Patents by Inventor Takeshi Iseki

Takeshi Iseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10373744
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: August 6, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Tsuda, Shogo Nakayama, Takeshi Iseki, Kazutoshi Matsumura
  • Patent number: 10141088
    Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 27, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Naohiro Mikamoto, Fuyuki Abe, Yuji Yasuoka, Akimitsu Fujii, Shogo Nakayama, Takeshi Iseki
  • Publication number: 20180211748
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Application
    Filed: March 26, 2018
    Publication date: July 26, 2018
    Inventors: Seiji TSUDA, Shogo NAKAYAMA, Takeshi ISEKI, Kazutoshi MATSUMURA
  • Patent number: 9959957
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: May 1, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Tsuda, Shogo Nakayama, Takeshi Iseki, Kazutoshi Matsumura
  • Publication number: 20170365380
    Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.
    Type: Application
    Filed: December 19, 2016
    Publication date: December 21, 2017
    Inventors: NAOHIRO MIKAMOTO, FUYUKI ABE, YUJI YASUOKA, AKIMITSU FUJII, SHOGO NAKAYAMA, TAKESHI ISEKI
  • Patent number: 9620267
    Abstract: In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: April 11, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Tsuda, Shoji Hoshitoku, Takeshi Iseki, Kazutosi Matumura
  • Publication number: 20160133362
    Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: SEIJI TSUDA, SHOGO NAKAYAMA, TAKESHI ISEKI, KAZUTOSHI MATSUMURA
  • Publication number: 20150129108
    Abstract: In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.
    Type: Application
    Filed: April 1, 2014
    Publication date: May 14, 2015
    Inventors: Seiji Tsuda, Shoji Hoshitoku, Takeshi Iseki, Kazutosi Matumura
  • Patent number: 9001485
    Abstract: An overvoltage protector includes a first discharging electrode, a second discharging electrode, and an overvoltage protection part provided between the first and second discharging electrodes. The overvoltage protecting part has an insulating property under a normal operation condition, and has a conductive property if an overvoltage is applied between the first and second discharging electrodes. The overvoltage protecting part is made of a mixture of resin having an insulation property, an inorganic compound having an insulating property, and metallic boride compound powder. The metallic boride compound powder has a high melting point therefore it is hardly melted. Under high temperatures causing the powder to melt, the powder is oxidized and loses conductivity, thus providing a high reliability.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: April 7, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kenji Nozoe, Hideaki Tokunaga, Takeshi Iseki, Takashi Morino, Kouichi Yoshioka
  • Patent number: 8943784
    Abstract: It is a method for producing a food-filled and sealed container having a high product value, in which a container lid made of resin is not deformed after sealing. In this method for producing a food-filled and sealed container, after a food is filled in a container body (10) made of thermoplastic resin, the container is sealed by heat sealing a container lid (20) made of thermoplastic resin, and the container body (10) and/or the container lid (20) have sealing surfaces (13, 24) provided with a concavity or convexity.
    Type: Grant
    Filed: May 11, 2010
    Date of Patent: February 3, 2015
    Assignees: Kabushiki Kaisha Yakult Honsha, Shikoku Kakoki Co., Ltd.
    Inventors: Takeshi Iseki, Masakatsu Kondo, Masao Kubo, Tomoyuki Masuda
  • Publication number: 20130083440
    Abstract: An overvoltage protector includes a first discharging electrode, a second discharging electrode, and an overvoltage protection part provided between the first and second discharging electrodes. The overvoltage protecting part has an insulating property under a normal operation condition, and has a conductive property if an overvoltage is applied between the first and second discharging electrodes. The overvoltage protecting part is made of a mixture of resin having an insulation property, an inorganic compound having an insulating property, and metallic boride compound powder. The metallic boride compound powder has a high melting point therefore it is hardly melted. Under high temperatures causing the powder to melt, the powder is oxidized and loses conductivity, thus providing a high reliability.
    Type: Application
    Filed: August 25, 2011
    Publication date: April 4, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Kenji Nozoe, Hideaki Tokunaga, Takeshi Iseki, Takashi Morino, Kouichi Yoshioka
  • Patent number: 8358836
    Abstract: A specific color detection circuit shows an RGB input pixel and an RGB color signal to be detected in a three-dimensional coordinate, calculates a first distance from an origin to a foot of a perpendicular drawn from the coordinate of the RGB input pixel to a straight line connecting the origin and the coordinate of the RGB color signal or a coordinate with the same RGB ratio as the signal and a second distance from the coordinate of the input pixel to the foot, and detects a hue of a signal of the input pixel. The circuit generates a detection region in a color-difference direction according to the first distance and the hue, calculates a third distance based on the first distance for the detection region and judges the input pixel as being in a predetermined color detection region when the third distance is longer than the second distance.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: January 22, 2013
    Assignee: Ikegami Tsushinki Co. Ltd.
    Inventors: Shinichi Maesato, Takeshi Iseki
  • Patent number: 8345404
    Abstract: A conductive layer mainly made of gold is formed on an upper surface of an insulating substrate. Plural electrodes facing each other via a gap is formed by forming the gap in the conductive layer. An overvoltage protective layer covering the gap and a portion of each of the plurality of electrodes is formed. This method can provide the gap with a narrow width precisely, and thereby, provide an electrostatic (ESD) protector with a low peak voltage, stable characteristics of suppressing electrostatic discharge, and a high resistance to sulfidation.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: January 1, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenji Nozoe, Takeshi Iseki, Takashi Morino, Hideaki Tokunaga
  • Publication number: 20120067765
    Abstract: It is a method for producing a food-filled and sealed container having a high product value, in which a container lid made of resin is not deformed after sealing. In this method for producing a food-filled and sealed container, after a food is filled in a container body (10) made of thermoplastic resin, the container is sealed by heat sealing a container lid (20) made of thermoplastic resin, and the container body (10) and/or the container lid (20) have sealing surfaces (13, 24) provided with a concavity or convexity.
