Patents by Inventor Takeshi Yokoyama
Takeshi Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10882504Abstract: A filter for an oil catch apparatus is provided. The oil catch apparatus is capable of efficiently extracting oil from air flowing through the oil catch apparatus while being of compact size. The filter includes a cylindrically wound main filter unit, a first keep member for keeping one end of the main filter unit, and a second keep member for keeping the other end of the main filter unit. Air flowing into the main filter unit from an opening formed in the first keep member is cleared of impurities upon passing through the main filter unit, and exits out of the main filter unit.Type: GrantFiled: October 1, 2015Date of Patent: January 5, 2021Assignee: Bendix Commerical Vehicle Systems LLCInventors: Hiroki Otsuka, Hiroki Takahashi, Takeshi Yokoyama
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Patent number: 10864628Abstract: A robot system includes a conveyor, a robot, a speed calculation circuit, and a robot control circuit. The conveyor is configured to convey a workpiece at a conveyance speed. The robot is configured to work on the workpiece while the workpiece is conveyed by the conveyor. The speed calculation circuit is configured to calculate the conveyance speed. The robot control circuit is configured to control a working speed of the robot according to the conveyance speed calculated by the speed calculation circuit.Type: GrantFiled: August 10, 2018Date of Patent: December 15, 2020Assignee: KABUSHIKI KAISHA YASHAWA DENKIInventors: Shingo Ando, Hiroshi Kumagai, Takeshi Yokoyama
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Publication number: 20200373798Abstract: The invention reduces tensile stress generated in the rotor core in a radial direction when a rotor core and a rotor support member are joined. A region in an axial direction (L) in which a melted joint portion (W2) for joining a rotor core (2) and a rotor support member (9) is formed is set as an axial joint region (JR). Among a plurality of corner portions (4c) of the permanent magnet (4), at least one corner portion (4c) that overlaps with the axial joint region (JR) when seen in a radial direction and that faces an outer peripheral surface (CP2) of the rotor core (2) is set as a specific corner portion (4s). Among facing surface portions (5p) of an inner wall portion of the magnet insertion hole (5) that face the corner portions (4c), the facing surface portion (5p) that faces the specific corner portion (4s) is set as a specific facing surface portion (5s).Type: ApplicationFiled: March 19, 2019Publication date: November 26, 2020Applicant: AISIN AW CO., LTD.Inventors: Hideharu USHIDA, Tetsuya MATSUBARA, Takeshi YOKOYAMA
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Publication number: 20200335375Abstract: Provided is an assembly jig set of semiconductor module having a plurality of semiconductor chips, the assembly jig set comprising: a first outer frame jig; and a plurality of inner piece jigs positioned by the first outer frame jig and each having a sectioned shape corresponding to the first outer frame jig, wherein one of the inner piece jigs has a plurality of opening portions for positioning the semiconductor chips. A manufacturing method of a semiconductor module using an assembly jig set is provided.Type: ApplicationFiled: February 24, 2020Publication date: October 22, 2020Inventors: Kazunaga ONISHI, Takeshi YOKOYAMA, Masaki MARUYAMA
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Publication number: 20200267845Abstract: A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.Type: ApplicationFiled: December 27, 2019Publication date: August 20, 2020Applicant: FUJI ELECTRIC CO., LTD.Inventors: Bin Wan Mat WAN AZHA, Takeshi YOKOYAMA
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Publication number: 20200194392Abstract: A semiconductor device includes: a multilayer substrate which includes a circuit board and an insulating plate on which the circuit board is formed; and a contact part having a cylindrical hollow hole therein and an open end bonded to a bonding area on the front surface of the circuit board via bonding material. In the case of this semiconductor device, wettability of a contact area of the contact part with respect to the bonding material is approximately equal to wettability of at least the bonding area of the circuit board with respect to the bonding material. Thus, the rising of the bonding material into the hollow hole of the contact part during heating performed when the contact part is bonded to the circuit board is reduced.Type: ApplicationFiled: February 25, 2020Publication date: June 18, 2020Applicant: FUJI ELECTRIC CO., LTD.Inventors: Rikihiro MARUYAMA, Masaoki MIYAKOSHI, Masayuki SOUTOME, Kazuya ADACHI, Takeshi YOKOYAMA
