Patents by Inventor Takeshi Hosomi
Takeshi Hosomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090039487Abstract: A semiconductor device comprises a source frame having a die pad; a linear gate frame having a bonding pad; a semiconductor chip mounted on the die pad; wires which electrically connect a source terminal of the semiconductor chip to the die pad and electrically connect a gate terminal of the semiconductor chip to the bonding pad; and resin which seals the die pad, the bonding pad, the semiconductor chip, and the wires. The die pad is spaced from the bonding pad and diagonal to an extending direction of the gate frame, in the vicinity of the bonding pad.Type: ApplicationFiled: July 2, 2008Publication date: February 12, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Keiichi Kawashima, Naohito Yoshida, Takeshi Hosomi
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Publication number: 20080254300Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.Type: ApplicationFiled: March 23, 2005Publication date: October 16, 2008Inventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
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Patent number: 7368497Abstract: A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure.Type: GrantFiled: February 27, 2004Date of Patent: May 6, 2008Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Takeshi Hosomi, Masako Yamashita, Takayuki Baba, Kentaro Yabuki
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Publication number: 20080042272Abstract: A semiconductor device 100 has a BGA substrate 110, a semiconductor chip 101, a bump 106 and an underfill 108 filling the periphery of the bump. An interlayer dielectric 104 in the semiconductor chip 101 contains a low dielectric constant film. The bump 106 is comprised of a lead-free solder. The underfill 108 is comprised of a resin material having an elastic modulus of 150 MPa to 800 MPa both inclusive, and a linear expansion coefficient of the BGA substrate 110 in an in-plane direction of the substrate is less than 14 ppm/° C.Type: ApplicationFiled: March 9, 2006Publication date: February 21, 2008Inventors: Mitsuo Sugino, Takeshi Hosomi, Yushi Sakamoto
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Publication number: 20040234741Abstract: A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure.Type: ApplicationFiled: February 27, 2004Publication date: November 25, 2004Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takeshi Hosomi, Masako Yamashita, Takayuki Baba, Kentaro Yabuki
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Patent number: 6768197Abstract: A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.Type: GrantFiled: June 24, 2002Date of Patent: July 27, 2004Assignee: Sumitomo Bakelite Company, LTDInventors: Takeshi Hosomi, Ryouichi Okada, Kensuke Nakamura, Toyosei Takahashi
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Publication number: 20030060043Abstract: A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.Type: ApplicationFiled: June 24, 2002Publication date: March 27, 2003Inventors: Takeshi Hosomi, Ryouichi Okada, Kensuke Nakamura, Toyosei Takahashi
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Patent number: 6483195Abstract: The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semiconductor flip chip in which copper-cored solder bumps with high reliability of bonding are mounted on a semiconductor chip through the use of the transfer bump sheet. In the transfer bump sheet, metal posts of two or more layers are formed on a base sheet.Type: GrantFiled: March 9, 2000Date of Patent: November 19, 2002Assignee: Sumitomo Bakelite Company LimitedInventors: Hitoshi Aoki, Takeshi Hosomi, Kensuke Nakamura, Hideki Hara, Masaaki Kato
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Patent number: 5976699Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.Type: GrantFiled: October 10, 1996Date of Patent: November 2, 1999Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
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Patent number: 5854325Abstract: The present invention provides a photosensitive adhesive composition for additive plating, comprising the following components (a), (b), (c), (d), (e) and (f) as essential components; and an excellent multilayer printed circuit board obtained by using the adhesive composition:(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,(c) an epoxy acrylate or epoxy methacrylate compound,(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers,(e) a photopolymerization initiator, and(f) an acid-soluble filler.Type: GrantFiled: March 4, 1997Date of Patent: December 29, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Hiroshi Hayai, Takayuki Baba
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Patent number: 5806177Abstract: A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured.Type: GrantFiled: October 28, 1996Date of Patent: September 15, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
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Patent number: 5756190Abstract: An undercoating agent for a multilayer printed circuit board which comprises:(a) a normally solid epoxy resin having a softening point of 45.degree. to 120.degree. C.,(b) an epoxy resin curing agent,(c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and(d) a photopolymerization initiator,said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.Type: GrantFiled: October 22, 1996Date of Patent: May 26, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
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Patent number: 5726219Abstract: The present invention provides a rein composition comprising the following components (a), (b), (c), (d) and (e) as essential components; and an excellent multilayer printed circuit board obtained by using the resin composition:(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,(c) an epoxy acrylate or epoxy methacrylate compound,(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, and(e) a photopolymerization initiator.Type: GrantFiled: March 4, 1997Date of Patent: March 10, 1998Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Hiroshi Hayai, Takayuki Baba
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Patent number: 5110988Abstract: A nonlinear optical material comprising a nitroaniline derivative represented by the following chemical formula:A--CX.sub.2 --Rwherein A represents ##STR1## (Y represents at least one group selected from the group consisting of hydrogen, alkyl groups, deuterated alkyl groups and electron donor groups and Z represents hydrogen, deuterium, a methyl group or a deuterated methyl group), X represents hydrogen or deuterium, and R represents an alkoxy group, a deuterated alkoxy group or the same group as A.Type: GrantFiled: June 29, 1989Date of Patent: May 5, 1992Assignees: Sumitomo Bakelite Company Limited, Seizo Miyata, Naoya Miyata, Research Development Corporation of JapanInventors: Seizo Miyata, Takeshi Hosomi, Toshio Suzuki, Toshiyuki Watanabe, Hironobu Yamamoto, Akio Hayashi