Abstract: The present invention provides: a white turbid dispersion liquid of a chemical for rubber, containing the chemical for rubber at a concentration of 1% by mass or more; a method for producing the white turbid dispersion liquid of a chemical for rubber, containing mixing a solution containing a chemical for rubber dissolved in a good solvent for the chemical for rubber, with a poor solvent for the chemical for rubber; and a wet master batch containing a chemical for rubber, containing a liquid mixture containing the white turbid dispersion liquid of a chemical for rubber, and a rubber latex, or a rubber latex and a filler slurry, the liquid mixture being coagulated, and thus provides: the dispersion liquid of a chemical for rubber that is for making various chemicals for rubber be contained in a rubber wet master batch with good dispersibility; the method for producing the same; and the rubber master batch that provides a rubber composition enhanced in thermal aging resistance, reinforcing property, elastic mod

Abstract: Provided are a process for efficiently producing a rubber wet master batch in which a dispersibility of carbon black in the rubber is improved, in which a reinforcing property and an abrasion resistance of the rubber can be enhanced by using carbon black having a high surface activity, in which a yield of the carbon black in the wet master batch obtained is not reduced and in which a handling property of the carbon black is good as compared with master batches prepared by using a granulated and dried substance of carbon black prepared by a conventional wet method and non-granulated carbon black, a carbon black-containing rubber wet master batch obtained by the above process and a rubber composition and a tire prepared by using the master batch.

Abstract: A cordless pointing device used for moving a pointer displayed on a display screen and selecting information displayed on the display screen. The cordless pointing device includes an operation device having an optical reflection surface, a light emitting and receiving unit, which is a separate unit from the operation device, and emits a light to the optical reflection surface of the operation device and receives the light reflected on the optical reflection surface of the operation device, a switch for generating an instruction on information pointed by the pointer, and a control unit that moves the pointer according to a movement of the operation device detected by the light emitting and receiving unit when the light is received and detects the instruction given by the switch.

Abstract: A server system includes at least one server, a signal processing unit that enables to operate said at least one server with a set of console, and a chassis having slots and a circuit board, said at least one server or the signal processing unit being attachable and detachable to any of the slots, the circuit board having interconnection lines connecting the slots. Said at least one server and the signal processing unit being connected via an interface that allows plug and play connectivity. Thus, it is possible to construct the server system without external cables. In addition, when a server is newly added to or removed from the system or, it is no longer necessary to power of the other servers. This makes it possible to facilitate system construction and management.

Abstract: An operation body having a pointing function with respect to information includes a chassis having a reflection face, a circuit charging an inner second battery when receiving an electrical power from outside through a terminal exposed from the chassis, and a circuit transmitting switch information to outside cordlessly. On the other hand, an information-input device includes a chassis supporting a keyboard, and an optical system that transmits a light to an operation body operated on the chassis and receives a reflected light of the light. The chassis supporting the keyboard has a recess housing the operation body. The operation portion may be housed in the recess. The second battery is charged when the operation body is housed. And a light emitting of the optical system is stopped when the operation body is housed.

Abstract: A cordless pointing device used for moving a pointer displayed on a display screen and selecting information displayed on the display screen. The cordless pointing device includes an operation device having an optical reflection surface, a light emitting and receiving unit, which is a separate unit from the operation device, and emits a light to the optical reflection surface of the operation device and receives the light reflected on the optical reflection surface of the operation device, a switch for generating an instruction on information pointed by the pointer, and a control unit that moves the pointer according to a movement of the operation device detected by the light emitting and receiving unit when the light is received and detects the instruction given by the switch.

Abstract: A server system includes at least one server, a signal processing unit that enables to operate said at least one server with a set of console, and a chassis having slots and a circuit board, said at least one server or the signal processing unit being attachable and detachable to any of the slots, the circuit board having interconnection lines connecting the slots. Said at least one server and the signal processing unit being connected via an interface that allows plug and play connectivity. Thus, it is possible to construct the server system without external cables. In addition, when a server is newly added to or removed from the system or, it is no longer necessary to power of the other servers. This makes it possible to facilitate system construction and management.

Abstract: In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

Abstract: A weight piece (14) containing 15 wt. % or greater of iron and tungsten, and having a specific gravity of 9 or larger, larger than a material of a head body (10) made of steel or pure iron, is joined to the head body (10) by welding.

Abstract: In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

Abstract: In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

Abstract: In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.