Abstract: Provided are a thermoelectric conversion element which has a thermoelectric conversion layer made of an organic material and is capable of generating electric power at a favorable efficiency and a method for manufacturing the thermoelectric conversion element.

Abstract: A thermoelectric conversion material containing (a) a nanocarbon material and (b) a dispersing agent having an anchoring group to the nanocarbon material and a steric repulsive group and having a decomposable group between the anchoring group and the steric repulsive group, a thermoelectric conversion element manufactured using the same, a method for manufacturing the same, a dispersing agent of a nanocarbon material consisting of a polymer compound including a repeating unit represented by General Formula (1A) below and a repeating unit represented by General Formula (1B) below, and a nanocarbon material dispersion containing the same: In General Formula (1A), Ra represents an aromatic group, an alicyclic group, an alkyl group, a hydroxyl group, a thiol group, an amino group, an ammonium group, or a carboxyl group. La represents a divalent group having an acetal structure, a tertiary alkyl ester structure, or a peroxide structure. R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

Abstract: A thermoelectric conversion element having, on a base material, a first electrode, a thermoelectric conversion layer, and a second electrode, in which a thermoelectric conversion layer is formed using a thermoelectric conversion material containing (a) a carbon nanotube and (b) a dispersing agent including a repeating unit represented by Formula (1A) and a repeating unit represented by Formula (1B): In Formulas (1A) and (1B), Ra represents an aromatic, alicyclic, alkyl, hydroxyl, thiol, amino, ammonium, or carboxyl group. Rb represents a monovalent group derived from a polyalkylene oxide, poly(meth)acrylate, polysiloxane, polyacrylonitrile, or polystyrene compound, a monovalent group obtained by combining the compounds, or an alkyl group having 5 or more carbon atoms. La and Lb represent a single bond or a divalent linking group. R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X represents an oxygen atom or —NH—.

Abstract: A thermoelectric conversion material containing (a) a carbon nanotube; and (b) a dispersing agent including a repeating unit represented by General Formula (1A) below and a repeating unit represented by General Formula (1B) below: In General Formula (1A), Ra represents an electron-accepting group. La represents a single bond or a divalent linking group. R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X represents an oxygen atom or —NH—. In General Formula (1B), Rb represents a monovalent group derived from a polyalkylene oxide compound, a poly(meth)acrylate compound, a polysiloxane compound, a polyacrylonitrile compound, or a polystyrene compound, a monovalent group obtained by combining the above-described compounds, or an alkyl group having 5 or more carbon atoms. Lb represents a single bond or a divalent linking group. R and X are identical to those in General Formula (1A).

Abstract: Provided are a composition for forming a thermoelectric conversion layer, the composition having excellent thermoelectric characteristics; a thermoelectric conversion element, in which the composition is used to form a thermoelectric conversion layer; and a thermoelectric power generating component. The composition for forming a thermoelectric conversion layer includes inorganic particles having an average particle size of 1.0 ?m or less; a carrier transport material which satisfies at least one of the condition that the mobility is 0.001 cm2/Vs or more and the condition that the carrier density is 1×1010 cm?3 to 1×1021 cm?3 when the band gap of the inorganic particles is 1.5 eV or less; and a material for a thermal excitation source which is an organic material satisfying the condition that the band gap is 1.5 eV or less when the band gap of the inorganic particles is more than 1.5 eV.

Abstract: A conductive film-forming composition includes copper oxide particles (A) having an average particle size of from 10 to 500 nm; copper particles (B) having an average particle size of from 100 to 1000 nm; a polyol compound (C) having two or more hydroxy groups in a molecule thereof; and at least one kind of solvent (D) selected from the group consisting of water and a water-soluble solvent. The ratio between a total weight WA of the copper oxide particles (A) and a total weight WB of the copper particles (B), WA:WB, is in a range from 1:3 to 3:1, and the ratio between a total weight WAB of the copper oxide particles (A) and the copper particles (B) and a total weight WC of the polyol compound (C), WAB:WC, is in a range from 20:1 to 2:1.

Abstract: An ink composition includes a compound having two or more partial structures represented by the following Formula (A) in a molecule (Component a), a compound selected from the group consisting of a compound represented by the following Formula (B1) and a compound represented by the following Formula (B2) (Component b), and a color material (Component c).

Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.

Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.

Abstract: A composition including a polymer, the polymer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, a radical polymerizable group, and an ionic polar group; a method of producing a metal pattern material using the same: and a metal pattern material produced by the method.

Abstract: The present invention provides a method of forming a metal pattern and a metal pattern obtained by the method. The method includes the steps of (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly to the substrate in a pattern form, (II) adding the electroless plating catalyst or precursor thereof to the polymer layer, and (III) forming a metal layer in the pattern form by electroless plating.

Abstract: The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10?10 to 1×10?4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.

Abstract: The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, and with a compound having a non-dissociative functional group and a reactive group, the non-dissociative functional group being capable of interacting with a plating catalyst or a precursor thereof, and at least one of the polymer or the monomer having a functional group that reacts with the reactive group in the compound; forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

Abstract: The invention provides a polymer containing at least a unit represented by the following Formula (1) and a unit represented by the following Formula (2). In Formula (1) and Formula (2), R1 to R5 each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group; X, Y and Z each independently represent a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group or an ether group; and L1 and L2 each independently represent a substituted or unsubstituted divalent organic group. The invention provides a method of synthesizing embodiments of the polymer, a composition containing the polymer, and a laminate formed by applying the composition on a resin base material.

Abstract: The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, and with a compound having a non-dissociative functional group and a reactive group, the non-dissociative functional group being capable of interacting with a plating catalyst or a precursor thereof, and at least one of the polymer or the monomer having a functional group that reacts with the reactive group in the compound; forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

Abstract: A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

Abstract: The present invention provide a composition for forming a layer to be plated, including a solution in which from 1% by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-insoluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water; a method of producing a metal pattern material using the composition for forming a layer to be plated; and a metal pattern material produced by the method.

Abstract: The present invention provides a metal pattern formed on a substrate. The metal pattern is constructed in (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly to the substrate in a pattern form, (II) adding the electroless plating catalyst or precursor thereof to the polymer layer, and (III) forming a metal layer in the pattern form by electroless plating.

Abstract: The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly bonded to the base material surface and having at least a group selected from a group consisting of: a polar group; a functional group whose hydrophilicity/hydrophobicity changes, whose structure is changed into a structure that interacts with an electroless plating catalyst or a precursor thereof, or which ceases to interact with an electroless plating catalyst or a precursor thereof in response to heat, acid or radiation; and a polymerizable functional group, is generated in a pattern shape using the active site as a starting point so that a pattern is formed on the surface of the base material.

Abstract: There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof.