yugo Tanigaki, Ichiro Masuda, Yusuke Fukuzaki
  • Patent number: 9048445
    Abstract: To provide a gate insulating material which has high chemical resistance, is superior in coatability of a resist and an organic semiconductor coating liquid, and has small hysteresis, a gate insulating film and an FET using the same by a polysiloxane having an epoxy group-containing silane compound as a copolymerization component.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: June 2, 2015
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Seiichiro Murase, Takenori Fujiwara, Yukari Jo, Jun Tsukamoto
  • Publication number: 20140242787
    Abstract: Disclosed is a photosensitive resin composition which exhibits positive or negative photosensitivity and is used as a mask in an ion implantation step, the photosensitive resin composition including, as a resin, (A) a polysiloxane. The photosensitive resin composition of the present invention has high heat resistance and is capable of controlling a pattern shape, and also has excellent ion implantation mask performance, thus enabling application to a low-cost high-temperature ion implantation process.
    Type: Application
    Filed: December 21, 2012
    Publication date: August 28, 2014
    Applicant: TORAY Industries, Inc.
    Inventors: Takenori Fujiwara, Yugo Tanigaki, Mitsuhito Suwa
  • Publication number: 20120237873
    Abstract: Disclosed is a positive photosensitive resin composition which contains a polisiloxane, a naphthoquinone diazide compound, and a solvent. The positive photosensitive resin composition is characterized in that the polysiloxane has: an organosilane-derived structure represented by the general formula (1): at a content ration of 20-80% inclusive of Si relative to the overall number of moles of Si atoms in the polysiloxane; and an organosilane-derived structure represented by general formula (2): The positive photosensitive resin composition exhibits high heat resistance, high transparency, and enables high sensitivity, high resolution patterning. The positive photosensitive resin composition can be used to form cured films such as planarization films used in TFT substrates, interlayer insulating films, core materials and cladding materials, and can be used in elements having cured films such as display elements, semiconductor elements, solid-state imaging elements, and optical waveguide elements.
    Type: Application
    Filed: December 20, 2010
    Publication date: September 20, 2012
    Applicant: TORAY INDUSTRIES INC.
    Inventors: Takenori Fujiwara, Keiichi Uchida, Yugo Tanigaki, Mitsuhito Suwa