Patents by Inventor Takeshi Kawabata

Takeshi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10909270
    Abstract: According to an embodiment, an information processing device switching between a secure mode and a non-secure mode to operate, includes one or more processors configured to perform: implementing a secure OS which operates in the secure mode; implementing a non-secure OS which operates in the non-secure mode; acquiring initialization process information autonomously in the secure mode, the initialization process information relating to an initialization process which the non-secure OS executes for a shared resource shared by the secure OS and the non-secure OS; and enabling, based on the initialization process information, the shared resource to be shared and used by the secure OS and the non-secure OS.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: February 2, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryuta Nara, Takeshi Kawabata
  • Publication number: 20200400424
    Abstract: It is an object of the present invention to provide a measuring apparatus capable of easily grasping a tracking state of a target and performing an efficient measurement. One aspect of the present invention is a measuring apparatus that emits a light beam toward a target, captures and tracks the target, and measures the three-dimensional coordinates of the target. The measuring apparatus comprises: a light source for emitting light beam; an angle control unit for controlling the emission angle of the light beam emitted from the light source so as to track the moving target; a display unit that provided on a device that is wearable by a measurer; a calculation unit for calculating the three-dimensional coordinates of the target based on the emission angle of the light beam and the light returning from the target; and a display control unit that controls information displayed on the display unit based on the three-dimensional coordinates calculated by the calculation unit.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 24, 2020
    Inventors: Kuniyuki Nuka, Motonori Ogihara, Takeshi Kawabata
  • Patent number: 10872174
    Abstract: According to an embodiment, an information processing device operates while switching between a secure mode and a non-secure mode. The information processing device includes processing circuitry. The processing circuitry is configured to function as a switching unit. The switching unit switches a mode from the secure mode to the non-secure mode at the time when the information processing device is operating in the secure mode.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: December 22, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryuta Nara, Takeshi Kawabata
  • Publication number: 20200393237
    Abstract: It is an object of the present invention to provide a measuring apparatus capable of easily restoring the tracking state when the tracking state of the target is interrupted. One aspect of the present invention is a measuring apparatus that emits a light beam toward a target, captures and tracks the target, and measures the three-dimensional coordinates of the target. The measuring apparatus includes: a light source for emitting light beam; an angle control unit for controlling the emission angle of the light beam emitted from the light source so as to track the moving target; an imaging unit for capturing the target or the vicinity of the target, and a recognition unit for recognizing the target or the specific portion including the target from an image captured by the imaging unit.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 17, 2020
    Inventors: Kuniyuki Nuka, Motonori Ogihara, Takeshi Kawabata, Kozaburo Suzuki
  • Patent number: 10847702
    Abstract: A semiconductor module includes: a semiconductor element; a wiring substrate on which the semiconductor element is mounted; a heat dissipation substrate; a first metal material that bonds the wiring substrate and the heat dissipation substrate; and a second metal material that bonds the wiring substrate and the heat dissipation substrate and has a different melting point from the first metal material. Each of the following is at least partially bonded: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, the second metal material and the wiring substrate, the second metal material and the heat dissipation substrate, and the first metal material and the second metal material. Each of the following is bonded by alloying: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, and the first metal material and the second metal material.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: November 24, 2020
    Assignee: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
    Inventors: Takeshi Kawabata, Kiyomi Hagihara, Takashi Yui, Naofumi Koga
  • Patent number: 10780679
    Abstract: Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: September 22, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Yu Iwai, Takeshi Kawabata, Akinori Shibuya
  • Publication number: 20200089113
    Abstract: A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Kenta YOSHIDA, Yu IWAI, Akinori SHIBUYA
  • Patent number: 10538627
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 21, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Publication number: 20200012820
    Abstract: According to an embodiment, an information processing device switching between a secure mode and a non-secure mode to operate, includes one or more processors configured to perform: implementing a secure OS which operates in the secure mode; implementing a non-secure OS which operates in the non-secure mode; acquiring initialization process information autonomously in the secure mode, the initialization process information relating to an initialization process which the non-secure OS executes for a shared resource shared by the secure OS and the non-secure OS; and enabling, based on the initialization process information, the shared resource to be shared and used by the secure OS and the non-secure OS.
    Type: Application
    Filed: February 26, 2019
    Publication date: January 9, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryuta Nara, Takeshi Kawabata
  • Patent number: 10526448
    Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: January 7, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Akinori Shibuya, Yu Iwai, Takeshi Kawabata, Ichiro Koyama
  • Publication number: 20190390947
    Abstract: A measuring apparatus and a measuring method capable of measuring a surface of an object includes a movable body having a mounting portion on which the object is mounted, and first and second surfaces not coplanar with each other, a first scale portion provided to press the first surface and to measure a first scale position along a first scale axis parallel to a normal direction of the first surface, a second scale portion provided to press the second surface and to measure a second scale position along a second scale axis parallel to a normal direction of the second surface, a first probe having a reference point of position measurement set on a probe axis parallel to the second direction and at an intersection of the first scale axis and the second scale axis, and a second probe measuring a position along the probe axis.