    Type: Application
    Filed: May 11, 2010
    Publication date: March 22, 2012
    Applicants: Kabushiki Kaisha Yakult Honsha, Shikoku Kakoki Co., Ltd.
    Inventors: Takeshi Iseki, Masakatsu Kondo, Masao Kubo, Tomoyuki Masuda
  • Patent number: 7903385
    Abstract: The static-electricity control part of the present invention contains multiple pairs of backside electrodes (13) provided on both end portions (11b) of a long-edge-side at the backside of insulating substrate (11); multiple pairs of top electrodes (18) provided on both end portions (11c) of a long-edge-side at the top face of insulating substrate (11); top ground electrode (17) provided on the top face of insulating substrate (11) from its short-edge-side one end portion (11a) to other end portion (11b); overvoltage protection material layer (22) for filling gap (19) formed between any one of the multiple pair pairs of top electrodes (18) and top ground electrode (17); and backside wiring (14) provided on the backside of insulating substrate (11) so as to connect between the multiple pairs of backside electrodes (13).
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: March 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Kenji Nozoe, Takeshi Iseki, Takashi Morino, Kouichi Yoshioka, Hideaki Tokunaga
  • Publication number: 20100302400
    Abstract: A specific color detection circuit shows an RGB input pixel and an RGB color signal to be detected in a three-dimensional coordinate, calculates a first distance from an origin to a foot of a perpendicular drawn from the coordinate of the RGB input pixel to a straight line connecting the origin and the coordinate of the RGB color signal or a coordinate with the same RGB ratio as the signal and a second distance from the coordinate of the input pixel to the foot, and detects a hue of a signal of the input pixel. The circuit generates a detection region in a color-difference direction according to the first distance and the hue, calculates a third distance based on the first distance for the detection region and judges the input pixel as being in a predetermined color detection region when the third distance is longer than the second distance.
    Type: Application
    Filed: February 18, 2010
    Publication date: December 2, 2010
    Applicant: IKEGAMI TSUSHINKI CO., LTD.
    Inventors: Shinichi Maesato, Takeshi Iseki
  • Publication number: 20100188791
    Abstract: A conductive layer containing gold as a main component is formed on the upper surface of an insulating base. A gap is formed on the conductive layer. A plurality of leader electrodes are formed to oppose one another via the gap. An excess voltage protection material layer is formed to cover some parts of the respective leader electrodes and the gap, so as to obtain an anti-static part. This method enables an accurate formation of a narrow gasp. Thus, it is possible to manufacture an anti-static part having a low peak voltage, stable suppression characteristic of electrostatic discharge (ESD), and a high sulfide resistance.
    Type: Application
    Filed: October 19, 2007
    Publication date: July 29, 2010
    Inventors: Kenji Nozoe, Takeshi Iseki, Takashi Morino, Hideaki Tokunaga
  • Publication number: 20100134235
    Abstract: A pair of thick first electrodes (2) are formed on an upper surface of alumina substrate (1) are formed with material having a low specific resistance. Thin second electrodes (3) that are positioned between first electrodes (2) and made of material having a high melting point are formed in a thin state. A gap (4) is formed between the second electrodes (3). First electrodes (2) forming connection electrodes are prevented from producing heat and protected from damage. The width of the gap between second electrodes (3) is narrow and accurate. This provides an electrostatic discharge (ESD) protector that is resistant to repetitive application of static electricity, reduces a peak voltage, and has a stable characteristic suppressing electrostatic discharge.
    Type: Application
    Filed: June 19, 2008
    Publication date: June 3, 2010
    Applicant: Panasonic Corporation
    Inventors: Kouichi Yoshioka, Masakatsu Nawate, Takashi Morino, Kenji Nozoe, Takeshi Iseki
  • Publication number: 20100067163
    Abstract: The static-electricity control part of the present invention contains multiple pairs of backside electrodes (13) provided on both end portions (11b) of a long-edge-side at the backside of insulating substrate (11); multiple pairs of top electrodes (18) provided on both end portions (11c) of a long-edge-side at the top face of insulating substrate (11); top ground electrode (17) provided on the top face of insulating substrate (11) from its short-edge-side one end portion (11a) to other end portion (11b); overvoltage protection material layer (22) for filling gap (19) formed between any one of the multiple pair pairs of top electrodes (18) and top ground electrode (17); and backside wiring (14) provided on the backside of insulating substrate (11) so as to connect between the multiple pairs of backside electrodes (13).
    Type: Application
    Filed: December 4, 2007
    Publication date: March 18, 2010
    Inventors: Kenji Nozoe, Takeshi Iseki, Takashi Morino, Kouichi Yoshioka, Hideaki Tokunaga
  • Patent number: 7667569
    Abstract: A chip resistor includes: a pair of upper surface electrodes formed at opposing side portions of a rectangular substrate as opposed to each other with respect to a center line of the rectangular substrate extending in a direction connecting the side portions; a resistive element formed on the rectangular substrate to be electrically connected with the upper surface electrode pair; and a pair of end surface electrodes formed on end surfaces of the opposing side portions of the rectangular substrate and electrically connected with the upper surface electrode pair. The chip resistor further includes dummy electrodes formed individually at the opposing side portions of the rectangular substrate at positions corresponding to the upper surface electrode pair in the direction connecting the side portions.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: February 23, 2010
    Assignee: Panasonic Corporation
    Inventors: Takeshi Iseki, Shuji Ariga, Mitsuaki Nakao