Abstract: In this semiconductor device and the inverter provided with the semiconductor device, an upper arm semiconductor element on a positive electrode wiring plate and an AC wiring plate are connected to each other by a first wiring member, and a lower arm semiconductor element on the AC wiring plate and a negative electrode wiring plate are connected to each other by a second wiring member. The AC wiring plate has: a first region to which the first wiring member is to be connected; a second region in which the lower arm semiconductor element is to be provided; and a connection region that connects these two regions. The connection region is positioned opposite positive-electrode/negative-electrode terminals with a region in between where the first and second wiring members are used, and the placement order is as follows: the positive electrode wiring plate, the negative electrode wiring plate, the first region, and the second region.

Abstract: A power conversion device can be miniaturized. A power conversion device includes a power module that performs switching operation, a smoothing capacitor that smooths a voltage ripple caused by the switching operation, a circuit board that controls driving of the power module, a housing that accommodates the power module and the smoothing capacitor, a first fixing member for fixing the power module to the housing, and a second fixing member for fixing the smoothing capacitor to the housing. The circuit board straddles between the power module and the smoothing capacitor, and is fixed by the first fixing member and the second fixing member.

Abstract: A power conversion device includes a substrate on which DC wiring and AC wiring are formed, and a plurality of circuit bodies that are electrically connected in parallel and have a first terminal and a second terminal each connected to the DC wiring or the AC wiring. The first terminals and the second terminals are adjacent to each other in the circuit bodies and protrude in a same direction, and the plurality of circuit bodies are disposed such that the first terminals and the second terminals are alternately arranged side by side on the substrate.

Abstract: A power conversion device includes: an inverter circuit; an AC conductor; a magnetic sensor that t detects magnetism generated when an AC current flows; a first magnetic body and a second magnetic body that face each other with the AC conductor and the magnetic sensor interposed therebetween; and a first housing and a second housing that are formed by conductive members. The first housing covers one opening of a space located between the first magnetic body and the second magnetic body, the second housing covers the other opening of the space. The end of each of the first magnetic body and the second magnetic body is formed so that the distance to the first housing or the second housing is smaller than the thickness of each of the first magnetic body and the second magnetic body in the arraying direction thereof.

Abstract: A power conversion device includes a plurality of circuit bodies each including a semiconductor element, and a printed circuit board having the plurality of circuit bodies mounted thereon and having a relay wiring connecting the plurality of circuit bodies to each other, a DC wiring, and an AC wiring, wherein at least one of the AC wiring and the DC wiring is connected to a conductor member.

Abstract: An electric power converter includes: an inverter circuit including a plurality of switching elements; a first capacitor and a second capacitor connected in parallel with the inverter circuit; a control circuit unit that controls the inverter circuit; and a connection conductor portion that connects the first capacitor and the second capacitor, wherein a conductive member is disposed between the control circuit unit and the connection conductor portion.

Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other.

Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other.

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: A power semiconductor device according to the present invention is provided with: a first circuit body constituting an upper arm of an inverter circuit for converting a DC current into an AC current; a second circuit body constituting a lower arm of the inverter circuit; and a circuit board that has therein a through-hole in which the first circuit body and the second circuit body are disposed and that has an intermediate board between the first circuit body and the second circuit body. The intermediate board has an AC wiring pattern for transmitting the AC current, and the first circuit body and the second circuit body are connected to the AC wiring pattern so as to be in surface contact with the AC wiring pattern.

Abstract: A motor control device connected to a power converter that performs power conversion from DC power to AC power and controls driving of an AC motor that is driven by using the AC power includes a voltage command generation unit that generates a three-phase voltage command; and a gate signal generation unit that performs pulse width modulation on the three-phase voltage command and generates a gate signal for controlling an operation of the power converter, in which the voltage command generation unit adjusts the three-phase voltage command by using a zero-phase voltage based on a power factor of the AC power in an overmodulation region in which a modulation factor according to a voltage amplitude ratio between the DC power and the AC power exceeds a predetermined threshold value, and the gate signal generation unit generates the gate signal by performing pulse width modulation on the adjusted three-phase voltage command.

