Abstract: A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.

Abstract: An information processing apparatus includes a processor configured to convert, using a conversion rule prescribing an association between order reception information on an article and manufacturing information used by each of plural manufacturers manufacturing the article in accordance with the order reception information on the article, the order reception information into the manufacturing information used by a designated manufacturer that is requested to manufacture the article.

Abstract: An optical device includes a support portion, a first movable portion having an optical surface, a second movable portion having a frame shape and surrounding the first movable portion, a first coupling portion coupling the first movable portion and the second movable portion to each other, a second coupling portion coupling the second movable portion and the support portion to each other, and a softening member which has a softening characteristic and to which stress is applied when the first movable portion swings around a first axis. When viewed in a direction perpendicular to the optical surface, the softening member is provided to a portion of the second movable portion, the portion extending between a drive element and the first coupling portion, and is not electrically connected to an outside.

Abstract: Provided is a decoding device including a decoding unit configured to decode a plurality of pieces of encoded data on the basis of encoding method information that has been received, received bitstream data including the plurality of pieces of encoded data in which a plurality of segments of a tactile signal has been respectively encoded, in which the encoding method information includes information indicating in which encoding method of a plurality of encoding methods the respective segments of the tactile signal have been encoded, the plurality of encoding methods includes a simple tactile encoding method corresponding to a simple tactile signal related to a beginning segment of the tactile signal, the plurality of pieces of encoded data includes simple tactile encoded data in which the simple tactile signal has been encoded in the simple tactile encoding method, and the decoding unit decodes the simple tactile encoded data, in a case where the encoding method information indicates the simple tactile encodi

Abstract: An actuator device includes a support part, a first movable part, and a second movable part. The second movable part includes a pair of first connection portions positioned on both sides of the first movable part on a first axis and connected to a pair of first connecting parts, a pair of second connection portions positioned on both sides of the first movable part on a second axis and connected to a pair of second connecting parts, and a pair of first portions. One of the first portions is connected to one of the first connection portions and one of the second connection portions and extends in a inclined direction, and the other of the first portions is connected to the other of the first connection portions and the one of the second connection portions and extends in a inclined direction.

Abstract: According to one embodiment, a flexure for use in a suspension assembly includes: a supporting plate; a wiring member including a metal plate and a wiring substrate placed on the metal plate and has a tip-side portion placed on the supporting plate, a base end-side portion extending to an outside of the supporting plate, and a first end provided at an extension end of the base end-side portion; and a piezoelectric element mounted on the wiring member. The wiring substrate includes an insulating layer and a conductive layer stacked on the insulating layer, the conductive layer having a plurality of connecting pads including a ground pad to which a ground electrode of the piezoelectric element is connected, a plurality of connecting terminals provided at the first end and including a ground terminal, and a plurality of traces including a ground trace connecting the ground pad and the ground terminal.

Abstract: A cooling efficiency is increased. An inkjet head is provided with a head main body for jetting ink, a cooling pipe which has corrosion resistance to the ink, and through which the ink for cooling a drive circuit passes, and a cooling member which has higher thermal conductivity than that of the cooling pipe, in which at least a part of the cooling pipe is embedded, and which has recessed parts in at least a part of a portion surrounding the cooling pipe.

Abstract: This composition for the oral cavity contains an amino acid and a specific sugar. The specific sugar is at least one selected from lactose, 2?-fucosyllactose, galactose, raffinose, and a galactooligosaccharide.

Abstract: According to one embodiment, a silicon carbide semiconductor device includes a first electrode, a second electrode, a first semiconductor layer, a plurality of first semiconductor pillar regions of a first conductivity type, a second semiconductor pillar region of a second conductivity type. The first semiconductor pillar regions include a first region has a first impurity concentration and second region has a second impurity concentration higher than the first impurity concentration. The second semiconductor pillar regions include a third region has a third impurity concentration and a fourth region has a fourth impurity concentration higher than the third impurity concentration.

Abstract: According to one embodiment, a method for manufacturing a silicon carbide semiconductor device. The method includes forming a semiconductor layer on a substrate. The method includes forming a first semiconductor region by implanting an impurity of a first conductivity type into the semiconductor layer. The first semiconductor region has a first concentration of the first conductivity type. The method includes forming a first semiconductor pillar portion and a second semiconductor pillar portion by implanting an impurity of a second conductivity type into a plurality of locations of the first semiconductor region. The first semiconductor pillar portion is of the first conductivity type. The second semiconductor pillar portion has a second concentration of the second conductivity type and is adjacent to the first semiconductor pillar portion. The method includes repeating the forming of the semiconductor layer, forming of the first semiconductor region, and the first and second semiconductor pillar portions.

Abstract: A semiconductor device includes a first electrode, a first semiconductor layer of a first conductivity type on the first electrode, a first pillar of a second conductivity type on the first semiconductor layer, the first pillar having a first average concentration of impurities, a second pillar of the first conductivity type on the first semiconductor layer, and including a first layer having a second average concentration of impurities lower than the first average concentration, and a second layer having a third average concentration of impurities higher than the first average concentration, a second semiconductor layer of the second conductivity type on the second pillar, a third semiconductor layer of the first conductivity type on the second semiconductor layer, a second electrode connected to the first pillar and the third semiconductor layer, a third electrode, and an insulating film disposed between the second semiconductor layer and the third electrode.

