Abstract: A chip resistor includes: a pair of upper surface electrodes formed at opposing side portions of a rectangular substrate as opposed to each other with respect to a center line of the rectangular substrate extending in a direction connecting the side portions; a resistive element formed on the rectangular substrate to be electrically connected with the upper surface electrode pair; and a pair of end surface electrodes formed on end surfaces of the opposing side portions of the rectangular substrate and electrically connected with the upper surface electrode pair. The chip resistor further includes dummy electrodes formed individually at the opposing side portions of the rectangular substrate at positions corresponding to the upper surface electrode pair in the direction connecting the side portions.

Abstract: An ultrasonic sealing apparatus is provided for transversely ultrasonically sealing a packing material comprised of a laminated body including at least a thermoplastic resin layer having a tubular form and containing a fluid. The apparatus includes a horn having an elongated and flat sealing face and an opposing jaw with an action face including a pressing portion for pressing the packing material in cooperation with the sealing face of the horn to a define at least one transverse sealing zone of the tubular packing material. At least one groove is disposed on the action face of the opposing jaw for forming a molten thermoplastic resin bulge in a vicinal area of the at least one sealing zone on a side in contact with the fluid in the tubular packing material.

Abstract: The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming portion. At least one of the rectangular sections is trimmed to adjust the resistance. According to the construction of the present invention, a compact resistor of superior surge property can be obtained.

Abstract: An ultrasonic sealing apparatus prevents a sealing failure by preventing a tunnel (through passage) to form in the step portions in the vicinity of both end portions of longitudinally sealed portions, when the tubular laminated packaging material is transversely ultrasonically sealed. An ultrasonic sealing apparatus, in which a laminated packaging material containing a thermoplastic resin layer and a paper layer is formed into a tubular form and the tubular laminated packaging material is transversely ultrasonic sealed, includes a horn having an elongated and flat sealing face and an opposing jaw having an elongated pressing face which presses the laminated packaging material in cooperation with the sealing face of the horn, wherein the center portion in longitudinal direction of the pressing face of the opposing jaw is narrower than both end portions of the pressing face. Further, at a center portion in longitudinal direction of a pressing face of the opposing jaw, a recess having an arc shape, etc.

Abstract: The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming portion. At least one of the rectangular sections is trimmed to adjust the resistance. According to the construction of the present invention, a compact resistor of superior surge property can be obtained.

Abstract: An ultrasonic sealing apparatus comprises at least one horn having an elongated sealing face for sealing a packing material. Plural converters are erected on a side of the horn opposite to the sealing face for resonating the horn with a vibrating frequency. The ultrasonic sealing apparatus has a length that is one wavelength of the vibrating frequency and is fixed in position to a sealing jaw at a nodal plane of the vibrating frequency.

Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Abstract: An ultrasonic sealing apparatus is provided for transversely ultrasonically sealing a packing material comprised of a laminated body including at least a thermoplastic resin layer having a tubular form and containing a fluid. The apparatus includes a horn having an elongated and flat sealing face and an opposing jaw with an action face including a pressing portion for pressing the packing material in cooperation with the sealing face of the horn to a define at least one transverse sealing zone of the tubular packing material. At least one groove is disposed on the action face of the opposing jaw for forming a molten thermoplastic resin bulge in a vicinal area of the at least one sealing zone on a side in contact with the fluid in the tubular packing material.

Abstract: An ultrasonic sealing apparatus is provided with an excellent sealability. The apparatus is capable of supplying sufficient output energy delivered by an ultrasonic wave-generating device to a thermoplastic resin of a packing material. A tubular packing material is evenly pressed on an appropriate timing in transverse sealing so that the thermoplastic resin is sufficiently softened/melted for an excellent sealing.

Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Abstract: The present invention is directed towards a resistor which has higher load-, surge-, and pulse-resistant characteristics and is capable of having a resistance adjusted at a higher rate of precision. A pair of electrodes 12 and a main resistance path 13 between the two electrodes 12 are mounted on a substrate 11. The main resistance path 13 is joined to a set of first rungs 14 which extend parallel to the main resistance path 13 and are joined with two first connecting paths 15 to form a first ladder-like resistance path for rough adjustment of the resistance which is connected to a part of the main resistance path 13. Also, a second ladder-like resistance path for fine adjustment of the resistance which comprises a set of second rungs 16 extending vertically from the main resistance path 13 and two second connecting paths 17 joining the second rungs 16 together is formed and connected to a part of the main resistance path 13.

Abstract: A device for preventing condensation of water vapor on a filling nozzle in the form of a vertical tube, included in a filling apparatus and positioned above a path of transport of containers comprises a downwardly open dry air chamber having the filling nozzle accommodated therein and permitting the container to be moved into and out of the chamber when the container is lifted by a lifter, an injection nozzle disposed as oriented downward above the path upstream from the dry air chamber for injecting dry air into the container to replace air therein, and a cover extending from a position downstream from the injection nozzle at least to the dry air chamber and covering the path from thereabove for preventing the dry air in the container from flowing out.

Abstract: The invention relates to glaze resistors which are used for electronic parts of hybrid integrated circuit devices, chip resistors, resistor network, etc. The glaze resistor comprises 4.0 to 70.0 wt % of a conductive component composed of a metal silicide and a metal boride and 30.0 to 96.0 wt % of glass in which a rate of said metal boride is 1.0 to 68.0 wt %. Thus, the glaze resistor can be formed by sintering in a non-oxidizing atmosphere and can provide a circuit, together with conductor pattern of base metals such as Cu.