Abstract: A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate (13) in the non-display area and connected to a control circuit substrate; a plurality of drivers (21) in the non-display area; a plurality of connection wiring lines (27) in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver (21A); a second driver (21B) that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line (32) that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line (31) that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.

Abstract: A vehicular occupant protection apparatus is provided, which includes: a controller for activating an occupant protector based on a detection result of a vehicle accident detector; a communication circuit for transmitting an accident data to a emergency call apparatus; and a backup circuit connected to the emergency call apparatus for supplying the controller with electric power from a backup battery. When the vehicle accident occurs, the controller performs power control in which the controller turns on the backup circuit and transmits the accident data to the emergency call apparatus by being supplied with the electric power from the backup battery, and turns off the backup circuit after transmitting the accident data to the emergency call apparatus.

Abstract: In a diffractive element, its grating pattern is so configured that a diffraction angle of a diffracted light beam of a light source that is subject to the first-order diffraction in a diffraction area is matched with an angle of a light beam passing through the diffractive area emitted from a light source and a light source position is matched with a light originating point of the light source that emits a light beam to be transmitted, and the center of light intensity distribution is matched with that of the light source passing through the diffractive element by inclining an optical axis of the light source. A position of the diffractive element is adjusted based on an electric current value generated when a reflected return path light beam of the light source is diffracted by the diffractive element and enters the light source.

Abstract: Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC (10) has a plurality of output bumps (12) arranged in the direction (direction A) along the long sides (11a and 11b). The output bumps include a plurality of source bumps (12a) arranged near the center section of the long side, and a plurality of gate bumps (12b) arranged towards the end portions of the long side. The source bumps are arranged close to the long side (11a), and the gate bumps are arranged closer to the long side (11b) than the source bumps.

Abstract: Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

Abstract: A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.

Abstract: Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface.

Abstract: In a diffractive element, its grating pattern is so configured that a diffraction angle of a diffracted light beam of a light source that is subject to the first-order diffraction in a diffraction area is matched with an angle of a light beam passing through the diffractive area emitted from a light source and a light source position is matched with a light originating point of the light source that emits a light beam to be transmitted, and the center of light intensity distribution is matched with that of the light source passing through the diffractive element by inclining an optical axis of the light source. A position of the diffractive element is adjusted based on an electric current value generated when a reflected return path light beam of the light source is diffracted by the diffractive element and enters the light source.

Abstract: Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC (10) has a plurality of output bumps (12) arranged in the direction (direction A) along the long sides (11a and 11b). The output bumps include a plurality of source bumps (12a) arranged near the center section of the long side, and a plurality of gate bumps (12b) arranged towards the end portions of the long side. The source bumps are arranged close to the long side (11a), and the gate bumps are arranged closer to the long side (11b) than the source bumps.

Abstract: A drive circuit wherein any abnormality of a semiconductor element is prevented from being erroneously sensed in a case where a gate “ON” command has entered in a state in which a gate voltage of the semiconductor element has not lowered fully. A detection process for a controlled variable of the semiconductor element is permitted only within a period which corresponds to a controlled variable of the semiconductor element at the time when an “ON” signal has been inputted to a control circuit, and a detected controlled variable which is detected within the period and a comparison controlled variable which is set in correspondence with the controlled variable are compared so as to output an abnormality signal, whereby the semiconductor element is turn-off at a speed lower than in normal turn-off.

Abstract: A drive circuit wherein any abnormality of a semiconductor element is prevented from being erroneously sensed in a case where a gate “ON” command has entered in a state in which a gate voltage of the semiconductor element has not lowered fully. A detection process for a controlled variable of the semiconductor element is permitted only within a period which corresponds to a controlled variable of the semiconductor element at the time when an “ON” signal has been inputted to a control circuit, and a detected controlled variable which is detected within the period and a comparison controlled variable which is set in correspondence with the controlled variable are compared so as to output an abnormality signal, whereby the semiconductor element is turn-off at a speed lower than in normal turn-off.

Abstract: A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.

Abstract: Provided is a semiconductor laser device with a ridge waveguide that is excellent in polarization characteristics and easiness of mounting. In its outermost part on which the solder layer is deposited, the incomplete adherent layer is formed at least in the ridge structure. In bonding the semiconductor laser device to the mount via the solder layer, the incomplete adherent layer is not adhered or adhered incompletely to the solder layer. On either side of the incomplete adherent layer is formed the complete adherent layer.

Abstract: In a semiconductor laser device, a wiring board (101) has pad patterns on its top surface, on which a block (102) is also mounted. The block (102) has a first mounting surface (113) and a second mounting surface (114), both of which face in an identical direction. The block (102) also has a raising mirror (111) for changing an optical axis of light. On the first mounting surface (113) is mounted a semiconductor laser element (103) which emits laser light (L). On the second mounting surface (114) is mounted a light receiving element (104) which receives reflected light of the laser light (L).

Abstract: In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

Abstract: In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

Abstract: In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

Abstract: In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

Abstract: A current detecting sensor includes parallel flat plates opposed in a substantially U-shape in cross-section. Since the flat plates are opposed to each other, the current detecting sensor has reduced inductance, significantly decreasing frequency dependency of outputs from detection terminals.

Abstract: A continuously operative printing machine and a method of operating the same are disclosed. The printing machine has a plurality of switchable printing units to be used selectively by switching. For continuous printing the printing units are switched alternately by coupling and decoupling first coupling/decoupling means while a continuous printing web is held running. Plate change of stationary printing units is done with independent drive means to be ready for the next printing. Then the stationary printing units are restored to the printing state through synchronous control by rotational control means. Thus plate change printing or the like can be carried out continuously without stopping the printing machine. In addition, high quality printing can be obtained efficiently. Further, it is possible to obtain double side printing.