    Type: Application
    Filed: June 11, 2019
    Publication date: December 26, 2019
    Applicant: MITUTOYO CORPORATION
    Inventors: Takeshi KAWABATA, Kazuhiko HIDAKA
  • Patent number: 10501580
    Abstract: A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 10, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Takuma Amemiya, Hidekazu Oohashi, Yu Iwai, Akinori Shibuya
  • Publication number: 20190369496
    Abstract: Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 5, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Yu IWAI, Akinori SHIBUYA
  • Patent number: 10450417
    Abstract: Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: October 22, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Yu Iwai, Akinori Shibuya
  • Patent number: 10447487
    Abstract: According to an embodiment, a data generating device includes a first generator, an obtainer, a second generator, a verifier, and an operation selector. The first generator generates device-specific first data. The obtainer obtains second data from outside of the data generating device. The second generator generates third data based on the first data and the second data. The verifier verifies correctness of the third data. When the third data is determined to be incorrect, the operation selector selects at least one of regenerating the first data, re-obtaining the second data, and disabling the data generating device according to a predetermined selection rule.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: October 15, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Komano, Hideo Shimizu, Takeshi Kawabata
  • Patent number: 10437680
    Abstract: A relay apparatus according to an embodiment includes a request transmitting unit, a response receiving unit, and a data transmitting unit. The request transmitting unit transmits an acquisition request to a provision apparatus. The response receiving unit receives the second data from the provision apparatus in response to the acquisition request. The data transmitting unit transmits, to the electronic control unit, the second data received from the provision apparatus, thereby causing the electronic control unit to update the first data firstly stored therein with the second data. When the updating has failed, the data transmitting transmits the first data to the electronic control unit, thereby causing the electronic control unit to restore the first data.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: October 8, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshiyuki Kito, Takeshi Kawabata, Kentaro Umesawa
  • Publication number: 20190294827
    Abstract: According to an embodiment, an information processing device operates while switching between a secure mode and a non-secure mode. The information processing device includes processing circuitry. The processing circuitry is configured to function as a switching unit. The switching unit switches a mode from the secure mode to the non-secure mode at the time when the information processing device is operating in the secure mode.
    Type: Application
    Filed: August 30, 2018
    Publication date: September 26, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryuta NARA, Takeshi KAWABATA
  • Patent number: 10360018
    Abstract: According to an embodiment, an update control apparatus is to control update of software in a terminal connected to a network. The update control apparatus includes a first communication circuit, a second communication circuit, and a processor. The first communication circuit is configured to communicate with a server located outside the network. The second communication circuit is configured to communicate with the terminal through the network. The processor is configured to: receive update data to update the software from the server using the first communication circuit; transmit the update data to the terminal, as well as receive an update result indicating whether update of the software has succeeded, together with verification data, from the terminal using the second communication circuit; and verify, using the verification data, whether the update result is proper data.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: July 23, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Komano, Zhengfan Xia, Takeshi Kawabata
  • Publication number: 20190221503
    Abstract: A semiconductor device that is a surface mount-type device includes a nitride semiconductor chip including a silicon substrate having a first thermal expansion coefficient and an InxGayAl1-x-yN layer in contact with a surface of the silicon substrate, where 0?x?1, 0?y?1, 0?x+y?1; and a die pad including Cu and having a second thermal expansion coefficient that is greater than the first thermal expansion coefficient. A thickness of the nitride semiconductor chip is at least 0.2 mm, length L of the nitride semiconductor chip is at least 3.12 mm, and thickness tm of the die pad and length L of the nitride semiconductor chip satisfy tm?2.00×10?3×L2+0.173, tm being a thickness in mm and L being a length in mm.
    Type: Application
    Filed: March 25, 2019
    Publication date: July 18, 2019
    Inventors: Hidekazu NAKAMURA, Manabu YANAGIHARA, Tomohiko NAKAMURA, Yusuke KATAGIRI, Katsumi OTANI, Takeshi KAWABATA
  • Publication number: 20190189881
    Abstract: A semiconductor module includes: a semiconductor element; a wiring substrate on which the semiconductor element is mounted; a heat dissipation substrate; a first metal material that bonds the wiring substrate and the heat dissipation substrate; and a second metal material that bonds the wiring substrate and the heat dissipation substrate and has a different melting point from the first metal material. Each of the following is at least partially bonded: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, the second metal material and the wiring substrate, the second metal material and the heat dissipation substrate, and the first metal material and the second metal material. Each of the following is bonded by alloying: the first metal material and the wiring substrate, the first metal material and the heat dissipation substrate, and the first metal material and the second metal material.
    Type: Application
    Filed: February 26, 2019
    Publication date: June 20, 2019
    Inventors: Takeshi KAWABATA, Kiyomi HAGIHARA, Takashi YUI, Naofumi KOGA