Patents by Inventor Takeshi Kurita

Takeshi Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210083058
    Abstract: Provided is a method of producing an epitaxial silicon wafer having high gettering capability resulting in even more reduced white spot defects in a back-illuminated solid-state imaging device. The method includes: a first step of irradiating a surface of a silicon wafer with cluster ions of CnHm (n=1 or 2, m=1, 2, 3, 4, or 5) generated using a Bernas ion source or an IHC ion source, thereby forming, in the silicon wafer, a modifying layer containing, as a solid solution, carbon and hydrogen that are constituent elements of the cluster ions; and a subsequent second step of forming a silicon epitaxial layer on the surface. In the first step, peaks of concentration profiles of carbon and hydrogen in the depth direction of the modifying layer are made to lie in a range of more than 150 nm and 2000 nm or less from the surface.
    Type: Application
    Filed: August 24, 2018
    Publication date: March 18, 2021
    Applicant: SUMCO CORPORATION
    Inventors: Takeshi KADONO, Kazunari KURITA
  • Patent number: 10835212
    Abstract: According to one embodiment, an ultrasonic diagnostic apparatus includes a transmission/reception circuit and processing circuitry. The transmission/reception circuit performs a first scan and a second scan, which are different in acoustic field in an elevation direction, by controlling at least one of transducers arranged along an azimuth direction and the elevation direction. The processing circuitry generates a first needle-enhanced image by using data acquired in the first scan, and generates a second needle-enhanced image by using data acquired in the second scan.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: November 17, 2020
    Assignee: Canon Medical Systems Corporation
    Inventors: Fumio Mochizuki, Koichiro Kurita, Takeshi Fukasawa, Satoshi Matsunaga, Koji Kuroiwa, Shogo Fukuda
  • Patent number: 10704625
    Abstract: A brake disc for a railway vehicle is provided in which noise arising from the brake disc during high-speed rotation of a wheel is reduced by a large margin. A brake disc for a railway vehicle includes: a disc plate portion that has a sliding portion on a front face thereof; a plurality of through-holes that pass from the front face to a rear face of the disc plate portion and are arranged in alignment in the circumferential direction of the disc plate portion, the through-holes allowing bolts to pass therethrough for fastening together the disc plate portion and a wheel of the railway vehicle; and a groove provided to link a plurality of through-holes on the front face side of the disc plate portion.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: July 7, 2020
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Nobuo Shiraishi, Yusuke Wakabayashi, Takeshi Kurita, Takahiro Fujimoto, Hiroshi Nogami, Atsushi Sakaguchi, Takanori Kato, Yuki Ichikawa
  • Publication number: 20200203418
    Abstract: Provided is a semiconductor epitaxial wafer having metal contamination reduced by achieving higher gettering capability, a method of producing the semiconductor epitaxial wafer, and a method of producing a solid-state image sensing device using the semiconductor epitaxial wafer. The method of producing a semiconductor epitaxial wafer 100 includes a first step of irradiating a semiconductor wafer 10 containing at least one of carbon and nitrogen with cluster ions 16 thereby forming a modifying layer 18 formed from a constituent element of the cluster ions 16 contained as a solid solution, in a surface portion of the semiconductor wafer 10; and a second step of forming a first epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer 10.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 25, 2020
    Applicant: SUMCO Corporation
    Inventors: Takeshi Kadono, Kazunari Kurita
  • Publication number: 20200180075
    Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 11, 2020
    Applicants: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Mikiharu KUCHIKI, Hidefumi KINDA, Daisuke KURITA, Takeshi SAKAMOTO, Takafumi OGIWARA, Yuta KONDOH, Naoki UCHIYAMA
  • Publication number: 20200127043
    Abstract: The present invention provides a method of producing a semiconductor epitaxial wafer, which can suppress metal contamination by achieving higher gettering capability. The method of producing a semiconductor epitaxial wafer includes a first step of irradiating a surface portion 10A of a semiconductor wafer 10 with cluster ions 16 thereby forming a modifying layer 18 formed from carbon and a dopant element contained as a solid solution that are constituent elements of the cluster ions 16, in the surface portion 10A of the semiconductor wafer; and a second step of forming an epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer, the epitaxial layer 20 having a dopant element concentration lower than the peak concentration of the dopant element in the modifying layer 18.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Applicant: SUMCO Corporation
    Inventors: Takeshi Kadono, Kazunari Kurita
  • Publication number: 20200127044
    Abstract: An object is to provide a method of producing a semiconductor epitaxial wafer having higher gettering capability and a reduced haze level of the surface of a semiconductor epitaxial layer. The method of producing a semiconductor epitaxial wafer, according to the present invention includes: a first step of irradiating a semiconductor wafer 10 with cluster ions 16 thereby forming a modifying layer 18 formed from a constituent element of the cluster ions 16 contained as a solid solution, in a surface portion 10A of the semiconductor wafer; a second step of performing heat treatment for crystallinity recovery on the semiconductor wafer 10 after the first step such that the haze level of the semiconductor wafer surface portion 10A is 0.20 ppm or less; and a third step of forming an epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer after the second step.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Applicant: SUMCO Corporation
