Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: A current sensor includes: a bus bar defining a longitudinal direction along one direction and in which an alternating current flows along the longitudinal direction; a sensor unit that outputs a detection signal based on a magnetic field generated according to the alternating current flowing through the bus bar; and a sensor housing in which the bus bar and the sensor unit are arranged. The bus bar is configured by a first bus bar and a second bus bar stacked in an arrangement direction of the bus bar and the sensor unit. The bus bar includes a covered portion covered with the sensor housing and a fastening portion exposed from the sensor housing. The first bus bar and the second bus bar are arranged in a state in which a gap is defined between the first bus bar and the second bus bar in the covered portion.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: The current sensor has a conductive member through which a current to be measured flows in a predetermined direction, and a magneto electric converter facing and spaced apart from the conductive member in an intersecting direction intersecting the predetermined direction. An opposing portion of the conductive member facing the magneto electric converter has an annular shape in which two tip surfaces face each other via a gap around the predetermined direction. The magneto electric converter is opposed to the hollow portion, arranged in the opposing portion having an annular shape, in the intersecting direction via the gap.

Abstract: A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Abstract: The current sensor has a conductive member through which a current to be measured flows in a predetermined direction, and a magneto electric converter facing and spaced apart from the conductive member in an intersecting direction intersecting the predetermined direction. An opposing portion of the conductive member facing the magneto electric converter has an annular shape in which two tip surfaces face each other via a gap around the predetermined direction. The magneto electric converter is opposed to the hollow portion, arranged in the opposing portion having an annular shape, in the intersecting direction via the gap.

Abstract: A control module is arranged in alignment with a battery module in a longitudinal direction. The battery module includes battery cells that are aligned in the longitudinal direction and each have upper and lower end faces opposite to each other in a height direction perpendicular to the longitudinal direction. The control module includes a busbar configured to electrically connect the battery module to an electrical load, a switch configured to switch electrical connection of the busbar with the electrical load between a connected state and a disconnected state, and a controller that controls the switch. In the height direction, the busbar is located closer to the upper end faces of the battery cells than to the lower end faces; the controller is located closer to the lower end faces of the battery cells than to the upper end faces; and the switch is located between the busbar and the controller.

Abstract: A control module is arranged in alignment with a battery module in a longitudinal direction. The control module includes a busbar, a switch and a current sensor configured to detect electric current flowing through the busbar. The current sensor includes a magneto-electric transducer and a magnetic field suppressor. The magneto-electric transducer is configured to convert a magnetic field, which depends on the electric current flowing through the busbar and passes through the magneto-electric transducer along a plane perpendicular to a height direction, into an electrical signal. The magnetic field suppressor is configured to suppress external magnetic fields from passing through the magneto-electric transducer along the plane perpendicular to the height direction. The switch includes a pair of magnets that are magnetized and opposed to each other in a lateral direction perpendicular to both the longitudinal and height directions. The current sensor is aligned with the magnets in the longitudinal direction.

Abstract: A control module is arranged in alignment with a battery module in a longitudinal direction. The battery module includes battery cells that are aligned in the longitudinal direction and each have upper and lower end faces opposite to each other in a height direction perpendicular to the longitudinal direction. The control module includes a busbar configured to electrically connect the battery module to an electrical load, a switch configured to switch electrical connection of the busbar with the electrical load between a connected state and a disconnected state, and a controller that controls the switch. In the height direction, the busbar is located closer to the upper end faces of the battery cells than to the lower end faces; the controller is located closer to the lower end faces of the battery cells than to the upper end faces; and the switch is located between the busbar and the controller.

Abstract: A control module is arranged in alignment with a battery module in a longitudinal direction. The control module includes a busbar, a switch and a current sensor configured to detect electric current flowing through the busbar. The current sensor includes a magneto-electric transducer and a magnetic field suppressor. The magneto-electric transducer is configured to convert a magnetic field, which depends on the electric current flowing through the busbar and passes through the magneto-electric transducer along a plane perpendicular to a height direction, into an electrical signal. The magnetic field suppressor is configured to suppress external magnetic fields from passing through the magneto-electric transducer along the plane perpendicular to the height direction. The switch includes a pair of magnets that are magnetized and opposed to each other in a lateral direction perpendicular to both the longitudinal and height directions. The current sensor is aligned with the magnets in the longitudinal direction.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: An electric current sensor includes a core having a coupling portion formed by bending a part of a plate member, and one end portion and the other end portion of the plate member are disposed to oppose to each other through a constant magnetic gap on a side opposite from the coupling portion. The core has: a first tapered portion in which a width of the plate member continuously decreases from one end of the coupling portion adjacent to the one end portion to a distal end of the one end portion; and a second tapered portion in which the width of the plate member continuously decreases from an other end of the coupling portion adjacent to the other end portion to a distal end of the other end portion.

Abstract: In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10?7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Abstract: There is disclosed an image processing apparatus provided with a reader for reading an original image, a connection unit for connection with a network to which plural computers are connected, and a transfer units for transferring the image data, read by the reader, to a computer through the connection unit, the apparatus comprises a specifying unit for specifying desired one among the computers connected through the connection unit, and a designation unit for designating image reading by the reader, wherein the transfer unit is adapted to transfer the image data, read by the reader in response to the designation by the designation unit, to a computer specified by the specifying unit.

Abstract: An electric current sensor includes a core having a coupling portion formed by bending a part of a plate member, and one end portion and the other end portion of the plate member are disposed to oppose to each other through a constant magnetic gap on a side opposite from the coupling portion. The core has: a first tapered portion in which a width of the plate member continuously decreases from one end of the coupling portion adjacent to the one end portion to a distal end of the one end portion; and a second tapered portion in which the width of the plate member continuously decreases from an other end of the coupling portion adjacent to the other end portion to a distal end of the other end portion.

Abstract: In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10?7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Abstract: There is disclosed an image processing apparatus provided with a reader for reading an original image, a connection unit for connection with a network to which plural computers are connected, and a transfer units for transferring the image data, read by the reader, to a computer through the connection unit, the apparatus comprises a specifying unit for specifying desired one among the computers connected through the connection unit, and a designation unit for designating image reading by the reader, wherein the transfer unit is adapted to transfer the image data, read by the reader in response to the designation by the designation unit, to a computer specified by the specifying unit.