Abstract: A semiconductor device includes a semiconductor part including a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type. The second semiconductor layer is provided in the first semiconductor layer. The semiconductor part includes first and second interfaces of the first semiconductor layer and the second semiconductor layer. The first interface intersects the second interface. The second semiconductor layer includes a plurality of sub-layers stacked in a direction orthogonal to the first interface. The second interface includes interfaces of the sub-layers of the second semiconductor layer and the first semiconductor layer. The second interface extending in a second direction inclined with respect to a first direction orthogonal to the first interface.

Abstract: A semiconductor device of embodiments includes a silicon carbide layer having a first face and a second face, a gate electrode, a gate insulating layer on the first face. The silicon carbide layer includes a first silicon carbide region of a first conductive type; a second silicon carbide region of a second conductive type disposed between the first silicon carbide region and the first face; a third silicon carbide region of a second conductive type between the first silicon carbide region and the first face; a fourth silicon carbide region; a fifth silicon carbide region; a sixth silicon carbide region of a second conductive type between the first silicon carbide region and the first face and between the second silicon carbide region and the third silicon carbide region; and a crystal defect. The crystal defect is in the sixth silicon carbide region.

Abstract: A semiconductor device of embodiments includes a silicon carbide layer including an element region and a termination region around the element region, the termination region having first straight-line portions extending in a first direction, second straight-line portions extending in a second direction, and corner portions between the first straight-line portions and the second straight-line portions, the termination region including a second-conductivity-type second silicon carbide region having a dot-line shape with first dot portions and first space portions surrounding the element region, an occupation ratio of the first dot portions is larger in the corner portions than in the first straight-line portions, and a second-conductivity-type third silicon carbide region having a dot-line shape with second dot portions and second space portions surrounding the second silicon carbide region, an occupation ratio of the second dot portions is lager in the corner portions than in the first straight-line portions.

Abstract: An information processing apparatus according to the present application includes an acquisition unit, a determination unit, and an appliance control unit. The acquisition unit acquires recipe information which is information regarding cooking performed by the user. Based on the recipe information acquired by the acquisition unit, the determination unit determines a non-cooking appliance that is an appliance used by the user and is not used for cooking to be an appliance being a control target. The appliance control unit controls the non-cooking appliance determined by the determination unit at a timing before a predetermined process based on a predetermined condition.

Abstract: A printing management apparatus includes a processor configured to acquire an order quantity being a quantity of paper required for printing, acquire a stock quantity for each attribute of paper, the stock quantity being a quantity of paper having at least one or more attributes in common with attributes of the paper which is required for the printing and is in stock by a printer, and, when the order quantity is greater than the stock quantity and a sum of at least two stock quantities is equal to or greater than the order quantity, display the printer as a printer capable of accepting an order.

Abstract: A printing management apparatus includes a processor configured to acquire an order quantity being a quantity of paper required for printing, acquire a stock quantity for each attribute of paper, the stock quantity being a quantity of paper having at least one or more attributes in common with attributes of the paper which is required for the printing and is in stock by a printer, and, when the order quantity is greater than the stock quantity and a sum of at least two stock quantities is equal to or greater than the order quantity, display the printer as a printer capable of accepting an order.

Abstract: A heat shield component includes a substrate, and a heat shield film arranged on the substrate. The heat shield film includes a first layer arranged on the substrate, including pores, and having a thermal conductivity of 0.3 W/(m·K) or less and a volumetric specific heat of 1200 kJ/(m3·K) or less, and a second layer arranged on the first layer to provide closed pores between the first layer and the second layer. The heat shield film has a surface roughness on a top surface which is 1.5 ?m Ra or less. The heat shield component can achieve high heat-insulating properties and an improved effect of reducing the emission amount of hydrocarbon in an internal combustion engine, for example.

Abstract: A printing management apparatus includes a processor configured to acquire an order quantity being a quantity of paper required for printing, acquire a stock quantity for each attribute of paper, the stock quantity being a quantity of paper having at least one or more attributes in common with attributes of the paper which is required for the printing and is in stock by a printer, and, when the order quantity is greater than the stock quantity and a sum of at least two stock quantities is equal to or greater than the order quantity, display the printer as a printer capable of accepting an order.

Abstract: An information processing apparatus includes a processor configured to: acquire an ordering condition for each of plural outsourcing patterns from an ordering company that places an order in a case where the ordering company outsources at least a part of the order; acquire order receiving conditions presented by plural order receiving companies that are candidates for an outsourcee; and perform control for displaying, for each of the plural outsourcing patterns, information on an order receiving company that presents an order receiving condition meeting the ordering condition for the outsourcing pattern and information on a profit which the ordering company is supposed to get when outsourcing the at least the part of the order to the order receiving company.