Abstract: A panel glass wherein a surface treating film is formed on a substrate glass so that overall transmittance distribution within an effective picture plane satisfies a specific mathematical expression, whereby, even with a flattened panel glass, a uniform-brightness image can be observed with a good contrast, and occurrence of a double image is suppressed; and a CRT.

Abstract: A panel glass wherein a surface treating film is formed on a substrate glass so that overall transmittance distribution within an effective picture plane satisfies a specific mathematical expression, whereby, even with a flattened panel glass, a uniform-brightness image can be observed with a good contrast, and occurrence of a double image is suppressed; and a CRT.

Abstract: A protective plate for a plasma display comprises conductive substrate for protecting a plasma display and an electrode in electrical contact with the conductive substrate.

Abstract: A CRT panel glass and a CRT wherein a surface treating film is formed on an outer surface of a CRT panel so that overall transmittance distribution and reflectance distribution within an effective picture plane satisfy specific mathematical expressions, whereby, even with a flattened panel glass, brightness and contrast are uniform over the entire surface of the image display plane, and their production method.

Abstract: A CRT panel glass and a CRT wherein a surface treating film is formed on an outer surface of a CRT panel so that overall transmittance distribution and reflectance distribution within an effective picture plane satisfy specific mathematical expressions, whereby, even with a flattened panel glass, brightness and contrast are uniform over the entire surface of the image display plane, and their production method.

Abstract: A method for producing a transparent conductive film composed mainly of an oxide by sputtering using a sputtering target capable of forming a transparent conductive film, wherein intermittent electric power is supplied to the target.

Abstract: A protective plate for a plasma display includes conductive substrate for protecting a plasma display and an electrode in electrical contact with the conductive substrate.

Abstract: A light absorptive antireflector provided with a titanium oxy-nitride film having a geometrical film thickness of from 5 to 25 nm, wherein O/Ti (atomic ratio)=0.11 to 0.33, and a film composed mainly of silica and having a geometrical film thickness of from 70 to 130 nm, and a process for its production.

Abstract: A sputtering target comprising a substrate and a target material formed on the substrate, wherein the target material comprises a metal oxide of the chemical formula MOx as the main component, wherein MOx is a metal oxide which is deficient in oxygen as compared with the stoichiometric composition, and M is at least one metal selected from the group consisting of Ti, Nb, Ta, Mo, W, Zr and Hf, a process for its production, and a method for forming a film having a high refractive index.

Abstract: A light absorptive antireflector comprising a substrate, and a first layer of a light absorptive film, a second layer made of a material which has slight absorption within a visible light region and a third layer made of a material which has a refractive index smaller than 1.55, sequentially formed on the substrate, which has an adequate low reflection performance within a wide range of a wavelength region and which has an electromagnetic shielding ability and a low luminous transmittance suitable for improving the contrast of a display, has freeness in transmittance and reflection color and is excellent also in the productivity, and a method for its production.

Abstract: A sputtering target comprising a substrate and a target material formed on the substrate, wherein the target material comprises a metal oxide of the chemical formula MOx as the main component, wherein MOx is a metal oxide which is deficient in oxygen as compared with the stoichiometric composition, and M is at least one metal selected from the group consisting of Ti, Nb, Ta, Mo, W, Zr and Hf, a process for its production, and a method for forming a film having a high refractive index.

Abstract: A sputtering target comprising a substrate and a target material formed on the substrate, wherein the target material comprises a metal oxide of the chemical formula MOx as the main component, wherein MOx is a metal oxide which is deficient in oxygen as compared with the stoichiometric composition, and M is at least one metal selected from the group consisting of Ti, Nb, Ta, Mo, W Zr and Hf, a process for its production, and a method for forming a film having a high refractive index.

Abstract: A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 .mu.s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.

Abstract: An organic substrate provided with a light absorptive antireflection film, which contains an organic substrate, and a light absorbing film and a low refractive index film formed in this order on the substrate, to reduce reflection of incident light from the low refractive index film side, wherein the organic substrate has its surface plasma-treated, and a layer made essentially of at least one member selected from the group consisting of silicon, a silicon nitride, a silicon oxide and a silicon oxy-nitride, is formed between the plasma-treated substrate surface and the light absorbing film.

Abstract: A light absorptive antireflector comprising a substrate, a light absorbing film formed on the substrate and a silica film formed on the light absorbing film, to reduce reflection of incident light from the silica film side, wherein the geometrical film thickness of the light absorbing film is from 5 to 25 nm, and the geometrical film thickness of the silica film is from 70 to 110 nm.

Abstract: The present invention relates to a film comprising silicon dioxide as the main component, which contains Zr, etc., and a method for forming it by reactive DC sputtering. It makes it possible to form reflection preventive films, alkali barrier films and various multi-layered films such as multi-layered films for anti-iridescent glass, which contain said film comprising silicon dioxide as the main component, by a physical vapor deposition method without breaking a vacuum.

Abstract: A light absorptive antireflector comprising a substrate, a light absorbing film formed on the substrate and a silica film formed on the light absorbing film, to reduce reflection of incident light from the silica film side, wherein the geometrical film thickness of the light absorbing film is from 5 to 25 nm, and the geometrical film thickness of the silica film is from 70 to 110 nm.

Abstract: A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 .mu.s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.

Abstract: The present invention relates to a film comprising silicon dioxide as the main component, which contains Zr, etc., and a method for forming it by reactive DC sputtering. It makes it possible to form reflection preventive films, alkali barrier films and various multi-layered films such as multi-layered films for anti-iridescent glass, which contain said film comprising silicon dioxide as the main component, by a physical vapor deposition method without breaking a vacuum.

Abstract: A non-iridescent transparent product comprising a transparent substrate, a transparent film having a refractive index of at least 1.6 and a thickness of at least 0.15 .mu.m formed on the substrate, and an underlying layer formed at the boundary between the substrate and the film, wherein the underlying layer is an absorbing layer with an extinction coefficient k being not 0.