Patents by Inventor Takeshi Hosomi
Takeshi Hosomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149458Abstract: A robot remote operation control device includes, in robot remote operation control for an operator to remotely operate a robot capable of gripping an object, an information acquisition unit that acquires operator state information on a state of the operator who operates the robot, an intention estimation unit that estimates a motion intention of the operator who causes the robot to perform a motion, on the basis of the operator state information, and a gripping method determination unit that determines a gripping method for the object on the basis of the estimated motion intention of the operator.Type: ApplicationFiled: March 16, 2022Publication date: May 9, 2024Inventors: Tomoki Watabe, Akira Mizutani, Takeshi Chiku, Yili Dong, Tomohiro Chaki, Nanami Tsukamoto, Naoki Hosomi, Anirudh reddy Kondapally, Takahide Yoshiike, Christian Goerick, Dirk Ruiken, Bram Bolder, Mathias Franzius, Simon Manschitz
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Patent number: 11348849Abstract: In a semiconductor apparatus, the apparatus is so arranged as to comprise: a semiconductor device having electrodes and wiring-interconnects on a main surface of a semiconductor chip; a first resin structure member, being placed on a side of the main surface of the semiconductor chip, constituting, in lateral and upward directions of a specific electrode of the semiconductor device, a hollow-body structure between the specific electrode and the first resin structure member; a second resin structure member covering an outer lateral side of the first resin structure member, and having the permittivity smaller than or equal to the permittivity of the first resin structure member; and an insulation film covering an outer lateral side of the second resin structure member, and having moisture permeability lower than that of the second resin structure member.Type: GrantFiled: November 14, 2017Date of Patent: May 31, 2022Assignee: Mitsubishi Electric CorporationInventor: Takeshi Hosomi
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Publication number: 20200176340Abstract: In a semiconductor apparatus, the apparatus is so arranged as to comprise: a semiconductor device having electrodes and wiring-interconnects on a main surface of a semiconductor chip; a first resin structure member, being placed on a side of the main surface of the semiconductor chip, constituting, in lateral and upward directions of a specific electrode of the semiconductor device, a hollow-body structure between the specific electrode and the first resin structure member; a second resin structure member covering an outer lateral side of the first resin structure member, and having the permittivity smaller than or equal to the permittivity of the first resin structure member; and an insulation film covering an outer lateral side of the second resin structure member, and having moisture permeability lower than that of the second resin structure member.Type: ApplicationFiled: November 14, 2017Publication date: June 4, 2020Applicant: Mitsubishi Electric CorporationInventor: Takeshi HOSOMI
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Patent number: 9711460Abstract: A semiconductor device includes: a semiconductor chip including an electronic part; and a package sealing the semiconductor chip, wherein the package includes a transparent section which is opaque to visible light and transparent to near-infrared light or near-ultraviolet light, and the transparent section is disposed in such a way that the electronic part is observed from outside under the near-infrared light or the near-ultraviolet light.Type: GrantFiled: April 19, 2016Date of Patent: July 18, 2017Assignee: Mitsubishi Electric CorporationInventor: Takeshi Hosomi
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Patent number: 9693462Abstract: A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part.Type: GrantFiled: July 2, 2015Date of Patent: June 27, 2017Assignee: Mitsubishi Electric CorporationInventor: Takeshi Hosomi
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Publication number: 20170053877Abstract: A semiconductor device includes: a semiconductor chip including an electronic part; and a package sealing the semiconductor chip, wherein the package includes a transparent section which is opaque to visible light and transparent to near-infrared light or near-ultraviolet light, and the transparent section is disposed in such a way that the electronic part is observed from outside under the near-infrared light or the near-ultraviolet light.Type: ApplicationFiled: April 19, 2016Publication date: February 23, 2017Applicant: Mitsubishi Electric CorporationInventor: Takeshi HOSOMI
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Publication number: 20160143148Abstract: A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part.Type: ApplicationFiled: July 2, 2015Publication date: May 19, 2016Applicant: Mitsubishi Electric CorporationInventor: Takeshi HOSOMI
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Publication number: 20150239197Abstract: According to the present invention, there is provided an article including: a main body portion (10) that is formed of a material composition containing a fiber filler and a resin and obtained using a paper-making method; and a functional layer (20) that covers the main body portion (10).Type: ApplicationFiled: September 2, 2013Publication date: August 27, 2015Applicant: SUMITOMO BAKELITE CO., LTD.Inventors: Takeshi Hosomi, Tatsumi Kawaguchi, Yasutaka Kimura
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Patent number: 8629556Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.Type: GrantFiled: April 20, 2007Date of Patent: January 14, 2014Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Mitsuo Sugino, Takeshi Hosomi, Masahiro Wada, Masataka Arai
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Patent number: 8110444Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: GrantFiled: August 10, 2010Date of Patent: February 7, 2012Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
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Patent number: 8044505Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: GrantFiled: November 30, 2006Date of Patent: October 25, 2011Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
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Publication number: 20110256367Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: ApplicationFiled: June 28, 2011Publication date: October 20, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takeshi HOSOMI, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
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Publication number: 20110120630Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.Type: ApplicationFiled: January 26, 2011Publication date: May 26, 2011Applicant: Sumitomo Bakelite Co., Ltd.Inventors: Maroshi YUASA, Takeshi Hosomi, Masataka Arai
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Publication number: 20100300619Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: ApplicationFiled: August 10, 2010Publication date: December 2, 2010Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
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Patent number: 7759794Abstract: A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.Type: GrantFiled: March 9, 2006Date of Patent: July 20, 2010Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Mitsuo Sugino, Takeshi Hosomi, Yushi Sakamoto
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Patent number: 7655871Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.Type: GrantFiled: March 23, 2005Date of Patent: February 2, 2010Assignee: Sumitomo Bakelite Company LimitedInventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
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Publication number: 20090321919Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.Type: ApplicationFiled: April 20, 2007Publication date: December 31, 2009Inventors: Mitsuo Sugino, Takeshi Hosomi, Masahiro Wada, Masataka Arai
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Publication number: 20090302462Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: ApplicationFiled: November 30, 2006Publication date: December 10, 2009Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
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Publication number: 20090166060Abstract: An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.Type: ApplicationFiled: March 20, 2006Publication date: July 2, 2009Inventors: Iji Onozuka, Masataka Arai, Takeshi Hosomi
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Publication number: 20090126974Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.Type: ApplicationFiled: September 27, 2006Publication date: May 21, 2009Inventors: Maroshi Yuasa, Takeshi Hosomi, Masataka Arai