    Inventors: Takeshi Kadono, Kazunari Kurita
  • Patent number: 10453682
    Abstract: Provided is an epitaxial wafer having an excellent gettering capability and a suppressed formation of epitaxial defects. The epitaxial wafer has a specified resistivity, and includes a modifying layer formed on a surface portion of the silicon wafer and composed of a predetermined element including at least carbon, in the form of a solid solution in the silicon wafer; and an epitaxial layer having a resistivity that is higher than the resistivity of the silicon wafer, wherein a concentration profile of the predetermined element in the modifying layer in a depth direction thereof meets a specified full width half maximum and a specified peak concentration.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: October 22, 2019
    Assignee: SUMCO CORPORATION
    Inventors: Takuro Iwanaga, Kazunari Kurita, Takeshi Kadono
  • Patent number: 10396120
    Abstract: A semiconductor epitaxial wafer production method that can increase the peak concentration of hydrogen in a surface portion of a semiconductor wafer after epitaxial layer formation is provided. A method of producing a semiconductor epitaxial wafer comprises: a first step of irradiating a surface of a semiconductor wafer with cluster ions containing hydrogen as a constituent element, to form a modifying layer formed from, as a solid solution, a constituent element of the cluster ions including hydrogen in a surface portion of the semiconductor wafer; a second step of, after the first step, irradiating the semiconductor wafer with electromagnetic waves of a frequency of 300 MHz or more and 3 THz or less, to heat the semiconductor wafer; and a third step of, after the second step, forming an epitaxial layer on the modifying layer of the semiconductor wafer.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: August 27, 2019
    Assignee: SUMCO CORPORATION
    Inventors: Takeshi Kadono, Kazunari Kurita
  • Patent number: 10382575
    Abstract: Disclosed is a program execution system for suppressing consumption of a CPU resource and a battery of a user terminal such as a smart terminal. The program execution system includes: a client device determines whether a program started up is to be executed by the client device or another device and transmits a first execution request to which state information on the client device is added, to a proxy server when it is determined that the program is to be executed by another device; the proxy server receives the first execution request and determines whether the program is to be executed by the proxy server or another device and transmits a second execution request to a cloud server when it is determined that the program is to be executed by another device; and the cloud server receives the second execution request and executes the program.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: August 13, 2019
    Assignee: NEC CORPORATION
    Inventor: Takeshi Kurita
  • Patent number: 10371230
    Abstract: A damping apparatus includes a damping unit 30 composed of a plurality of damping plates 36 having plasticity, a holding member 31 holding at least one ends of the damping plates 36 in a manner to allow deflection of the damping plates 36 with the damping plates 36 laminated together, and a contact member 33 provided at a position spaced from a holding position of the holding member 31, and attached to an outermost one of the damping plates 36, or extending through and held by the damping plates 36 in such a manner that it can be brought into contact with the outermost one of the damping plates 36 and can be moved in an extending direction thereof. The damping unit 30 is supported by a support mechanism 2 in such a manner that the contact member 33 can be brought into contact with an object W.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: August 6, 2019
    Assignee: KAWATATEC CORP.
    Inventors: Masahiro Kawata, Takeshi Harada, Takuya Matsumoto, Yutaka Kurita, Hirotaka Tanabe, Yasunori Oura, Takashi Tanaka
  • Publication number: 20190232423
    Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.
    Type: Application
    Filed: January 24, 2019
    Publication date: August 1, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshio MIZUTA, Takashi KURITA, Takeshi WATARI, Yuki KABEYA, Norio KURITA, Toshiyuki KAWASHIMA
  • Patent number: 10336879
    Abstract: A rigid polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. Provided is a rigid polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a blowing agent, and a catalyst. The rigid polyurethane foam contains the polyol containing a polyester polyol having an aromatic component concentration of 17-35 wt. %, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the blowing agent containing a halogenated olefin.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: July 2, 2019
    Assignee: ACHILLES CORPORATION
    Inventors: Takeshi Kurita, Yamato Koike
  • Publication number: 20190178317
    Abstract: A brake disc for a railway vehicle is provided in which noise arising from the brake disc during high-speed rotation of a wheel is reduced by a large margin. A brake disc for a railway vehicle includes: a disc plate portion that has a sliding portion on a front face thereof; a plurality of through-holes that pass from the front face to a rear face of the disc plate portion and are arranged in alignment in the circumferential direction of the disc plate portion, the through-holes allowing bolts to pass therethrough for fastening together the disc plate portion and a wheel of the railway vehicle; and a groove provided to link a plurality of through-holes on the front face side of the disc plate portion.
