Patents by Inventor Takeshi Shimane
Takeshi Shimane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230301109Abstract: A semiconductor device has a third region between first and second regions on a substrate surface. A gate insulating film which is above the third region. A gate electrode is above the gate insulating film and includes a metal-containing layer. A first conductor is above the gate electrode. A first voltage can be applied to the first conductor. A second conductor is above the first region. A second voltage can be applied to the second conductor. A third conductor is above the first region. A third voltage different from the first and second can be applied to the third conductor. A metal oxide film is provided between the first region and the third conductor. An upper surface of the metal oxide film includes a portion at a height from the substrate that is lower than a height of an upper surface of the metal-containing layer.Type: ApplicationFiled: August 26, 2022Publication date: September 21, 2023Inventors: Tadayoshi UECHI, Takeshi SHIMANE
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Patent number: 11694995Abstract: A semiconductor memory device, includes: a first region including a memory cell array; and a second region including a peripheral circuit. The second region includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes: a semiconductor region between the first and second surfaces; an n-type semiconductor region provided on the first surface and higher in donor concentration than the semiconductor region; a damaged region provided on the second surface; and a p-type semiconductor region provided between the damaged region and the n-type semiconductor region, closer to the second surface than the n-type semiconductor region in a direction from the first surface toward the second surfaces of the semiconductor substrate, and higher in acceptor concentration than the semiconductor region.Type: GrantFiled: March 1, 2021Date of Patent: July 4, 2023Assignee: Kioxia CorporationInventors: Michihito Kono, Takashi Izumida, Tadayoshi Uechi, Takeshi Shimane
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Patent number: 11527645Abstract: A semiconductor device of an embodiment includes: a first and second semiconductor regions of a first conductivity type; a third semiconductor region of a second conductivity type disposed between the first and second semiconductor regions; a fourth semiconductor region of the first conductivity type disposed below the first semiconductor region; a fifth semiconductor region of the first conductivity type disposed below the second semiconductor region; a first region containing carbon disposed between the first and fourth semiconductor regions; a second region containing carbon disposed between the second and fifth semiconductor regions; a third region disposed between the first and second regions; the first and second regions having a first and second carbon concentrations respectively, the third region not containing carbon or having a lower carbon concentration than the first and second carbon concentrations in a portion below an end of a lower face of a gate electrode.Type: GrantFiled: July 30, 2019Date of Patent: December 13, 2022Assignee: KIOXIA CORPORATIONInventors: Tadayoshi Uechi, Takashi Izumida, Takeshi Shimane
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Publication number: 20220246632Abstract: A semiconductor device includes a semiconductor substrate that includes a first surface and a second surface, a semiconductor region between the first and second surfaces, a first well region in the first surface and having one of a donor concentration and a acceptor concentration higher than the semiconductor region, a second well region between the first well region and the second surface and having a higher acceptor concentration than the semiconductor region, a third well region between the second well region and the second surface and having a higher donor concentration than the semiconductor region, a conductor surrounding at least a portion of the first well region along the first surface and extending from the first surface to the third well region in a first direction intersecting the first surface, and an insulator between the conductor and the first well region and between the conductor and the second well region.Type: ApplicationFiled: August 24, 2021Publication date: August 4, 2022Inventor: Takeshi SHIMANE
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Publication number: 20220084984Abstract: A semiconductor memory device, includes: a first region including a memory cell array; and a second region including a peripheral circuit. The second region includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes: a semiconductor region between the first and second surfaces; an n-type semiconductor region provided on the first surface and higher in donor concentration than the semiconductor region; a damaged region provided on the second surface; and a p-type semiconductor region provided between the damaged region and the n-type semiconductor region, closer to the second surface than the n-type semiconductor region in a direction from the first surface toward the second surfaces of the semiconductor substrate, and higher in acceptor concentration than the semiconductor region.Type: ApplicationFiled: March 1, 2021Publication date: March 17, 2022Applicant: Kioxia CorporationInventors: Michihito KONO, Takashi IZUMIDA, Tadayoshi UECHI, Takeshi SHIMANE
