Abstract: By transmitting/receiving a multicast receiving terminal management message, a router to be a starting point upon creation of a multicast route is determined based on a multicast routing protocol, and switched according to a state of a multicast transmitting terminal side network. Accordingly, when a trouble occurs in the transmitting terminal side network, it becomes possible to perform switching into a redundant network.

Abstract: A transfer material comprising an organic thin film uniformly provided by a wet method, etc. with high productivity is used to efficiently produce an organic thin film device such as an organic EL device excellent in light-emitting efficiency, uniformity of light emission and durability.

Abstract: A manufacturing apparatus of a semiconductor device is disclosed, which comprises an implantation source which applies particles or an electromagnetic wave into an implantation region of a semiconductor substrate in a ? direction shifted by an angle ? from a vertical direction of the semiconductor substrate, a first stencil mask disposed between the semiconductor substrate and the implantation source, the first stencil mask having a first opening corresponding in the ? direction to the implantation region, and a second stencil mask disposed between the first stencil mask and the implantation source, the second stencil mask having a second opening corresponding in the ? direction to the implantation region.

Abstract: A manufacturing apparatus of a semiconductor device is disclosed, which comprises an implantation source which applies particles or an electromagnetic wave into an implantation region of a semiconductor substrate in a ? direction shifted by an angle ? from a vertical direction of the semiconductor substrate, a first stencil mask disposed between the semiconductor substrate and the implantation source, the first stencil mask having a first opening corresponding in the ? direction to the implantation region, and a second stencil mask disposed between the first stencil mask and the implantation source, the second stencil mask having a second opening corresponding in the ? direction to the implantation region.

Abstract: An ion implantation apparatus includes an ion emission unit configured to emit ions to a plurality of regions of at least one substrate under different conditions. A substrate holding unit is configured to hold the substrate and change a position of the at least one substrate relative to the ions emitted from the ion emission unit. A computation unit is configured to prepare a correcting process condition for each of the regions based on correction information beforehand input for each of the regions. The correcting process condition is acquired by correcting a standard process condition used for ion emission. A controller controls the ion emission unit and the substrate holding unit to emit the ions to each of the regions under the correcting process condition.

Abstract: An ion implantation apparatus includes a laser beam irradiation unit which irradiates the surface of a target substrate with laser beam. The angle of an optical axis of the laser beam relative to the surface is adjustable. A reference line defining unit is adapted to define a virtual reference line which coincides with the optical axis of the laser beam when the angle takes a certain value. An ion irradiation unit provides an ion beam on a trajectory which coincides with the reference line.

Abstract: An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.

Abstract: A semiconductor device fabrication method includes preparing a substrate having a first circuit pattern of a semiconductor device; providing a mask with at least part of second circuit pattern of the semiconductor device; collimating incident direction of particles; changing at least one of the a substrate angle between a vertical axis of the substrate and the incident direction of the particles and a mask angle between a vertical axis of the mask and the incident direction so that the second circuit pattern on the mask can be aligned to the first circuit pattern on the substrate with a design margin; and selectively irradiating the particles to the substrate using the mask.

Abstract: A stencil mask capable of attaining long durability without any special processing thereon, wherein an inversion means for inverting the front and back of the stencil mask formed with an opening pattern penetrating in the thickness direction is provided, so that positions can be changed, that is, a surface irradiated with charged particles can be on the side of facing to a substrate subjected to processing, and a surface faced to the substrate can be on the side of receiving irradiation of charged particles, and the inversion means comprises a mask holder for electrostatically sticking with an outer circumferential part of the stencil mask and a rotation means for rotating the mask holder about an axis of a supporting portion.

Abstract: Preparing a stencil mask comprising a silicon thin film in which an opening for selectively irradiating charged particles to a semiconductor substrate is provided and whose irradiation surface on which the charged particles are irradiated is implanted with an impurity, and selectively irradiating charged particles to the semiconductor substrate using the stencil mask which is opposingly arranged on the semiconductor substrate.

Abstract: A transfer material comprising an organic thin film uniformly provided by a wet method, etc. with high productivity is used to efficiently produce an organic thin film device such as an organic EL device excellent in light-emitting efficiency, uniformity of light emission and durability.

Abstract: A method for fabricating a semiconductor device and an equipment for fabricating the semiconductor device are described.

Abstract: In a stencil mask, a conductive thin film has first openings in it. An insulating film is formed in the region of the conductive thin film excluding the first openings. A conductive support is formed on the insulating film. A second opening goes through the conductive support and insulating film and reaches the surface of the conductive thin film. A conducting member is formed in the second opening. The conducting member connects the conductive support and conductive thin film electrically.

Abstract: A manufacturing apparatus of a semiconductor device is disclosed, which comprises an implantation source which applies particles or an electromagnetic wave into an implantation region of a semiconductor substrate in a &thgr; direction shifted by an angle &thgr; from a vertical direction of the semiconductor substrate, a first stencil mask disposed between the semiconductor substrate and the implantation source, the first stencil mask having a first opening corresponding in the &thgr; direction to the implantation region, and a second stencil mask disposed between the first stencil mask and the implantation source, the second stencil mask having a second opening corresponding in the &thgr; direction to the implantation region.

Abstract: An image display has an electromagnetic shield comprising a conductive material with an irregular network structure. The image display is obtained by forming a thin film on a substrate; generating microcracks in a network manner in the thin film; and forming a layer of the conductive material in the microcracks. The electromagnetic shield has excellent electromagnetic-shielding properties and high light transmittance.

Abstract: A network conductor has an irregular network structure with as thin lines as 10 nm to 10 &mgr;m. The network conductor is obtained by forming a thin film on a substrate; forming microcracks in a network manner in the thin film; and forming a layer of a conductive material in the microcracks. The network conductor can be used for a positive electrode and/or a negative electrode of an organic electroluminescence device.

Abstract: Preparing a stencil mask comprising a silicon thin film in which an opening for selectively irradiating charged particles to a semiconductor substrate is provided and whose irradiation surface on which the charged particles are irradiated is implanted with an impurity, and selectively irradiating charged particles to the semiconductor substrate using the stencil mask which is opposingly arranged on the semiconductor substrate.

Abstract: A stencil mask has a silicon thin film in which an opening pattern is formed, a silicon oxide film, and a support part. The silicon thin film has a two-layer structure of a first silicon thin film and a second silicon thin film stacked one on top of the other. The first and second silicon thin films enable microscopic openings to be made in them. Stacking the first and second silicon thin films one on top of the other makes it possible to achieve the necessary strength and increase the strength of the stencil mask.

Abstract: A transfer material comprising an organic thin film uniformly provided by a wet method, etc. with high productivity is used to efficiently produce an organic thin film device such as an organic EL device excellent in light-emitting efficiency, uniformity of light emission and durability.

Abstract: To reduce the number of components for facilitating assembly and parts management, and to ensure prevention of rattling of the movable block, a switch contact structure is disclosed, which comprises a substrate 63, a movable block 67 disposed so as to be movable along the substrate 63, a fixed contact 89 mounted on the substrate 63, and a movable contact mounted on the movable block 67, the movable contact being brought into and out of contact with the fixed contact 89 by the movement of the movable block 67 along the substrate 63, wherein the movable block 67 is provided with a resin spring portion 107 formed integrally therewith for urging the movable block 67 toward the substrate 63, and the movable contact plated or printed on the surface facing toward the substrate 63.