Abstract: In a distribution server of a distribution server system according to the present invention, menu information, including a menu item name and information to execute a job related to the menu item name, is generated based on display capability information and job capability information of each multifunction apparatus. The generated menu information is stored in a hard disk. When the multifunction apparatus requests for the menu information, the distribution server retrieves the information from the hard disk and delivers the same to the requesting multifunction apparatus via a network. The display capability information and job capability information of the multifunction apparatus is displayed so that personalized menu information can be generated, by a user, based on a menu item name (set within the range of the display capability) and a function (selected from the job capability).

Abstract: A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.

Abstract: A built-in electrode type susceptor having excellent corrosion resistance and plasma resistance is obtained. A placement plate and a support plate made of ceramics are prepared, fixation holes are formed in this support plate, and feeding terminals consisting of a conductive composite ceramics are fitted into these fixation holes so as to penetrate through the support plate. A conductive material layer consisting of a conductive composite ceramics is formed on this support plate so as to come into contact with the feeding terminals, and the support plate and the placement plate are overlapped on each other via the conductive material layer on the support plate, and subjected to sintering and heat treatment under application of pressure, to thereby integrate these plates. Also, the conductive material layer is used as an internal electrode consisting of a conductive composite ceramics sintered body, to thereby obtain a built-in electrode type susceptor.

Abstract: An electrode-built-in susceptor is formed by a susceptor base body which is made of an aluminium-nitride-group-sintered-member on one of which surface a plate sample is mounted, an inner electrode which is built in the susceptor member, a power supplying terminal which is disposed in the susceptor base body so as to be attached to the inner electrode, and an insulating layer which is formed mainly by one of a boron nitride, a lithium oxide, an aluminium oxide, or a magnesium oxide is formed between the inner electrode and the mounting surface.

Abstract: There is provided a susceptor with a built-in electrode and a manufacturing method therefor, in which there is no danger of corrosive gas or plasma or the like penetrating to the inside of the substrate, which has excellent corrosion resistance and plasma resistance, in which nonconductivity under high temperatures is improved, and in which leakage current does not occur.

Abstract: A built-in electrode type susceptor having excellent corrosion resistance and plasma resistance is obtained.

Abstract: In an apparatus for processing input N-bit digital video data with an error correction parity, the input N-bit digital video data includes each one sample of higher-order-N-bit data and a plurality of samples of lower-order-(M-N)-bit data, wherein M>N. An error correction circuit corrects an error of input N-bit digital video data, outputs error-corrected N-bit digital video data, and generates an error detection signal representing an error which can not be corrected. Further, a data combining circuit converts the error-corrected N-bit digital video data into M-bit digital video data, and an error classifying circuit classifies the error detection signal into a first error detection signal representing an error of the each one sample of the higher-order-N-bit data and a second error detection signal representing an error of the plurality of samples of the lower-order-(M-N)-bit data.