Abstract: The present invention provides a release film having good releasability such that a release force is light, and also suppresses silicone transfer from the film surface. The present invention relates to a release film having a surface layer on a substrate layer, in which a main component of the surface layer is a resin component, the resin component contains a modified acrylic-based resin having a polysiloxane component, and a relationship between a ratio MT of a content of silicon to a content of all elements existing on an outermost surface of the surface layer and a ratio MB of a content of silicon to a content of all elements existing at a position in a depth of 10 nm from the outermost surface of the surface layer vertically toward the substrate layer satisfies (i) 5?MT/MB?30 or (ii) MB=0, and 8.5?MT?30.

Abstract: The present invention provides a release film having good releasability such that a release force is light, and also suppresses silicone transfer from the film surface. The present invention relates to a release film having a surface layer on a substrate layer, in which a main component of the surface layer is a resin component, the resin component contains a modified acrylic-based resin having a polysiloxane component, and a relationship between a ratio MT of a content of silicon to a content of all elements existing on an outermost surface of the surface layer and a ratio MB of a content of silicon to a content of all elements existing at a position in a depth of 10 nm from the outermost surface of the surface layer vertically toward the substrate layer satisfies (i) 5?MT/MB?30 or (ii) MB=0, and 8.5?MT?30.

Abstract: A band-pass filter includes a photonic crystal having a local mode that generates a pass band in a stop band formed by Bragg reflection, a transmission channel that limits electromagnetic waves propagating in the photonic crystal to a mode in which an amplitude direction of an electrical field is a particular direction; and a magnetic field-applying unit for applying to the photonic crystal a DC magnetic field in a direction perpendicular to a propagation direction of the electromagnetic waves. The photonic crystal includes a periodic structure including a low permittivity dielectric member and a plurality of high permittivity dielectric members periodically arranged in the low permittivity dielectric member so that the Bragg reflection occurs in the periodic structure, and a magnetic member disposed in the periodic structure.

Abstract: A three-dimensional component having cavities containing a photocurable resin material and having a structure in which a plurality of cured resin layers composed of the photo-cured resin material are stacked, is manufactured by stereolithography. Inorganic members are inserted into concave portions when the concave portions are formed before covering the cavities, each of the concave portions being at least a portion of the corresponding cavity, and the photocurable resin material remaining. When the three-dimensional component is completed, the photocurable resin material remaining in the cavity is thermally cured, thus being brought into contact with the inorganic members. In this manner, a three-dimensional photonic structure having the plurality of inorganic members precisely disposed at desired periodic positions within the resin matrix is efficiently manufactured.

Abstract: A band-pass filter includes a photonic crystal having a local mode that generates a pass band in a stop band formed by Bragg reflection, a transmission channel that limits electromagnetic waves propagating in the photonic crystal to a mode in which an amplitude direction of an electrical field is a particular direction; and a magnetic field-applying unit for applying to the photonic crystal a DC magnetic field in a direction perpendicular to a propagation direction of the electromagnetic waves. The photonic crystal includes a periodic structure including a low permittivity dielectric member and a plurality of high permittivity dielectric members periodically arranged in the low permittivity dielectric member so that the Bragg reflection occurs in the periodic structure, and a magnetic member disposed in the periodic structure.

Abstract: Photonic crystal units (10a, 10b, and 10c) are formed by an optical molding process using a photocurable resin, and partitions (11) are provided at the boundaries therebetween. The voids in each photonic crystal unit are filled with a second substance containing ceramic particles dispersed therein to form a filled portion 2. A plurality of three-dimensional periodic structure units containing the first and second substances distributed with three-dimensional periodicity are arranged so as to have different ratios between the dielectric constants of the first and second substances. Therefore, present invention provides a three-dimensional periodic structure having a wide photonic band gap which could not be obtained in a conventional three-dimensional periodic structure.

Abstract: Photonic crystal units (10a, 10b, and 10c) are formed by an optical molding process using a photocurable resin, and partitions (11) are provided at the boundaries therebetween. The voids in each photonic crystal unit are filled with a second substance containing ceramic particles dispersed therein to form a filled portion 2. A plurality of three-dimensional periodic structure units containing the first and second substances distributed with three-dimensional periodicity are arranged so as to have different ratios between the dielectric constants of the first and second substances. Therefore, present invention provides a three-dimensional periodic structure having a wide photonic band gap which could not be obtained in a conventional three-dimensional periodic structure.

