Abstract: The present invention provides a compound which enhances the production of erythropoietin. The present invention provides a compound represented by formula (1): [wherein, R1: formula (1A): [wherein, R4 and R5: H, halogen, or alkyl; R6: H, halogen, alkyl, or the like; R7: substitutable hydroxyalkyl, substitutable hydroxyhalo alkyl, substitutable alkoxyalkyl, or the like; substituent group ?: oxo, hydroxy, amino, or the like; ring Q1: a monocyclic heterocyclic group; ring Q2: a monocyclic hydrocarbon ring group, or a monocyclic heterocyclic group; ring Q3: a monocyclic hydrocarbon ring group, or a monocyclic heterocyclic group; X: a single bond, methylene, ethylene, or the like]; R2: alkyl, or methylsulfanyl; and R3: H, or methyl], or the like.

Abstract: The present invention provides a compound which enhances the production of erythropoietin. The present invention provides a compound represented by formula (1): [wherein, R1: formula (1A): [wherein, R4 and R5: H, halogen, or alkyl; R6: H, halogen, alkyl, or the like; R7: substitutable hydroxyalkyl, substitutable hydroxyhalo alkyl, substitutable alkoxyalkyl, or the like; substituent group ?: oxo, hydroxy, amino, or the like; ring Q1: a monocyclic heterocyclic group; ring Q2: a monocyclic hydrocarbon ring group, or a monocyclic heterocyclic group; ring Q3: a monocyclic hydrocarbon ring group, or a monocyclic heterocyclic group; X: a single bond, methylene, ethylene, or the like]; R2: alkyl, or methylsulfanyl; and R3: H, or methyl], or the like.

Abstract: The present invention provides compounds which promote erythropoietin production.

Abstract: An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step of executing the selected processing procedure.

Abstract: An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step (S22 to S26, S30, S34 to S38, S42 to S46) of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step (S28, S32, S40, S48, S50, S52) of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step (S28, S32, S40, S48, S50, S52) of executing the selected processing procedure.

Abstract: Provided is a maintenance method which makes it possible to collectively and quantitatively detect maintenance timings of parts included in respective devices in a component mounter. A management apparatus determines a position of an equipped device using a RF-tag reader/writer (S1001). Then, from the RF tag, the RF-tag reader/writer obtains maintenance information regarding parts in the device (S1002). Then, the determination unit determines a maintenance timing of each of the parts, by comparing maintenance information recorded in a maintenance reference information storage unit to the maintenance information of each part which has been obtained at S1002 (S1003). Next, if it is not yet the maintenance timing (NO at S1003), then the determination unit (608) ends the determining processing. On the other hand, if it is the maintenance timing (YES at S1003), then the determination unit (608) instructs a warning unit to provide warning (S1004) and stops driving of the component mounter.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: A transfer rack 15 loaded with a seriate number of component supply cassettes 14 to be handled collectively is carried and retained on a truck 61 so that it can be taken in and out of the truck 61. The transfer rack 15 is passed between the truck 61 and a component supply section 8. Thus, the withdrawal of the transfer rack 15 from the component supply section 8 to the truck 61 and the delivery of the transfer rack 15 to the component supply section 8 are executed in a timely manner so as to change the component supply cassettes 14 at the component supply section 8. The transfer rack 15 delivered to the component supply section 8 is positioned by operating an automatic positioning means at the component supply section 8 in a direction in which it is loaded and unloaded and in a direction perpendicular to the direction in which it is loaded and unloaded.

Abstract: Image data of various kinds of components and component text data required for mounting of components, e.g., shapes, dimensions, packing forms, colors, and the like of the components, are stored in a storage medium in a manner to be read out as part of a component electronic catalog. The storage medium is used to make a search for components on a screen and automatically read out necessary component text data. The component electronic catalog can be used not only to search for components on a screen, similar to a conventional component electronic catalog, but to automatically read out component text data so as to automatically form mounting data for components to be mounted which are selected through the screen search.

Abstract: There are provided a method and apparatus of component mounting capable of avoiding damage caused by production operations with a component holder having debris thereon. If it is determined during a detecting step of a component holding condition that a component is held by a component holder in an improper condition for mounting, the component holder releases such a component into a collecting box, and skips a pick up operation at a next round of a pick up station. The component holder is then subjected to confirming whether any debris exists by using, preferably, a condition sensor, and the component holder picks up a new component if it is confirmed that no debris exists. If debris is found during the confirming step, production operations are stopped, or a warning is generated. After maintenance of the component holder is completed, production operations are restarted.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Abstract: An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Abstract: A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Abstract: A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

Abstract: A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.