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Publication number: 20200082950Abstract: A reactor plant includes a reactor having a reactor core, and a steam circulation system and a bypass system, as a plurality of systems capable of circulating water carrying thermal energy generated by a nuclear fission reaction in the reactor core, and the water as the same heat medium can be circulated in the steam circulation system and the bypass system.Type: ApplicationFiled: April 24, 2019Publication date: March 12, 2020Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Ren Shimada, Hiromichi Gima, Takeshi Yokoyama, Yukinori Usui
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Publication number: 20200030194Abstract: A dental adhesive curable composition containing a polymerizable monomer including a polymerizable monomer represented by formula (1?) and defined amounts of an acidic group-containing polymerizable monomer, a polymerization initiator containing a peroxide and a photopolymerization initiator, and a reductant containing a sulfinic acid compound and/or a salt thereof, and a filler: wherein the R groups, n and m are defined. A dental adhesive curable kit and a mobile tooth fixing material are also provided.Type: ApplicationFiled: September 30, 2019Publication date: January 30, 2020Applicants: Mitsui Chemicals, Inc., Sun Medical Co., Ltd.Inventors: Kazuhiko YOSHINAGA, Yoshimitsu TANABE, Shinsuke KINOSHITA, Takenori MITAMURA, Hiroki MURAI, Takeshi YOKOYAMA, Yoshihisa KAMIMOTO, Tatsuya ORI, Hirohisa SHIMIZU, Masami ARATA, Masuji TSUCHIKAWA, Sayaka MIYAMORI, Yoshiaki KATSURA
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Publication number: 20200006921Abstract: A semiconductor laser device lases in a multiple transverse mode and includes a stacked structure where a first conductivity-side semiconductor layer, an active layer, and a second conductivity-side semiconductor layer are stacked above a substrate. The second conductivity-side semiconductor layer includes a current block layer having an opening that delimits a current injection region. Side faces as a pair are formed in portions of the stacked structure that range from part of the first conductivity-side semiconductor layer to the second conductivity-side semiconductor layer. The active layer has a second width greater than a first width of the opening. The side faces in at least part of the first conductivity-side semiconductor layer are inclined to the substrate. A maximum intensity position in a light distribution of light guided in the stacked structure, in a direction of the normal to the substrate, is within the first conductivity-side semiconductor layer.Type: ApplicationFiled: September 11, 2019Publication date: January 2, 2020Inventors: Norio IKEDO, Tougo NAKATANI, Takahiro OKAGUCHI, Takeshi YOKOYAMA, Tomohito YABUSHITA, Toru TAKAYAMA
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Patent number: 10470980Abstract: The present invention provides polymerizable monomers represented by the following general formula (1) that are useful as dental materials. In the general formula (1), Ra is a divalent C6-9 aromatic hydrocarbon group or a divalent C6-9 optionally bridged cyclic hydrocarbon group, R1 and R2 are each a hydrogen atom or a C1-3 alkyl group, R3, R4, R5 and R6 are each a hydrogen atom or a hydrocarbon group, R7 and R8 are each a hydrogen atom or a methyl group, m and n are each independently 0 to 4, and Rb and Rc are each independently a C2-6 linear alkylene or C2-6 linear oxyalkylene group optionally substituted with a C1-3 alkyl group or a (meth)acryloyloxymethylene group in place of a hydrogen atom.Type: GrantFiled: March 31, 2016Date of Patent: November 12, 2019Assignees: MITSUI CHEMICALS, INC., SUN MEDICAL CO., LTD.Inventors: Kazuhiko Yoshinaga, Yoshimitsu Tanabe, Shinsuke Kinoshita, Takenori Mitamura, Hiroki Murai, Takeshi Yokoyama, Yoshihisa Kamimoto, Tatsuya Ori, Hirohisa Shimizu, Masami Arata, Masuji Tsuchikawa, Sayaka Miyamori, Yoshiaki Katsura
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Patent number: 10434450Abstract: An oil catch apparatus is provided. The oil catch apparatus is capable of efficiently extracting oil from air flowing through the oil catch apparatus while being of compact size. A filter of the oil catch apparatus includes a cylindrically wound main filter unit and a keep member for keeping both ends of the main filter unit. Air flowing into the main filter unit is cleared of impurities upon passing through the main filter unit, and exits out of the main filter unit.Type: GrantFiled: October 1, 2015Date of Patent: October 8, 2019Assignee: Bendix Commercial Vehicle Systems LLCInventors: Hiroki Otsuka, Hiroki Takahashi, Takeshi Yokoyama
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Publication number: 20190148916Abstract: A semiconductor laser device includes: a first semiconductor layer on a first conductivity side; a second semiconductor layer on the first conductivity side; an active layer; a third semiconductor layer on a second conductivity side different from the first conductivity side; and a fourth semiconductor layer on the second conductivity side. Eg2<Eg3 is satisfied, where Eg2 and Eg3 denote maximum values of band gap energy of the second semiconductor layer and the third semiconductor layer, respectively. The third semiconductor layer includes a first region layer in which band gap energy monotonically decreases toward the fourth semiconductor layer. N2>N3 is satisfied, where N2 denotes an impurity concentration of the second semiconductor layer, and N3 denotes an impurity concentration of the third semiconductor layer.Type: ApplicationFiled: December 20, 2018Publication date: May 16, 2019Inventors: Tougo NAKATANI, Takahiro OKAGUCHI, Norio IKEDO, Takeshi YOKOYAMA, Tomohito YABUSHITA, Toru TAKAYAMA, Shoichi TAKASUKA
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Publication number: 20190131770Abstract: A semiconductor laser device includes: a first conductivity side semiconductor layer, an active layer; and a second conductivity side semiconductor layer. The second conductivity side semiconductor layer includes a first semiconductor layer and a second semiconductor layer, the first semiconductor layer being closer to the active layer than the second semiconductor layer is. The second semiconductor layer defines a width of a current injection region for injecting current into an optical waveguide. The current injection region includes a width varying region in which a width varies. S1>S2, where S1 denotes a width of the width varying region on a front end face side, and S2 denotes a width of the width varying region on a rear end face side.Type: ApplicationFiled: December 27, 2018Publication date: May 2, 2019Inventors: Norio IKEDO, Tougo NAKATANI, Takahiro OKAGUCHI, Takeshi YOKOYAMA, Tomohito YABUSHITA, Toru TAKAYAMA
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Publication number: 20190077010Abstract: A robot system includes a conveyor, a robot, a speed calculation circuit, and a robot control circuit. The conveyor is configured to convey a workpiece at a conveyance speed. The robot is configured to work on the workpiece while the workpiece is conveyed by the conveyor. The speed calculation circuit is configured to calculate the conveyance speed. The robot control circuit is configured to control a working speed of the robot according to the conveyance speed calculated by the speed calculation circuit.Type: ApplicationFiled: August 10, 2018Publication date: March 14, 2019Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Shingo ANDO, Hiroshi KUMAGAI, Takeshi YOKOYAMA
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Patent number: 10148158Abstract: A varnish impregnation apparatus that includes a support that supports a stator, in which the stator coil is mounted to the stator core, with an axial direction of the stator directed in a horizontal direction while grasping a radially outer side of the stator, and that is rotationally driven by a rotary device to rotate the stator; a varnish dropping device that drops the varnish toward a coil end portion of the stator which is rotated while being supported by the support; and a heater disposed in a cavity portion provided at an axial center of the stator core of the stator supported by the support to heat the stator from a radially inner side of the stator.Type: GrantFiled: June 11, 2014Date of Patent: December 4, 2018Assignee: AISIN AW CO., LTD.Inventors: Hideaki Kimura, Tsuyoshi Niwa, Takamitsu Sugimoto, Susumu Kato, Shigeru Maeda, Takeshi Yokoyama
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Publication number: 20180326582Abstract: A robot includes a robot body, a control processor, a detection circuit, a memory, and a determining circuit. The control processor is configured to control the robot body to perform a work on a workpiece while the workpiece is conveyed. The detection circuit is configured to detect external force which the robot body receives from the workpiece. The memory is to store a threshold force. The determining circuit is configured to determine whether the external force is equal to or larger than the threshold force.Type: ApplicationFiled: April 26, 2018Publication date: November 15, 2018Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Takeshi YOKOYAMA, Takahiko KANAMORI, Keisuke YONEHARA
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Publication number: 20180304878Abstract: A filter for an oil catch apparatus is provided. The oil catch apparatus is capable of efficiently extracting oil from air flowing through the oil catch apparatus while being of compact size. The filter includes a cylindrically wound main filter unit, a first keep member for keeping one end of the main filter unit, and a second keep member for keeping the other end of the main filter unit. Air flowing into the main filter unit from an opening formed in the first keep member is cleared of impurities upon passing through the main filter unit, and exits out of the main filter unit.Type: ApplicationFiled: October 1, 2015Publication date: October 25, 2018Applicant: Bendix Commercial Vehicle Systems LLCInventors: Hiroki OTSUKA, Hiroki TAKAHASHI, Takeshi YOKOYAMA
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Patent number: 10098254Abstract: A method of manufacturing a semiconductor device, including preparing a heat-dissipating base, performing a first initial warping or a second initial warping of the heat-dissipating base, soldering a laminated substrate, including a circuit board provided on an insulating board, on the heat-dissipating base after the first or second initial warping, and soldering a semiconductor chip on the circuit board. The first initial warping includes performing shot peening on the rear surface of the heat-dissipating base to form a hardened layer, and subsequently plating the front and rear surfaces of the heat-dissipating base, including the hardened layer formed thereon, with a metal material. The second initial warping includes plating the front and rear surfaces of the heat-dissipating base with the metal material to form a plating layer, and subsequently performing the shot peening on the rear surface of the heat-dissipating base, including the plating layer formed thereon, with the metal material.Type: GrantFiled: August 31, 2017Date of Patent: October 9, 2018Assignee: FUJI ELECTRIC CO., LTD.Inventors: Takeshi Yokoyama, Takashi Saito
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Patent number: 10027209Abstract: A method for manufacturing a stator for a rotating electrical machine by placing coils in a stator core, wherein each of a plurality of teeth formed in a radial pattern in an inner periphery of an annular yoke portion in the stator core has tip-end parallel side surfaces formed in its tip end portion having a constant width in a circumferential direction, has intermediate tilted side surfaces continuous with the tip-end parallel side surfaces and formed in its portion whose width in the circumferential direction increases closer to an outer periphery, and has base-end parallel side surfaces continuous with the intermediate tilted side surfaces and formed in its base end portion having a constant width in the circumferential direction.Type: GrantFiled: May 12, 2014Date of Patent: July 17, 2018Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Shingo Hashimoto, Takeshi Yokoyama, Hiroyuki Tanaka, Kazuya Iwatsuki, Takahiro Hashimoto, Hisao Miyata, Kirika Yoshikawa, Takanori Ota, Hirotaka Kawaura, Norihiko Akao, Tetsuya Sugimoto, Yukihiko Nakagami
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Publication number: 20180110683Abstract: The present invention provides polymerizable monomers represented by the following general formula (1) that are useful as dental materials. In the general formula (1), Ra is a divalent C6-9 aromatic hydrocarbon group or a divalent C6-9 optionally bridged cyclic hydrocarbon group, R1 and R2 are each a hydrogen atom or a C1-3 alkyl group, R3, R4, R5 and R6 are each a hydrogen atom or a hydrocarbon group, R7 and R8 are each a hydrogen atom or a methyl group, m and n are each independently 0 to 4, and Rb and Rc are each independently a C2-6 linear alkylene or C2-6 linear oxyalkylene group optionally substituted with a C1-3 alkyl group or a (meth)acryloyloxymethylene group in place of a hydrogen atom.Type: ApplicationFiled: March 31, 2016Publication date: April 26, 2018Applicants: MITSUI CHEMICALS, INC., SUN MEDICAL CO., LTD.Inventors: Kazuhiko YOSHINAGA, Yoshimitsu TANABE, Shinsuke KINOSHITA, Takenori MITAMURA, Hiroki MURAI, Takeshi YOKOYAMA, Yoshihisa KAMIMOTO, Tatsuya ORI, Hirohisa SHIMIZU, Masami ARATA, Masuji TSUCHIKAWA, Sayaka MIYAMORI, Yoshiaki KATSURA