Abstract: An emergency notification apparatus for a vehicle includes: a receiver provided in a subject vehicle, being adapted to receive emergency information from another vehicle; a transmitter provided in the subject vehicle, being adapted to transmit the emergency information received by the receiver to a predetermined emergency information center via a base station for wireless communication; a navigation device which navigates the subject vehicle to a predetermined destination; and a controller which controls the navigation device so as to set a communicable area of the base station as the destination when the receiver receives the emergency information outside of the communicable area and controls the transmitter so as to transmit the emergency information via the base station after the subject vehicle reaches the communicable area guided by the navigation device.

Abstract: A chlorinated vinyl chloride-based resin composition in which from 2 to 9 parts by weight of an MBS resin and from 0.5 to 3 parts by weight of chlorinated polyethylene are blended to 100 parts by weight of a chlorinated vinyl chloride-based resin with a chlorine content of from 62 to 70% by weight obtained by post-chlorinating a vinyl chloride-based resin, which can provide an injection molding product such as a joint of excellent heat resistance, impact strength, moldability and surface property.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: An image sending apparatus includes an imaging device configured to capture images of a vehicle, an image recording device configured to record a plurality of image data of the images captured by the imaging device, a priority setting device configured to give a sending priority to the plurality of image data, and an image sending device configured to send the image data to an outside of the vehicle in an order according to the sending priority when a predetermined emergency condition occurs.

Abstract: Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B, 26C and 26D in the contact block 26 to coincide with the positioning marks 24MA, 24MB, 24MC and 24MD in the pitch-changing substrate 24.

Abstract: In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.

Abstract: This vehicle-occupant's status detecting device is provided in a vehicle having a running-supporting device for supporting driving operations of a vehicle-occupant in the vehicle on moving. The vehicle-occupant's status detecting device includes: a biological data detecting device having a vibration-detecting sensor which detects biological data of the vehicle-occupant; and a detection-permitting device which permits, only when the running-supporting device is in operation, the biological data detecting device to detect the biological data.

Abstract: A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: A solid polymer electrolyte film is composed of at least an ion exchange resin. The solid polymer electrolyte film of the present invention is also characterized in having beaded silica dispersed therein. The ratio of the ion exchange resin and the beaded silica (beaded silica/ion exchange resin) is about 1 to 50 wt %, for example. The preferred beaded silica has a primary particle size of 50 nm or less as measured with the help of the BET method, and has a particle size of 60 nm or more as measured with the help of dynamic light scattering.

Abstract: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes a step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and a step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: A chlorinated vinyl chloride resin composition comprising 100 parts by weight of chlorinated vinyl chloride resin and a hydroxypolycarboxylic acid salt, e.g., sodium tartrate, and/or 0.2 to 1.5 parts by weight of zeolite. The composition exhibits improved thermal stability and is particularly suited to pipe extrusion.