Abstract: A data processor according to the present invention executes instructions described in first and second instruction formats. The first instruction format defines a register-addressing field of a predetermined size, while the second instruction format defines a register-addressing field of a size larger than that of the register-addressing field defined by the first instruction format. The data processor includes: instruction-type identifier, responsive to an instruction, for identifying the received instruction as being described in the first or second instruction format by the instruction itself; a first register file including a plurality of registers; and a second register file also including a plurality of registers, the number of the registers included in the second register file being larger than that of the registers included in the first register file.

Abstract: There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circuiting, propagation of power supply or GND noise due to reduction in IO cell interval, and signal transmission delay difference due to displacement of pad positions. In a semiconductor device wherein plural pads on a semiconductor element which are connected to function terminals on an external package are arranged in two lines along the periphery of the semiconductor element, an arrangement order of the plural pads on the semiconductor element is made different from an arrangement order of the function terminals on the external package.

Abstract: A semiconductor device having in a deep hole formed in a first interlayer insulating film a memory cell region that comprises a plurality of capacitors having a lower electrode 229 composed of a crown structure having an outside face and inner face, a first upper electrode 231 facing the outside face of the lower electrode, and a dielectric and a second upper electrode extending from the inner face of the lower electrode to the surface of a first interlayer insulating film other than the deep hole; wherein the first upper electrode is connected to the second upper electrode by connecting a first upper electrode 227 formed on the inner wall of the deep hole to the wiring 241a via a conductor film 224 and a conductor plug 236a, and connecting a second upper electrode 231 to be a plate to a wiring 241a via a conductor plug 239a.

Abstract: A data processor according to the present invention executes instructions described in first and second instruction formats. The first instruction format defines a register-addressing field of a predetermined size, while the second instruction format defines a register-addressing field of a size larger than that of the register-addressing field defined by the first instruction format. The data processor includes: instruction-type identifier, responsive to an instruction, for identifying the received instruction as being described in the first or second instruction format by the instruction itself; a first register file including a plurality of registers; and a second register file also including a plurality of registers, the number of the registers included in the second register file being larger than that of the registers included in the first register file.

Abstract: A data processor according to the present invention executes instructions described in first and second instruction formats. The first instruction format defines a register-addressing field of a predetermined size, while the second instruction format defines a register-addressing field of a size larger than that of the register-addressing field defined by the first instruction format. The data processor includes: instruction-type identifier, responsive to an instruction, for identifying the received instruction as being described in the first or second instruction format by the instruction itself; a first register file including a plurality of registers; and a second register file also including a plurality of registers, the number of the registers included in the second register file being larger than that of the registers included in the first register file.

Abstract: A moving object detection device accurately detects moving objects. The device includes a motion vector calculation section calculating motion vectors from an input image; a motion vector removal section removing a motion vector having high randomness from the calculated motion vectors; a motion vector accumulation section temporally accumulating each motion vector not removed by the motion vector removal section, and calculating an accumulated number of occurrences and an accumulated value of each motion vector; and a moving object detection section determining, based on the calculated accumulated value and calculated accumulated number of occurrences of each motion vector, whether each motion vector corresponds to a moving object.

Abstract: An information processing apparatus is characterized in that firmware is easily replaced in the case where a booting operating system is changed for another to improve the operational efficiency associated with the changing of the operating system; plural pieces of firmware, each of which is compatible with each of plural operating systems of different kinds, types or versions, are stored in a storage unit and each piece of firmware is provided with compatible information indicating which of the operating systems each pieces of firmware conforms to; and the type or version of operating system to boot is determined when booting the operating system, and firmware compatible with compatible information is selected from the storage unit for replacement on the basis on a determination result.

Abstract: On a silicon oxide film including the interior of an opening a semispherical RGP film is deposited. At a temperature lower than that allowing a crystal of silicon to be grown a BPTEOS film is deposited to fill the opening. Then a portion other than the semispherical RGP film introduced in the opening is chemically mechanically polished and thus removed. This contributes to reduced crystal growth of silicon at the semispherical RGP film and hence reduced scattering and/or removal of the RGP film for example when a CMP step is performed. Subsequently the semispherical RGP film is annealed to grow a crystal of silicon to form a generally spherical RGP film. Thus a storage node can have an increased surface area and a capacitor can have increased capacity.

Abstract: On a silicon oxide film including the interior of an opening a semispherical RGP film is deposited. At a temperature lower than that allowing a crystal of silicon to be grown a BPTEOS film is deposited to fill the opening. Then a portion other than the semispherical RGP film introduced in the opening is chemically mechanically polished and thus removed. This contributes to reduced crystal growth of silicon at the semispherical RGP film and hence reduced scattering and/or removal of the RGP film for example when a CMP step is performed. Subsequently the semispherical RGP film is annealed to grow a crystal of silicon to form a generally spherical RGP film. Thus a storage node can have an increased surface area and a capacitor can have increased capacity.