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Patent number: 11056558Abstract: A semiconductor device according to an embodiment includes a semiconductor layer having a first plane and a second plane opposite to the first plane; a gate electrode; a gate insulating layer provided between the first plane and the gate electrode; and a pair of first p-type impurity regions provided in the semiconductor layer on both sides of the gate electrode, containing boron, carbon, and germanium, having a bond structure of boron and carbon, having a first boron concentration and a first depth in a direction from the first plane toward the second plane, and having a distance between the first p-type impurity regions being a first distance.Type: GrantFiled: February 15, 2019Date of Patent: July 6, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takashi Izumida, Takeshi Shimane, Tadayoshi Uechi
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Publication number: 20200295191Abstract: A semiconductor device of an embodiment includes: a first and second semiconductor regions of a first conductivity type; a third semiconductor region of a second conductivity type disposed between the first and second semiconductor regions; a fourth semiconductor region of the first conductivity type disposed below the first semiconductor region; a fifth semiconductor region of the first conductivity type disposed below the second semiconductor region; a first region containing carbon disposed between the first and fourth semiconductor regions; a second region containing carbon disposed between the second and fifth semiconductor regions; a third region disposed between the first and second regions; the first and second regions having a first and second carbon concentrations respectively, the third region not containing carbon or having a lower carbon concentration than the first and second carbon concentrations in a portion below an end of a lower face of a gate electrode.Type: ApplicationFiled: July 30, 2019Publication date: September 17, 2020Applicant: TOSHIBA MEMORY CORPORATIONInventors: Tadayoshi UECHI, Takashi IZUMIDA, Takeshi SHIMANE
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Publication number: 20200091292Abstract: A semiconductor device according to an embodiment includes a semiconductor layer having a first plane and a second plane opposite to the first plane; a gate electrode; a gate insulating layer provided between the first plane and the gate electrode; and a pair of first p-type impurity regions provided in the semiconductor layer on both sides of the gate electrode, containing boron, carbon, and germanium, having a bond structure of boron and carbon, having a first boron concentration and a first depth in a direction from the first plane toward the second plane, and having a distance between the first p-type impurity regions being a first distance.Type: ApplicationFiled: February 15, 2019Publication date: March 19, 2020Applicant: Toshiba Memory CorporationInventors: Takashi IZUMIDA, Takeshi SHIMANE, Tadayoshi UECHI
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Patent number: 8390076Abstract: According to an aspect of the present invention, there is provided a semiconductor device including: a semiconductor substrate; active areas with island-like shapes formed on the semiconductor substrate; an element isolation area surrounding the active areas and including an element isolation groove formed on the semiconductor substrate and an element isolation film embedded into the element isolation groove; gate insulating films each formed on corresponding one of the active areas and having a first end portion that overhangs from the corresponding active area onto the element isolation area at one side and a second end portion that overhangs from the corresponding active area onto the element isolation area at the other side, wherein an overhang of the first end portion has a different length from a length of an overhang of the second end portion.Type: GrantFiled: April 8, 2009Date of Patent: March 5, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Atsuhiro Suzuki, Hiroshi Shimode, Takeshi Shimane, Norihisa Arai, Minori Kajimoto
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Patent number: 8369152Abstract: According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other.Type: GrantFiled: June 17, 2010Date of Patent: February 5, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Takeshi Shimane, Naoyuki Shigyo, Mutsuo Morikado
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Publication number: 20110233680Abstract: According to one embodiment, a nonvolatile memory device including MOS transistors formed in a surface of one semiconductor substrate is provided. The device includes a first and second MOS transistors. The first MOS transistor includes a first source and drain regions spaced from each other, a first gate insulating film provided on the surface, a first gate electrode provided on the first gate insulating film, and a first channel region located immediately below the first gate insulating film and containing impurities of both conductivity types. The second MOS transistor includes a second source and drain regions spaced from each other, a second gate insulating film provided on the surface, a second gate electrode provided on the second gate insulating film, and a second channel region located immediately below the second gate insulating film and having an identical concentration profile of the impurity to the first channel region.Type: ApplicationFiled: September 20, 2010Publication date: September 29, 2011Applicant: Kabushiki Kaisha ToshibaInventors: Saku HASHIURA, Shinichi WATANABE, Takeshi SHIMANE, Norihisa ARAI
