Abstract: A charged particle emission control technique where slow extraction of a charged particle beam from a synchrotron can be stably performed even in a state where beam adjustment has not been performed or completed. A charged particle emission control device includes a first receiver configured to receive a first detection signal obtained by detecting a current value of charged particles orbiting in a synchrotron; an arithmetic processor configured to time-differentiate the first detection signal and output a beam-intensity equivalent-value; and an emission controller configured to output a control signal for emitting a charged particle beam from the synchrotron to a beam transport system in such a manner that the beam intensity-equivalent value matches a target value.

Abstract: A solid-state imaging device includes a photoelectric conversion section which is disposed on a semiconductor substrate and which photoelectrically converts incident light into signal charges, a pixel transistor section which is disposed on the semiconductor substrate and which converts signal charges read out from the photoelectric conversion section into a voltage, and an element isolation region which is disposed on the semiconductor substrate and which isolates the photoelectric conversion section from an active region in which the pixel transistor section is disposed. The pixel transistor section includes a plurality of transistors. Among the plurality of transistors, in at least one transistor in which the gate width direction of its gate electrode is oriented toward the photoelectric conversion section, at least a photoelectric conversion section side portion of the gate electrode is disposed within and on the active region with a gate insulating film therebetween.

Abstract: There is provided an image sensor including a first substrate including a plurality of pixels and a plurality of vertical signal lines and a plurality of first wiring layers and a second substrate including a plurality of second wiring layers. The first and second substrates are secured together between the pluralities of first and second wiring layers. First pads are provided between one of the plurality of first wiring layers and one of the plurality of second wiring layers and second pads are provided between another of the plurality of first wiring layers and another of the plurality of second wiring layers. First vias and second vias connect the first pads and the one of the plurality of first wiring layers and the one of the plurality of second wiring layers together.

Abstract: The purpose of the present disclosure is to improve the dynamic range of an image sensor including a polarization pixel. The image sensor includes: a high-sensitivity pixel group; and a low-sensitivity pixel group. The high-sensitivity pixel group included in the image sensor includes a plurality of high-sensitivity pixels. The low-sensitivity pixel group included in the image sensor includes a plurality of low-sensitivity pixels. A polarization unit that causes incident light in a predetermined polarization direction to be transmitted therethrough is disposed in part of pixels of at least the high-sensitivity pixel group, of the high-sensitivity pixel group and the low-sensitivity pixel group.

Abstract: A semiconductor device including a gate electrode disposed on a semiconductor substrate and source/drain regions disposed at both sides of the gate electrode, the source/drain regions being formed by implanting impurities. The source/drain regions include an epitaxial layer formed by epitaxially growing a semiconductor material having a different lattice constant from that of the semiconductor substrate in a recessed position at a side of the gate electrode, and a diffusion layer disposed in a surface layer of the semiconductor substrate.

Abstract: To reduce the occurrence of crosstalk due to stray light. A plurality of photoelectric converters is formed on a semiconductor substrate and performs photoelectric conversion according to incident light. A light path portion includes a transparent film through which the incident light is transmitted; a light-blocking wall for each of the plurality of photoelectric converters, the light-blocking wall partitioning the transparent film in a direction perpendicular to the semiconductor substrate, and blocking light; and a light-blocking film that is arranged near an end of the light-blocking wall, the end being situated opposite to an end of the light-blocking wall that is situated closer to the semiconductor substrate, the light-blocking film having a film shape parallel to the semiconductor substrate, and including, for each of the plurality of photoelectric converters, an opening through which the incident light is transmitted.

Abstract: A container mounting structure includes a container, a container mounting portion, and a regulating section. The container has an opening, extends in one direction, and contains powder. When the container disposed at a predetermined temporarily placed position is rotated in a circumferential direction of the container, the container is mounted to the container mounting portion and the opening of the container is, with the container mounting portion, caused to be exposed. The regulating section regulates the rotation of the container in the circumferential direction in a case where the container is disposed at a position deviated from the temporarily placed position.

Abstract: A container mounting structure includes a container and a container mounting portion. The container extends in one direction and contains powder. The container is mounted to the container mounting portion by rotating the container disposed at a temporarily placed position in a circumferential direction of the container. In a state in which the container is mounted to the container mounting portion, the container mounting structure has contact sections where the container is in contact with the container mounting portion in a radial direction of the container. Each of the contact sections is disposed at corresponding one of at least three different positions in the circumferential direction. The container is in contact with the container mounting portion from inside in the radial direction at one subset of the contact sections and from outside in the radial direction at another subset of the contact sections.

