Patents by Inventor Takeshi Kawanishi

Takeshi Kawanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070187140
    Abstract: The present invention is to provide a printed wiring board in which malconnection or disconnection caused by a difference between coefficients of thermal expansion of a semiconductor chip and a printed wiring board can be decreased even when a highly-integrated semiconductor apparatus is mounted thereon and an electronic device using the same. An electronic device (4) according to the present invention includes a printed wiring board (1) with a component mounting pin (18) and a surface-mounting type semiconductor apparatus (2) with an electrode pad (3), wherein the component mounting pin (18) has elasticity and is urged against the electrode pad (3) to maintain electric connection.
    Type: Application
    Filed: December 5, 2006
    Publication date: August 16, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Takashi Kariya, Toshiki Furutani, Takeshi Kawanishi