Patents by Inventor Takeshi Tokuyama
Takeshi Tokuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180013355Abstract: An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.Type: ApplicationFiled: February 26, 2016Publication date: January 11, 2018Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi TOKUYAMA, Morio KUWANO, Toshiya SATOH, Akihiro NAMBA
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Patent number: 9852962Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.Type: GrantFiled: February 4, 2015Date of Patent: December 26, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama, Toshiya Satoh, Toshiaki Ishii, Kazuaki Naoe
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Publication number: 20170365536Abstract: An electronic device includes electronic components and an epoxy resin portion which seals the electronic components. The electronic device is disposed in a refrigerant which cools the electronic components. A first layer having a three-dimensional crosslinking structure is formed on a surface or inside of the epoxy resin portion. The first layer is formed such that a length calculated by cube root of an average free volume in the three-dimensional crosslinking structure of the first layer is shorter than a length of the longest side of molecules forming the refrigerant.Type: ApplicationFiled: January 8, 2016Publication date: December 21, 2017Inventors: Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiya SATOH
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Publication number: 20170309540Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.Type: ApplicationFiled: October 15, 2015Publication date: October 26, 2017Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Hiroyuki TEMMEI, Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiaki ISHII, Toshiya SATOH
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Publication number: 20170302191Abstract: A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.Type: ApplicationFiled: June 28, 2017Publication date: October 19, 2017Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
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Patent number: 9729076Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: GrantFiled: June 28, 2016Date of Patent: August 8, 2017Assignee: Hitachi Automotive Systems, Ltd.Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Publication number: 20170223875Abstract: An object of the present invention is to provide a power conversion device that suppresses a bypass flow and has superior heat dissipation performance. The power conversion device according to the present invention includes a power semiconductor module 300 and a flow channel formation body 1000 on which the power semiconductor module 300 is disposed. The power semiconductor module 300 has a high thermal conductor 920 which is disposed at a position between a semiconductor chip and the flow channel formation body 1000 and a sealing material that seals a power semiconductor element and the high thermal conductor 920. The high thermal conductor 920 has a fin protruding to the flow channel formation body 1000 at the side of the flow channel formation body 1000 and a part of the sealing material surrounding the fin and a leading edge of the fin are on almost the same plane.Type: ApplicationFiled: June 8, 2015Publication date: August 3, 2017Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: NOBUTAKE TSUYUNO, Eiichi IDE, Takeshi TOKUYAMA
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Publication number: 20170215304Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: ApplicationFiled: April 10, 2017Publication date: July 27, 2017Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO, Keisuke HORIUCHI, Toshiya SATOH, Hideki MIYAZAKI
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Patent number: 9648791Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: August 10, 2015Date of Patent: May 9, 2017Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Publication number: 20170105321Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: ApplicationFiled: December 22, 2016Publication date: April 13, 2017Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO
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Patent number: 9609789Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: GrantFiled: January 6, 2014Date of Patent: March 28, 2017Assignee: HITACHI, LTD.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
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Patent number: 9583264Abstract: A capacitor device includes: a film capacitor element that has a coiled body in which an insulating layer and an electrification layer are laminated and wound together, and a pair of collector electrodes that are formed upon two opposite end faces of the coiled body; a case that has a capacitor housing portion within which the film capacitor element is received; a pair of inserts having insulation properties, one of which is inserted between one of the pair of collector electrodes and one of inner walls of the capacitor housing portion; and a mass of sealing and insulating material that is charged between the film capacitor element and the one of the inner walls of the capacitor housing portion.Type: GrantFiled: March 5, 2014Date of Patent: February 28, 2017Assignee: Hitachi, Ltd.Inventors: Hiroshi Kamizuma, Kinya Nakatsu, Junpei Kusukawa, Takeshi Tokuyama
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Patent number: 9565791Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.Type: GrantFiled: January 6, 2014Date of Patent: February 7, 2017Assignee: HITACHI, LTD.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito
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Publication number: 20160343636Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.Type: ApplicationFiled: February 4, 2015Publication date: November 24, 2016Inventors: Hiroyuki TEMMEI, Mina AMO, Nobutake TSUYUNO, Eiichi IDE, Takeshi TOKUYAMA, Toshiya SATOH, Toshiaki ISHII, Kazuaki NAOE
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Publication number: 20160308456Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: ApplicationFiled: June 28, 2016Publication date: October 20, 2016Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
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Patent number: 9433134Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.Type: GrantFiled: June 15, 2012Date of Patent: August 30, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Tokihito Suwa
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Patent number: 9407163Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: GrantFiled: December 17, 2014Date of Patent: August 2, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
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Patent number: 9407166Abstract: An inverter device includes; a switching element; a plurality of flyback diodes each connected in parallel with the switching element; a first conductor plate connected to anode terminals of the flyback diodes and to one side of the switching element; and a second conductor plate connected to cathode terminals of the flyback diodes and to the other side of the switching element. Each of the flyback diodes is formed in a polygonal shape, and the two flyback diodes in each pair of the flyback diodes that are arranged in mutually adjacent positions are arranged so that a vertex of one opposes a vertex of the other.Type: GrantFiled: March 5, 2014Date of Patent: August 2, 2016Assignee: Hitachi, Ltd.Inventors: Masami Ohnishi, Takeshi Tokuyama
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Patent number: 9362261Abstract: The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module.Type: GrantFiled: July 22, 2013Date of Patent: June 7, 2016Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Akira Mima, Yukio Hattori, Toshiya Satoh
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Publication number: 20160149512Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.Type: ApplicationFiled: December 17, 2014Publication date: May 26, 2016Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA