Abstract: According to an embodiment, a computer program product includes a computer-readable medium including program, when executed by a computer, to have a plurality of modules run by the computer. The computer includes a memory having a shared area, which is an area accessible to only those modules which run cooperatively and storing therein execution module identifiers. Each of the modules includes a first operation configured to store, just prior to a switchover of operations to an other module that runs cooperatively, an identifier of the other module as the execution module identifier in the shared area; and a second operation configured to execute, when the execution module identifier stored in the shared area matches with an identifier of own module immediately after a switchover of operations from the other module, a function inside the own module.

Abstract: A semiconductor device includes an extended semiconductor chip including a first semiconductor chip and an extension outwardly extending from a side surface of the first semiconductor chip; and a second semiconductor chip connected to the extended semiconductor chip through a plurality of bumps and electrically connected to the first semiconductor chip. The first semiconductor chip is smaller than the second semiconductor chip. At least one external terminal is provided on the extension.

Abstract: A semiconductor device includes: a first semiconductor chip held on a substrate and including an expanded portion expanding outward from a side surface of a body of the first semiconductor chip; a first wire connecting the expanded portion of the first semiconductor chip to the substrate; and a second wire connecting the body of the first semiconductor chip to the substrate.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition.

Abstract: A semiconductor module having a second semiconductor package 200 mounted on a first semiconductor package 100, wherein the first semiconductor package 100 includes: pads 15 formed on the top surface of the first semiconductor package 100; external connection terminals 2 formed on the underside of the first semiconductor package 100, and vias 18 electrically connecting the pads 15 and the connection terminals 2. In a radiographic plane viewed in a vertical direction relative to one surface of a second substrate 25 of the second semiconductor package 200, the via 18 overlaps one of the pad 15 and the connection terminal 2, the pad 15 and the connection terminal 2 overlap each other, and the pad 15 has the center position outside the connection terminal 2.

Abstract: According to one embodiment, an encryption device includes a storage unit, an input unit, first to fourth partial encryption units, a generation unit, and an output unit. The first partial encryption unit calculates first intermediate data from input plain data to store in the storage unit. The generation unit generates a round key, which is used in calculations for the first intermediate data and N-th intermediate data, from the secret key. The second partial encryption unit calculates (i+1)th intermediate data from i-th intermediate data (i is smaller than N) and the round key to store in the storage unit. The third partial encryption unit performs an arithmetic operation including predetermined conversion for mixing the N-th intermediate data, and calculates (N+1)th intermediate data to store in the storage unit. The fourth partial encryption unit obtains encrypted data by performing an arithmetic operation including inverse conversion of the conversion on the (N+1)th intermediate data.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) comprising any of repeating units (A) of general formula (I) below, each of which contains an ionic structural moiety that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid in a side chain of the resin.

Abstract: According to one embodiment, in a key scheduling device, a non-linear transformation unit non-linearly transforms at least one of partial keys resulting from dividing an expanded key. A first linear transformation unit includes first and second circuits. The second circuit linearly transforms the partial key by directly using a transformation result from the non-linear transformation unit. A first storage stores the partial key linearly transformed by the first linear transformation unit. A second linear transformation unit linearly transforms, inversely to the first linear transformation unit, each of partial keys other than the partial key linearly transformed by the second circuit out of the partial keys stored in the first storage, and outputs inversely transformed partial keys. A second storage stores one of inputs to the second circuit. An outputting unit connects the respective inversely transformed partial keys and the input stored in the second storage to be output as a second key.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes an arylsulfonium salt that when exposed to actinic rays or radiation, generates an acid, the arylsulfonium salt containing at least one aryl ring on which there are a total of one or more electron donating groups, the acid generated upon exposure to actinic rays or radiation having a volume of 240 ?3 or greater.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below, in which W1 represents an optionally substituted alkylene group, W2 represents a bivalent connecting group, W3 represents an optionally substituted organic group having 15 or more carbon atoms, and Z represents a hydroxyl group or a fluoroalkylsulfonamido group having at least one fluorine atom introduced therein as a substituent.

Abstract: A first storage unit stores a plurality of security functions each defining a first protection attribute requiring a storage of a value of an argument for input/output of data. A second storage unit stores a program list describing a second protection attribute of a variable indicating a storage area of the data and an executing procedure of a predetermined process. An identifying unit identifies a third protection attribute of an actual argument for input/output of a security function based on the second protection attribute. When a judging unit judges not all of third protection attributes match with first protection attributes, an output unit outputs error information indicating a mismatch of the protection attributes.

Abstract: According to an embodiment, a cryptographic device includes a first operation unit that receives a shared key and generates plural expanded keys; and a second operation unit that receives plaintext or ciphertext and performs at least one of encryption and decryption using the expanded keys. First data pieces are obtained by dividing the plaintext into predetermined units of words or obtained by dividing the ciphertext into predetermined units of words. The second operation unit includes a data array determination unit that determines, at a time of encryption, an array order of the first data pieces included in the plaintext as a first order, and determines, at a time of decryption, an array order of the first data pieces included in the ciphertext as a second order; and a main data computation unit that performs, on the first data pieces, computation of at least one of encryption and decryption in the determined order.

Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below.

Abstract: When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light-emitting element 2 to emit light, the optical properties of the semiconductor light-emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light-emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M11 represents a single bond or a divalent linking group; Q11 represents an alkyl group, a cycloalkyl group, or an aryl group).

Abstract: A semiconductor device includes: on an upper surface of a second semiconductor chip on a circuit board, a ring dam section formed at an outer circumference of a mounting region above which a first semiconductor chip is mounted; and an interconnect extending from the dam section to a center section of the first semiconductor chip or the second semiconductor chip in a region in which the first semiconductor chip faces the second semiconductor chip. The interconnect is electrically connected to a connection terminal on a circuit formation surface of the first or second semiconductor chip at the center section of the first or second semiconductor chip. The dam section and the interconnect are power supply interconnects or ground interconnects.

Abstract: A lamination structure includes a first semiconductor chip and a second semiconductor chip stacked via a bonding section so that a rear surface of the first semiconductor chip faces the main surface of the second semiconductor chip. At least a part of a side surface of the first semiconductor chip are covered with a first resin, a distribution layer is formed on the plane formed of the main surface of the first semiconductor chip and a surface of the first resin. At least part of electrodes existing in the main surface of the second semiconductor chip is electrically connected to at least part of first external electrodes formed on the distribution layer via the penetration electrodes that penetrate the first semiconductor chip.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive composition comprising (P) a compound having a phenolic hydroxyl group and a group formed by substituting for the hydrogen atom in a phenolic hydroxyl group by a group represented by the specific formula, a resist film formed using the specific actinic ray-sensitive or radiation-sensitive composition, a pattern forming method containing steps of exposing and developing the resist film, a manufacturing method of an electronic device, containing the pattern forming method, and an electronic device manufactured by the specific manufacturing method of an electronic device.