Patents by Inventor Takeshi Kawanishi
Takeshi Kawanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8541691Abstract: A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.Type: GrantFiled: November 23, 2010Date of Patent: September 24, 2013Assignee: IBIDEN Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 8507806Abstract: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.Type: GrantFiled: June 19, 2009Date of Patent: August 13, 2013Assignee: IBIDEN Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 8409461Abstract: The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component.Type: GrantFiled: December 5, 2006Date of Patent: April 2, 2013Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20120052528Abstract: An object to be solved by the present invention is to provide a method for producing a selective medium that allows a target microorganism to predominantly proliferate in the simultaneous presence of many different microorganisms according to specific criteria. The object is solved by a method for producing a selective medium for a microorganism, which comprises the steps of: selecting at least one carbon source assimilable by a microorganism and/or at least one antibiotic to which the microorganism has resistance based on biological information about the microorganism; and mixing the selected carbon source and/or antibiotic with basic medium components.Type: ApplicationFiled: February 25, 2010Publication date: March 1, 2012Applicant: THE UNIVERSITY OF TOKYOInventors: Shigetou Namba, Hiroshi Hamamoto, Takeshi Kawanishi
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Patent number: 8008583Abstract: This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.Type: GrantFiled: December 8, 2008Date of Patent: August 30, 2011Assignee: IBIDEN Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7994432Abstract: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers.Type: GrantFiled: June 19, 2009Date of Patent: August 9, 2011Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20110063806Abstract: A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.Type: ApplicationFiled: November 23, 2010Publication date: March 17, 2011Applicant: IBIDEN CO., LTD.Inventors: Takashi KARIYA, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7891089Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: GrantFiled: October 20, 2008Date of Patent: February 22, 2011Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7773388Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.Type: GrantFiled: December 5, 2006Date of Patent: August 10, 2010Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7731504Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: GrantFiled: October 20, 2008Date of Patent: June 8, 2010Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20090260857Abstract: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.Type: ApplicationFiled: June 19, 2009Publication date: October 22, 2009Applicant: IBIDEN CO., LTD.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20090255716Abstract: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers.Type: ApplicationFiled: June 19, 2009Publication date: October 15, 2009Applicant: IBIDEN CO., LTD.Inventors: Takashi KARIYA, Toshiki FURUTANI, Takeshi KAWANISHI
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Publication number: 20090084594Abstract: This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.Type: ApplicationFiled: December 8, 2008Publication date: April 2, 2009Applicant: IBIDEN CO., LTD.Inventors: Takashi KARIYA, Toshiki FURUTANI, Takeshi KAWANISHI
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Patent number: 7497694Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: GrantFiled: December 5, 2006Date of Patent: March 3, 2009Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20090053911Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: ApplicationFiled: October 20, 2008Publication date: February 26, 2009Applicant: IBIDEN CO., LTDInventors: Takashi KARIYA, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20090053910Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: ApplicationFiled: October 20, 2008Publication date: February 26, 2009Applicant: IBIDEN CO., LTDInventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Patent number: 7462784Abstract: This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.Type: GrantFiled: May 2, 2006Date of Patent: December 9, 2008Assignee: IBIDEN Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20070256858Abstract: This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.Type: ApplicationFiled: May 2, 2006Publication date: November 8, 2007Applicant: IBIDEN CO., LTD.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20070256297Abstract: The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component A method of manufacturing a printed wiring board (1) with a component mounting pin (18) at a stage to form a component mounting surface after layers of a predetermined number were formed includes the steps of forming a conductive land (11) on the component mounting surface, covering the component mounting surface with an insulating layer (12) except the conductive land (11) of the component mounting surface, partly forming near the conductive land (11) of the upper surface of the insulating layer (12) a sacrificial layer (14) which can be removed in the subsequent process, forming conductive layers (16, 17) on the upper surfaces of the conductive land (11) and the sacrificial layer (14) with a plating process to pattern the conductive layers (16, 17), forming the component mounting pin (18) elongated from the conductive land (11) by paType: ApplicationFiled: December 5, 2006Publication date: November 8, 2007Applicant: IBIDEN CO., LTD.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi
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Publication number: 20070190819Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).Type: ApplicationFiled: December 5, 2006Publication date: August 16, 2007Applicant: IBIDEN CO., LTD.Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi