Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.

Abstract: A manufacturing method of a stator for manufacturing a stator by mounting a concentrated winding coil wound with a square wire conductor on each of a plurality of teeth in a stator core and welding end of the concentrated winding coil to corresponding end of another concentrated winding coil, characterized in that a first set of concentrated winding coils and a second set of concentrated winding coils are mounted on the teeth, and the welding of each end in the first set of concentrated winding coils and corresponding end in the second set of concentrated winding coils is started while a third set of concentrated winding coils is mounted on the teeth.

Abstract: A method of manufacturing a semiconductor device, including preparing a heat-dissipating base, performing a first initial warping or a second initial warping of the heat-dissipating base, soldering a laminated substrate, including a circuit board provided on an insulating board, on the heat-dissipating base after the first or second initial warping, and soldering a semiconductor chip on the circuit board. The first initial warping includes performing shot peening on the rear surface of the heat-dissipating base to form a hardened layer, and subsequently plating the front and rear surfaces of the heat-dissipating base, including the hardened layer formed thereon, with a metal material. The second initial warping includes plating the front and rear surfaces of the heat-dissipating base with the metal material to form a plating layer, and subsequently performing the shot peening on the rear surface of the heat-dissipating base, including the plating layer formed thereon, with the metal material.

Abstract: An oil catch apparatus is provided. The oil catch apparatus is capable of efficiently extracting oil from air flowing through the oil catch apparatus while being of compact size. A filter of the oil catch apparatus includes a cylindrically wound main filter unit and a keep member for keeping both ends of the main filter unit. Air flowing into the main filter unit is cleared of impurities upon passing through the main filter unit, and exits out of the main filter unit.

Abstract: A resin casing is insert-molded while clamp protrusions of clamp portions formed in bonding portions of lead terminals are put between an upper mold and a lower mold. An insulating substrate which has a wiring pattern mounted with semiconductor elements is fitted into an opening portion of the resin casing and adhesively bonded to the resin casing. Electric connection between the semiconductor elements and the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and the bonding portions of the lead terminals is made by bonding wires. Thus, it is possible to provide a method for manufacturing a semiconductor device and the semiconductor device, in which stress applied to lead terminals of a lead frame formed by insert molding can be suppressed, and wire bonding properties and reliability can be improved even when the thickness of each of the lead terminals is reduced.

Abstract: A shield case 10 has, disposed upon a lateral plate 12, a first anchor part 123 for anchoring to a substrate, and a slit 127 which extends from a release edge part to a top plate 11, whereupon a leading end portion 127a thereof is formed upon the top plate 11.

Abstract: A method for manufacturing a stator for a rotating electrical machine by placing a plurality of coils in a stator core, wherein each of a plurality of teeth formed in a radial pattern in an inner periphery of an annular yoke portion in the stator core has tip-end parallel side surfaces at its tip end portion having a constant width in a circumferential direction, and has base-end tilted side surfaces in its base end portion whose width in the circumferential direction increases closer to an outer periphery.

Abstract: A varnish impregnation apparatus that includes a support that supports a stator, in which the stator coil is mounted to the stator core, with an axial direction of the stator directed in a horizontal direction while grasping a radially outer side of the stator, and that is rotationally driven by a rotary device to rotate the stator; a varnish dropping device that drops the varnish toward a coil end portion of the stator which is rotated while being supported by the support; and a heater disposed in a cavity portion provided at an axial center of the stator core of the stator supported by the support to heat the stator from a radially inner side of the stator.

Abstract: A semiconductor light emitting device includes a first conductive clad layer that is group III-V semiconductor mixed crystal, an active layer, and a second conductive clad layer. The second conductive clad layer has a laminated structure of at least three layers including a first layer, a second layer, and a third layer disposed in this order closer to the active layer. The second layer and the third layer are included in a striped ridge, and the second layer is positioned at a skirt of the ridge. The surface of the first layer is a flat part at both sides of the ridge. When Al compositions of the first layer, second layer, and third layer are X1, X2, and X3, respectively, the relation X2>X1, X3 is satisfied. When film thicknesses of the first layer, second layer, and third layer are D1, D2, and D3, the relation D2<D3 is satisfied.

Abstract: A method for manufacturing a stator for a rotating electrical machine by placing coils in a stator core, wherein each of a plurality of teeth formed in a radial pattern in an inner periphery of an annular yoke portion in the stator core has tip-end parallel side surfaces formed in its tip end portion having a constant width in a circumferential direction, has intermediate tilted side surfaces continuous with the tip-end parallel side surfaces and formed in its portion whose width in the circumferential direction increases closer to an outer periphery, and has base-end parallel side surfaces continuous with the intermediate tilted side surfaces and formed in its base end portion having a constant width in the circumferential direction.