Abstract: A three-dimensional component having cavities containing a photocurable resin material and having a structure in which a plurality of cured resin layers composed of the photo-cured resin material are stacked, is manufactured by stereolithography. Inorganic members are inserted into concave portions when the concave portions are formed before covering the cavities, each of the concave portions being at least portion of the corresponding cavity, and the photocurable resin material remaining. When the three-dimensional component is completed, the photocurable resin material remaining in the cavity is thermally cured, thus being brought into contact with the inorganic members. In this manner, a three-dimensional photonic structure having the plurality of inorganic members precisely disposed at desired periodic positions within the resin matrix is efficiently manufactured.

Abstract: There is provided a three dimensional periodic structure comprising two substances having different dielectric constants with a high contrast between the dielectric constants or refractive indexes, periodically distributed in a three dimensional space. A unit cell substrate having air holes in a diamond structure is formed by a stereo lithography method which repeats the step of irradiating light onto a liquid surface of a light-hardening resin such as a photosensitive epoxy resin in each layer in a cross-sectional pattern to be formed. Then, a conductive film made of, for example, Cu is formed by an electroless plating method on the surface of the unit cell substrate. Thus, a three dimensional periodic structure comprising two substances having different dielectric constants, i.e., resin and air, periodically distributed in a three dimensional space, and comprising a conductive film formed at an interface between the two substances is obtained.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Abstract: A ceramic electronic component includes a ceramic electronic component body having two end faces opposing each other, side faces connecting the two end faces, and terminal electrodes formed on each end face; and terminal members, each including a metal being soldered to one of the terminal electrodes. Each of the terminal electrodes includes a metal layer formed only on the end face, a conductive resin layer formed on the metal layer, the conductive resin layer including metal powder and resin, and a plating film on the conductive resin layer.

Abstract: A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 &mgr;m.

Abstract: A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Abstract: In a mounting structure for a ceramic electronic part in which a terminal member formed of a metal plate is connected to a terminal formed on a ceramic electronic component, thermal effects caused by a substrate are to be suppressed to prevent mechanical damage to the ceramic electronic component, such as cracking. For this purpose, a length of an intermediate portion between the ceramic electronic component and the substrate, measured along the length of the terminal member, is at least 5 mm.

Abstract: A projection 23 is formed on a connecting terminal part 22 opposing to a side surface 16 of a ceramic electronic component main body 12 in a terminal member 19 by processing the metal plate which provides this terminal member 19. This projection 23 is made to project toward the side surface 16 of the ceramic electronic component main body 12. The interval more than the predetermined dimension is reliably formed between the connecting terminal part 22 and the side surface 16 of the ceramic electronic component main body 12 by the projection 23. This prevents the solder from reaching even to the ceramic electronic component main body 12.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a U shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: Disclosed herein is a method of preparing an InSb thin film, which comprises a step of physically sticking InSb powder onto a major surface of a substrate, and a step of depositing an InSb thin film on the major surface of the substrate provided with the as-stuck InSb powder by a method such as vacuum evaporation.

Abstract: First, an aqueous solution of water soluble compounds or an aqueous solution of water soluble complexes, which is a salt of elements belonging to the 6A, 7A, 1B, 2B, 3B, 4B, 5B, 6B, or 8 group in a periodic table are prepared. The pH of the aqueous solution is adjusted and titanium trichloride is added thereto. The aqueous solution provided with titanium trichloride is stirred at temperature below the boiling point of the solution under atmospheric pressure or under high pressure. Then, by the reducing action of the titanium trichloride, a fine titanium-free powder selected from the group consisting of a metal powder, an alloy powder containing two or more of metals and non-metals, or a compound powder containing two or more of metals and non-metals is obtained.

Abstract: A magnetoresistance element includes an insulating substrate, a patterned magnetoresistance film of a ferromagnetic material deposited thereon and having a uniaxis magnetic anisotropy, and a patterned hard biasing layer of a ferromagnetic material deposited on the substrate. The biasing layer is divided into two parts on both sides of the magnetoresistance layer and magnetized in the direction parallel to a line which intersects the easy direction of magnetization of the patterned magnetoresistance layer at an acute angle (.theta.).