    Type: Application
    Filed: December 6, 2016
    Publication date: June 13, 2019
    Inventors: Nobuo Shiraishi, Yusuke Wakabayashi, Takeshi Kurita, Takahiro Fujimoto, Hiroshi Nogami, Atsushi Sakaguchi, Takanori Kato, Yuki Ichikawa
  • Patent number: 10304761
    Abstract: Provided are a semiconductor device realized easily at low cost without requiring a complicated manufacturing process, and an alternator using the same. The semiconductor device includes a base having a base seat, a lead having a lead header, and an electronic circuit body, wherein the electronic circuit body is arranged between the base and the lead; the base seat is connected to a first surface of the electronic circuit body; the lead header is connected to a second surface of the electronic circuit body; the electronic circuit body is integrally covered by resin, including a transistor circuit chip having a switching element, a control circuit chip for controlling the switching element, a drain frame, and a source frame; either one of the drain frame and the source frame, and the base are connected; and the other one of the drain frame and the source frame, and the lead are connected.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: May 28, 2019
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Kenya Kawano, Tetsuya Ishimaru, Shinichi Kurita, Takeshi Terakawa
  • Publication number: 20190017559
    Abstract: A brake disc for a railway vehicle includes: a disc plate portion that has a sliding portion of a front face; a plurality of radial fins that are provided on the rear face of a disc plate portion, and that have a shape that extends in the radial direction of the disc plate portion; and a circumferential rib that is provided between each pair of adjacent radial fins, and that has a shape that extends in the circumferential direction of the disc plate portion. A flow path for air is formed between the pair of radial fins, and the flow path for air is narrowed by the circumferential rib. On the circumferential rib, a gradual slope for suppressing fluctuations in an airflow that passes between the pair of radial fins is provided from a base part to a top part.
    Type: Application
    Filed: December 6, 2016
    Publication date: January 17, 2019
    Inventors: Nobuo Shiraishi, Yusuke Wakabayashi, Takeshi Kurita, Takanori Kato, Takahiro Fujimoto, Hiroshi Nogami, Atsushi Sakaguchi, Yuki Ichikawa
  • Publication number: 20180030232
    Abstract: A rigid polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. Provided is a rigid polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a blowing agent, and a catalyst. The rigid polyurethane foam contains the polyol containing a polyester polyol having an aromatic component concentration of 17-35 wt. %, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the blowing agent containing a halogenated olefin.
    Type: Application
    Filed: February 24, 2016
    Publication date: February 1, 2018
    Applicant: ACHILLES CORPORATION
    Inventors: Takeshi KURITA, Yamato KOIKE
  • Publication number: 20170171340
    Abstract: Disclosed is a program execution system for suppressing consumption of a CPU resource and a battery of a user terminal such as a smart terminal. The program execution system includes: a client device determines whether a program started up is to be executed by the client device or another device and transmits a first execution request to which state information on the client device is added, to a proxy server when it is determined that the program is to be executed by another device; the proxy server receives the first execution request and determines whether the program is to be executed by the proxy server or another device and transmits a second execution request to a cloud server when it is determined that the program is to be executed by another device; and the cloud server receives the second execution request and executes the program.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 15, 2017
    Applicant: NEC CORPORATION
    Inventor: Takeshi KURITA
  • Patent number: 9352654
    Abstract: A slider is slightly moved in a direction in which both side surfaces of the slider come in contact with inclined surfaces of impact mitigating parts of neighboring contact strip pieces. For this reason, the inclined surface of the impact mitigating part of the contact strip piece which the slider approaches is relatively downwardly slid with respect to one side surface of the slider. In addition, the inclined surface of the impact mitigating part of the contact strip piece from which the slider moves away is relatively upwardly slid with respect to the other side surface of the slider. As a result, since an impact generated between the contact strip piece and the slider is mitigated by the impact mitigating part without fitting the slider into a stepped section between the neighboring contact strip pieces, the slider is smoothly transferred from the one contact strip piece of the neighboring contact strip pieces to the other contact strip piece.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 31, 2016
    Assignees: East Japan Railway Company, Toyo Electric Mfg. Co., Ltd.
    Inventors: Haruo Yamada, Takeshi Kurita, Fumio Mizushima, Shinji Nakajima, Hitoshi Satoh
  • Patent number: 9227577
    Abstract: Provided is an acoustic insulation device for a mobile vehicle in which sound transmitted to the exterior of the vehicle body is blocked by being reflected or diffracted by acoustic insulation bodies provided upright to the vehicle body; and the amount of noise that an observer or local residents are subjected to is further reduced. Movement of a mobile vehicle generates noise in, and in the vicinity of, a power collector or a similar device provided upright on the roof (3) of the vehicle. Acoustic insulation bodies (1L), (2L), (1R), (2R) are provided upright on the roof (3), and block noise travelling directly ahead. The noise is diffracted or reflected by the acoustic insulation bodies (1L), (2L), (1R), (2R), and moves so as to be transmitted to the vehicle exterior.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: January 5, 2016
    Assignee: East Japan Railway Company
    Inventors: Takeshi Kurita, Fumio Mizushima