Abstract: A manufacturing method for an electric motor rotor includes: a stacking process in which a plurality of iron core pieces are stacked to form a laminated iron core; a magnet insertion process in which a permanent magnet is inserted into a magnet insertion hole provided in the laminated iron core; a resin filling process in which the laminated iron core is heated to fill the magnet insertion hole with a molten resin for magnet fixation; and a rotary shaft assembly process in which a rotary shaft is warm-fitted into a rotary shaft insertion hole of the laminated iron core utilizing residual heat from the heating of the laminated iron core 10 in the resin filling process.

Abstract: A manufacturing method of a stator for manufacturing a stator by mounting a concentrated winding coil wound with a square wire conductor on each of a plurality of teeth in a stator core and welding end of the concentrated winding coil to corresponding end of another concentrated winding coil, characterized in that a first set of concentrated winding coils and a second set of concentrated winding coils are mounted on the teeth, and the welding of each end in the first set of concentrated winding coils and corresponding end in the second set of concentrated winding coils is started while a third set of concentrated winding coils is mounted on the teeth.

Abstract: A resin casing is insert-molded while clamp protrusions of clamp portions formed in bonding portions of lead terminals are put between an upper mold and a lower mold. An insulating substrate which has a wiring pattern mounted with semiconductor elements is fitted into an opening portion of the resin casing and adhesively bonded to the resin casing. Electric connection between the semiconductor elements and the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and the bonding portions of the lead terminals is made by bonding wires. Thus, it is possible to provide a method for manufacturing a semiconductor device and the semiconductor device, in which stress applied to lead terminals of a lead frame formed by insert molding can be suppressed, and wire bonding properties and reliability can be improved even when the thickness of each of the lead terminals is reduced.

Abstract: A fuel assembly 20 is constituted by combining a plurality of fuel rods 21, holding the fuel rods 21 by a plurality of support grids 22, and arranging a lower nozzle 24 and an upper nozzle 23 at opposite ends of the fuel rods 21. A shock-absorbing device 10 for a fuel assembly is fitted to the lower nozzle 24 and the upper nozzle 23. The shock-absorbing device 10 for a fuel assembly is constituted a nozzle support 12 fitted to a depression 24U of the lower nozzle 24 and a depression 23U of the upper nozzle 23, and a buffer 11 combined with the nozzle support 12, with stiffness thereof in a longitudinal direction of the fuel rods 21 being equal to or lower than that of the nozzle support 12.

Abstract: A shield case 10 has, disposed upon a lateral plate 12, a first anchor part 123 for anchoring to a substrate, and a slit 127 which extends from a release edge part to a top plate 11, whereupon a leading end portion 127a thereof is formed upon the top plate 11.

Abstract: A semiconductor light emitting device includes a first conductive clad layer that is group III-V semiconductor mixed crystal, an active layer, and a second conductive clad layer. The second conductive clad layer has a laminated structure of at least three layers including a first layer, a second layer, and a third layer disposed in this order closer to the active layer. The second layer and the third layer are included in a striped ridge, and the second layer is positioned at a skirt of the ridge. The surface of the first layer is a flat part at both sides of the ridge. When Al compositions of the first layer, second layer, and third layer are X1, X2, and X3, respectively, the relation X2>X1, X3 is satisfied. When film thicknesses of the first layer, second layer, and third layer are D1, D2, and D3, the relation D2<D3 is satisfied.

Abstract: A resin filling device for a laminated iron core, the resin filling device being used when a magnet insertion hole provided in the laminated iron core of a rotor for an electric motor is filled with a molten resin for fixing a magnet. The resin filing device configured with a resin feeding mold, an opposing mold, and a pressing mechanism that applies a compression force with the laminated iron core sandwiched between the resin feeding mold and the opposing mold. The resin feeding mold includes one or more discharge outlets arranged so as to face the opening of the magnet insertion hole, and configured to include a diameter reducing part in which an inner diameter is reduced gradually along a discharge direction of the molten resin. A diameter reducing part is arranged inside of the laminated iron core.

Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.

Abstract: A resin filling device for a laminated iron core, the resin filling device being used when a magnet insertion hole provided in the laminated iron core of a rotor for an electric motor is filled with a molten resin for fixing a magnet. The resin filing device configured with a resin feeding mold, an opposing mold, and a pressing mechanism that applies a compression force with the laminated iron core sandwiched between the resin feeding mold and the opposing mold. The resin feeding mold includes one or more discharge outlets arranged so as to face the opening of the magnet insertion hole, and configured to include a diameter reducing part in which an inner diameter is reduced gradually along a discharge direction of the molten resin. A diameter reducing part is arranged inside of the laminated iron core.

Abstract: A manufacturing method for an electric motor rotor includes: a stacking process in which a plurality of iron core pieces are stacked to form a laminated iron core; a magnet insertion process in which a permanent magnet is inserted into a magnet insertion hole provided in the laminated iron core; a resin filling process in which the laminated iron core is heated to fill the magnet insertion hole with a molten resin for magnet fixation; and a rotary shaft assembly process in which a rotary shaft is warm-fitted into a rotary shaft insertion hole of the laminated iron core utilizing residual heat from the heating of the laminated iron core 10 in the resin filling process.