Abstract: A rotating device includes a body having a bottom wall extending in one direction; a holding object including a rotating portion extending in the one direction and a supporting portion supporting the rotating portion at one end of the rotating portion in the one direction such that the rotating portion is rotatable on an axis extending in the one direction, the holding object being provided on the bottom wall; a first holding portion provided on the body and holding the supporting portion of the holding object at one end of the supporting portion in the one direction; a second holding portion provided on the body and holding the supporting portion of the holding object at an other end of the supporting portion in the one direction; and a transmitting portion provided on the body and transmitting a rotational force to the rotating portion of the holding object.

Abstract: A container mounting structure includes a container, a container mounting portion, and a regulating section. The container has an opening, extends in one direction, and contains powder. When the container disposed at a predetermined temporarily placed position is rotated in a circumferential direction of the container, the container is mounted to the container mounting portion and the opening of the container is, with the container mounting portion, caused to be exposed. The regulating section regulates the rotation of the container in the circumferential direction in a case where the container is disposed at a position deviated from the temporarily placed position.

Abstract: A rotating device includes a body having a bottom wall extending in one direction; a holding object including a rotating portion extending in the one direction and a supporting portion supporting the rotating portion at one end of the rotating portion in the one direction such that the rotating portion is rotatable on an axis extending in the one direction, the holding object being provided on the bottom wall; a first holding portion provided on the body and holding the supporting portion of the holding object at one end of the supporting portion in the one direction; a second holding portion provided on the body and holding the supporting portion of the holding object at an other end of the supporting portion in the one direction; and a transmitting portion provided on the body and transmitting a rotational force to the rotating portion of the holding object.

Abstract: A container includes a container body, an opening/closing member, and a suppressing portion. The container body has a circumferential surface and has an opening in the circumferential surface through which powder contained in the container body is discharged to outside of the container body. The opening/closing member has an inner circumferential surface. The opening/closing member is mounted to the container body, and is moved, when the container body is relatively rotated to one side in a circumferential direction of the container body, from a closed position to an open position The opening/closing member is moved, when the container body is relatively rotated to another side in the circumferential direction, from the open position to the closed position. The suppressing portion is formed in the inner circumferential surface of the opening/closing member. The suppressing portion suppresses leakage of the powder from the opening/closing member to outside of the opening/closing member.

Abstract: A container mounting structure includes a container and a container mounting portion. The container extends in one direction and contains powder. The container is mounted to the container mounting portion by rotating the container disposed at a temporarily placed position in a circumferential direction of the container. In a state in which the container is mounted to the container mounting portion, the container mounting structure has contact sections where the container is in contact with the container mounting portion in a radial direction of the container. Each of the contact sections is disposed at corresponding one of at least three different positions in the circumferential direction. The container is in contact with the container mounting portion from inside in the radial direction at one subset of the contact sections and from outside in the radial direction at another subset of the contact sections.

Abstract: A container includes a container body, an opening/closing member, and a suppressing portion. The container body has a circumferential surface, and has an opening in the circumferential surface through which powder contained in the container body is discharged to outside of the container body. The opening/closing member has an inner circumferential surface. The opening/closing member is mounted to the container body, and is moved, when the container body is relatively rotated to one side in a circumferential direction of the container body, from a closed position to an open position. The opening/closing member is moved, when the container body is relatively rotated to another side in the circumferential direction, from the open position to the closed position. The suppressing portion is formed in the inner circumferential surface of the opening/closing member. The suppressing portion suppresses leakage of the powder from the opening/closing member to outside of the opening/closing member.

Abstract: Disclosed is a solid-state imaging device which includes a pixel section, a peripheral circuit section, a first isolation region formed with a STI structure on a semiconductor substrate in the peripheral circuit section, and a second isolation region formed with the STI structure on the semiconductor substrate in the pixel section. The portion of the second isolation region buried into the semiconductor substrate is shallower than the portion buried into the semiconductor substrate of the first isolation region, and the height of the upper face of the second isolation region is equal to that of the first isolation region. A method of producing the solid-state imaging device and an electronic device provided with the solid-state imaging devices are also disclosed.

Abstract: A solid-state imaging device includes, in a semiconductor substrate, a pixel portion provided with a photoelectric conversion portion, which photoelectrically converts incident light to obtain an electric signal and a peripheral circuit portion disposed on the periphery of the pixel portion, wherein a gate insulating film of aMOS transistor in the peripheral circuit portion is composed of a silicon oxynitride film, a gate insulating film of aMOS transistor in the pixel portion is composed of a silicon oxynitride film, and an oxide film is disposed just above the photoelectric conversion portion in the pixel portion.