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Patent number: 7911844Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: GrantFiled: December 18, 2008Date of Patent: March 22, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi
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Publication number: 20100329026Abstract: According to one embodiment, a semiconductor memory device includes memory cells, first and second selection transistors, a source line, a temperature monitor, and a source line voltage controller. The memory cells are connected in series between a source of the first selection transistor and a drain of the second selection transistor. The temperature monitor monitors a temperature of the semiconductor substrate. The source line voltage controller applies a voltage to the source line, in a read operation, in such a manner that a potential difference between the source line and the semiconductor substrate increases according to a rise in the temperature monitored by the temperature monitor and that a reverse bias is applied between the source of the second selection transistor and the semiconductor substrate.Type: ApplicationFiled: June 24, 2010Publication date: December 30, 2010Inventors: Mitsutoshi NAKAMURA, Takeshi Shimane, Michiru Hogyoku, Katsuaki Isobe, Naoyuki Shigyo
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Publication number: 20100322009Abstract: According to one embodiment, a semiconductor memory device includes a semiconductor substrate, memory cells without a source region and a drain region, and a first insulating film. The memory cells are arranged adjacent to one another on the semiconductor substrate and include a first gate electrode including a charge accumulation layer. A current path functioning as a source region or a drain region of a selected memory cell is formed in the semiconductor substrate when a voltage is applied to the first gate electrode of one of unselected memory cells. The first insulating film is formed on the semiconductor substrate to fill a region between the first gate electrodes of the memory cells adjacent to each other.Type: ApplicationFiled: June 17, 2010Publication date: December 23, 2010Inventors: Takeshi SHIMANE, Naoyuki Shigyo, Mutsuo Morikado
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Publication number: 20090256190Abstract: According to an aspect of the present invention, there is provided a semiconductor device including: a semiconductor substrate; active areas with island-like shapes formed on the semiconductor substrate; an element isolation area surrounding the active areas and including an element isolation groove formed on the semiconductor substrate and an element isolation film embedded into the element isolation groove; gate insulating films each formed on corresponding one of the active areas and having a first end portion that overhangs from the corresponding active area onto the element isolation area at one side and a second end portion that overhangs from the corresponding active area onto the element isolation area at the other side, wherein an overhang of the first end portion has a different length from a length of an overhang of the second end portion.Type: ApplicationFiled: April 8, 2009Publication date: October 15, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Atsuhiro SUZUKI, Hiroshi SHIMODE, Takeshi SHIMANE, Norihisa ARAI, Minori KAJIMOTO
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Publication number: 20090161427Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: ApplicationFiled: December 18, 2008Publication date: June 25, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi
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Patent number: RE45307Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: GrantFiled: March 21, 2013Date of Patent: December 30, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi
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Patent number: RE46526Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: GrantFiled: October 22, 2014Date of Patent: August 29, 2017Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi
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Patent number: RE47355Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: GrantFiled: July 13, 2017Date of Patent: April 16, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi
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Patent number: RE49274Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.Type: GrantFiled: February 25, 2019Date of Patent: November 1, 2022Assignee: KIOXIA CORPORATIONInventors: Dai Nakamura, Hiroyuki Kutsukake, Kenji Gomikawa, Takeshi Shimane, Mitsuhiro Noguchi, Koji Hosono, Masaru Koyanagi, Takashi Aoi