Abstract: In a semiconductor device, an active region is formed in a semiconductor substrate separated by a plurality of isolation regions. A plurality of surface insulating films of different thickness are formed separately on the active region. A plurality of conductive films are formed on the respective insulating films. Then, one of the surface insulating film having smaller thickness is caused to break down to work as an electric fuse.

Abstract: A photolithography step is carried out for exposing/etching a resist film in an etching step. Thereafter a superposition inspection step employing a superposed layer superposition mark and a resist film superposition mark is carried out with a superposition inspection apparatus. In this step, an applied mask confirmation step is simultaneously carried out with the superposition inspection apparatus. Thus, it is possible to provide a method of fabricating a semiconductor device including a superposition inspection step, capable of efficiently confirming an applied mask and improving the fabrication yield for the semiconductor device.

Abstract: There is described a semiconductor device having a storage node capacitor structure suitable for rendering memory cells compact, and storage nodes are prevented from tilting. The device includes a storage node which has a vertical surface extending in the direction perpendicular to the surface of a semiconductor substrate, and a dielectric film for tilt prevention purposes which is brought into close contact with the side surface of the vertical surface and which prevents the vertical surface from tilting.

Abstract: A photolithography step is carried out for exposing/etching a resist film in an etching step. Thereafter a superposition inspection step employing a superposed layer superposition mark and a resist film superposition mark is carried out with a superposition inspection apparatus. In this step, an applied mask confirmation step is simultaneously carried out with the superposition inspection apparatus. Thus, it is possible to provide a method of fabricating a semiconductor device including a superposition inspection step, capable of efficiently confirming an applied mask and improving the fabrication yield for the semiconductor device.

Abstract: A semiconductor device having a test mark comprising: a semiconductor substrate; a first TEOS layer formed on the semiconductor substrate; a second TEOS layer formed on the first TEOS layer and having a fluidity lower than that of the first TEOS layer at an elevated temperature; a recess formed in the first and second TEOS layers and exposing the surface of the semiconductor substrate, wherein the horizontal cross section of the recess is substantially rectangular in configuration; and a metal layer formed between the first and second TEOS layers and opposing to the corner of the recess.

Abstract: There is described a semiconductor device having a storage node capacitor structure suitable for rendering memory cells compact, and storage nodes are prevented from tilting. The device includes a storage node which has a vertical surface extending in the direction perpendicular to the surface of a semiconductor substrate, and a dielectric film for tilt prevention purposes which is brought into close contact with the side surface of the vertical surface and which prevents the vertical surface from tilting.

Abstract: A data processor according to the present invention executes instructions described in first and second instruction formats. The first instruction format defines a register-addressing field of a predetermined size, while the second instruction format defines a register-addressing field of a size larger than that of the register-addressing field defined by the first instruction format. The data processor includes: instruction-type identifier, responsive to an instruction, for identifying the received instruction as being described in the first or second instruction format by the instruction itself; a first register file including a plurality of registers; and a second register file also including a plurality of registers, the number of the registers included in the second register file being larger than that of the registers included in the first register file.

Abstract: A data processor according to the present invention executes instructions described in first and second instruction formats. The first instruction format defines a register-addressing field of a predetermined size, while the second instruction format defines a register-addressing field of a size larger than that of the register-addressing field defined by the first instruction format. The data processor includes: instruction-type identifier, responsive to an instruction, for identifying the received instruction as being described in the first or second instruction format by the instruction itself; a first register file including a plurality of registers; and a second register file also including a plurality of registers, the number of the registers included in the second register file being larger than that of the registers included in the first register file.

Abstract: In order to provide a method of fabricating a high melting point metal wiring layer improved to be capable of forming a thin line without employing a mask, a gate oxide film is formed on a semiconductor substrate. A silicon layer is formed on the gate oxide film. A high melting point metal layer is formed on the silicon layer. A mixed layer of the silicon layer and the high melting point metal layer is formed on a portion for defining a wiring layer. Remaining parts of the silicon layer and the high melting point metal layer other than those forming the mixed layer are removed by etching thereby forming a wiring layer. The wiring layer is heat-treated.

Abstract: A semiconductor device with a high reliability is provided. The semiconductor device includes a silicon substrate, titanium nitride films and an interlayer insulating film. A first opening is formed in the titanium nitride film. A second opening having a diameter different from that of the first opening is formed in the second titanium nitride film. A contact hole is formed in the interlayer insulating film. A titanium film, a titanium nitride film, a plug layer and an interconnect layer are formed so as to be electrically connected to the titanium nitride films through the first and second openings.

Abstract: This invention relates to a video signal processing circuit for easily simultaneously performing conversion of the number of lines and format conversion with a simple construction and an image pickup apparatus such as CCD using the circuit. A signal in a 4:2:2 format is supplied to a linear interpolating unit. Input luminance signals and input color difference signals of one line are written into line memories and the input luminance signals and the input color difference signals of the next one line are written into other memories. Similarly, signals are alternately written. The input luminance signal is read twice from the above memories in a period of writing signals of one line. The obtained signals are multiplied by coefficients for linear interpolation, respectively, and the resultant signals are added, thereby generating a luminance signal to be outputted.