Abstract: A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

Abstract: A power semiconductor device includes: a substrate in which a positive electrode wiring connected to a first conductor on a high potential side and a negative electrode wiring connected to a fourth conductor on a low potential side are provided on one surface, and an output wiring connected to a second conductor and a third conductor is provided on the other surface so as to face the positive electrode wiring and the negative electrode wiring; and a first capacitor that smooths DC power supplied to a first upper-arm circuit body and a first lower-arm circuit body. The substrate is disposed between the first upper-arm circuit body and the first lower-arm circuit body. The first capacitor is disposed between the first upper-arm circuit body and the first lower-arm circuit body, and is connected to the positive electrode wiring and the negative electrode wiring on the substrate.

Abstract: This power conversion device comprises: first and second power circuit units each having a power semiconductor element and a plurality of conductors that hold the power semiconductor element therebetween and that are connected to an emitter and a collector of the power semiconductor element; and a flow channel forming body which houses the first and second power circuit units and through which a refrigerant flows. A conductor at the emitter side of the first power circuit unit is disposed so as to face a conductor at the collector side of the second power circuit unit. The conductor at the emitter side of the first power circuit unit and the conductor at the collector side of the second power circuit unit are connected to each other via a plurality of conductive fins which are in contact with the refrigerant.

Abstract: A power semiconductor device according to the present invention is provided with a conductive section, a circuit component, a substrate that supports the conductive section and the circuit component, and a sealing member, wherein the sealing member forms a first flow path, and the first flow path has a first region thermally connected to a power circuit and a second region thermally connected to the circuit component.

Abstract: A power module includes a power semiconductor element converting DC power into AC power and outputting the AC power to a motor; a conductor electrically connected to the power semiconductor element; a substrate having a substrate wiring connected to the conductor on a surface; and a resin sealing material sealing the power semiconductor element, the conductor, and the substrate, in which the substrate has, at a position in contact with an end portion of the resin sealing material, a concave portion formed by a surface of the substrate wiring becoming concave in a continuously curved surface shape.

Abstract: An object of the present invention is to provide a structure capable of stably holding a bonded magnet into a magnet insertion part of a rotor core. A rotor of a rotating electrical machine includes a bonded magnet 112, an elastic member 113 having a bent part 113a, and a rotor core provided with a magnet storage part storing the bonded magnet 112 and the elastic member 113. The elastic member 113 is embedded in the bonded magnet 112 in a state where at least a part of the bent part 113a is exposed from the bonded magnet 112, and an exposed part 113c of the bent part 113a from the bonded magnet 112 comes into contact with an inner wall of the magnet storage part 114 and elastically deforms.

Abstract: An object of the present invention is to provide an inverter integrated motor that achieves both improvement in cooling performance of a current sensor and downsizing of an entire device. An inverter integrated motor includes: a power module that converts a direct current into an alternating current; a flow path forming body that is formed so as to flow and cover a refrigerant in the power module; an inverter that installs the power module and the flow path forming body inside; a current sensor that detects the alternating current; and a motor that houses a stator and a rotor, wherein the power module is disposed at a position facing a rotation shaft of the motor via the stator and the rotor, and the current sensor 13 is disposed between the flow path forming body and a coil end of the stator when viewed from a direction perpendicular to the rotation shaft, and at least a part of the current sensor is housed in a motor housing.

Abstract: An object of the present invention is to improve cooling capability of a bus bar with a simple system. An electric system includes a motor unit including a stator and a rotor, the motor unit being cooled by a refrigerant, an inverter unit that supplies electric power to a winding of the stator, a wiring portion that transmits electric power output from the inverter unit to the motor unit, and a pipe that supplies or discharges a refrigerant to or from the motor unit. The pipe is provided at a position at which the wiring portion can exchange heat with an oily medium cooled by the pipe.

Abstract: A power conversion device can be miniaturized. A power conversion device includes a power module that performs switching operation, a smoothing capacitor that smooths a voltage ripple caused by the switching operation, a circuit board that controls driving of the power module, a housing that accommodates the power module and the smoothing capacitor, a first fixing member for fixing the power module to the housing, and a second fixing member for fixing the smoothing capacitor to the housing. The circuit board straddles between the power module and the smoothing capacitor, and is fixed by the first fixing member and the second fixing member.