Abstract: The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

Abstract: The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

Abstract: An adhesive sheet having high adhesion and removability, low metal corrosion, small outgas generation, and particularly suitable for adherence to an electronic part, which sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive forming the adhesive layer includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.5% by mass of a functional group-containing unsaturated monomer; and a ratio M2/M1 of the mole number (M2) of isocyanate groups in the component (D) to the mole number (M1) of functional groups in the component (C) is 1.5 to 15.0.

Abstract: An adhesive sheet having high adhesion and removability, low metal corrosion, small outgas generation, and particularly suitable for adherence to an electronic part, which sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive forming the adhesive layer includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.5% by mass of a functional group-containing unsaturated monomer; and a ratio M2/M1 of the mole number (M2) of isocyanate groups in the component (D) to the mole number (M1) of functional groups in the component (C) is 1.5 to 15.0.

Abstract: Provided is a transparent protective sheet (10) including a supporting base sheet (11), and a thermally fusible resin layer (12) that is laminated on at least one surface (11a) of the supporting base sheet (11). The thermally fusible resin layer (12) is formed from a copolymer obtained by polymerizing ethylene and an unsaturated carboxylic acid as essential components, and a content ratio of a constituent unit derived from the unsaturated carboxylic acid is 5 to 30% by mass. According to the invention, a transparent protective sheet of which the transparency does not deteriorate due to a heating treatment, and a solar cell module using the transparent protective sheet are provided.

Abstract: Disclosed herein is a release sheet including: a base material; and a release agent layer provided on the base material, wherein the release agent layer is formed by curing a material mainly constituted of a diene-based polymer and contains substantially no silicone compound, and wherein Mooney viscosity (ML1+4 (100° C.)) of the diene-based polymer before curing which is measured according to JIS K6300 at a temperature of 100° C. is in the range of 40 to 70. It is preferred that the material before curing is mainly constituted of one or two or more diene-based polymers having a cis-1,4 bond content of 90 to 99%.

Abstract: There is provided an adhesive sheet comprising an adhesive base sheet, an adhesive layer, and a release sheet laminated in sequence from the adhesive base sheet. The release sheet comprises a release agent layer and a release base material laminated in sequence from the adhesive layer. A release force between the release sheet and the adhesive layer is decreased by an external stimulus.

Abstract: Provided is an adhesive sheet, which has a high adhesion and removability, corrodes a metal to a low degree, generates small amount of outgases, and is particularly suitable as an adhesive sheet for being adhered to an electronic part. The adhesive sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive of which the adhesive layer is formed includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.

Abstract: A process for making a release sheet which is non-silicone based and has good releasability from a pressure sensitive adhesive layer and which makes it possible to form a release agent layer at low temperature, having solvent resistance. The process comprises coating a substrate film with a release agent liquid, drying, and curing, to give a release agent layer, wherein the release agent layer is a cured layer obtained by irradiating a diene base polymer containing an intermolecular cleavage photopolymerization initiator with an active energy beam.

Abstract: A pressure-sensitive adhesive article 100 includes a release sheet 1 constituted from a releasing agent layer 11 and a base material 12, and a pressure-sensitive adhesive sheet 2 constituted from a pressure-sensitive adhesive layer 21 and a pressure-sensitive adhesive sheet base 22. Such a pressure-sensitive adhesive article 100 has a structure in which the pressure-sensitive adhesive sheet 2 is laminated on the release sheet 1 so that the pressure-sensitive adhesive layer 21 is in contact with the releasing agent layer 11. The releasing agent layer 11 is composed of a material containing substantially no silicone compound. The releasing agent layer 11 is mainly composed of an elastomer and has a Young's modulus of 1.5 GPa or less. Preferred examples of the elastomer include polybutadiene rubber (especially, 1,4-polybutadiene rubber), polyisoprene rubber, and ethylene propylene rubber. The release sheet 1 has excellent releasability and has little adverse effect on electric components and the like.

Abstract: A double-faced pressure-sensitive adhesive sheet used for electronic components is provided. The double-faced pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer; a first release sheet including at least a first release agent layer attached to one surface of the pressure-sensitive adhesive layer; and a second release sheet including at least a second release agent layer attached to the other surface of the pressure-sensitive adhesive layer. The first release agent layer is mainly constituted of an olefin-based resin and the second release agent layer is mainly constituted of a diene-based polymer material. When an peeling force of the first release sheet with respect to the pressure-sensitive adhesive layer is defined as “X” [mN/20 mm] and an peeling force of the second release sheet with respect to the pressure-sensitive adhesive layer is defined as “Y” [mN/20 mm], the following relation is satisfied: Y?X?50.

Abstract: Provided is a release sheet which is non-silicone-based and has a good releasability from a layer of a pressure sensitive adhesive and which has a stable antistatic property without being influenced by the air environment and is free of bleeding out of ionic substances derived from an antistatic agent. The release sheet is prepared by providing an undercoat layer containing a polyurethane-based resin and 0.1 to 45% by mass of a lithium salt-based antistatic agent and a layer of a rubber-based release agent formed by coating and drying a liquid containing a release agent in order on a substrate.

Abstract: The pressure sensitive adhesive sheet of the present invention is characterized by a pressure sensitive adhesive sheet in which a pressure sensitive adhesive layer is formed on at least one surface of a base material and in which a surface of the above pressure sensitive adhesive layer at a side opposite to the base material is brought into contact with a release agent layer, wherein the pressure sensitive adhesive layer and the release agent layer do not substantially contain a silicone-based compound, and the pressure sensitive adhesive layer contains an antioxidant. It has a good releasing performance from the release agent layer and is excellent in a releasing stability after ageing.

Abstract: Disclosed herein is a release sheet including: a base material; and a release agent layer provided on the base material, wherein the release agent layer is formed by curing a material mainly constituted of a diene-based polymer and contains substantially no silicone compound, and wherein Mooney viscosity (ML1+4 (100° C.)) of the diene-based polymer before curing which is measured according to JIS K6300 at a temperature of 100° C. is in the range of 40 to 70. It is preferred that the material before curing is mainly constituted of one or two or more diene-based polymers having a cis-1,4 bond content of 90 to 99%.

Abstract: Provided are a double-sided pressure-sensitive adhesive sheet which is free from an adverse affect on an electronic part or the like and is excellent in releasing performance and a production method thereof.

Abstract: Provided is a release sheet which is a non-silicone based and has a good releasability from a pressure sensitive adhesive layer and which makes it possible to form a release agent layer at low temperature and has a solvent resistance. The release sheet comprises a substrate film and a release agent layer, wherein the release agent layer is a cured layer obtained by irradiating a diene base polymer containing an intermolecular cleavage type photopolymerization initiator with an active energy beam.

Abstract: Provided is a release sheet which is a non-silicone-based and has a good releasability from a layer of a pressure sensitive adhesive and which has a stable antistatic property without being influenced by the air environment and is free of bleeding out of ionic substances derived from an antistatic agent. The release sheet is prepared by providing an undercoat layer containing a polyurethane-based resin and 0.1 to 45% by mass of a lithium salt-based antistatic agent and a layer of a rubber-based release agent formed by coating and drying a liquid containing a release agent in order on a substrate.

Abstract: Provided is a release sheet which is a non-silicone based and has a good releasing performance from a pressure sensitive adhesive layer and which is excellent in an aging stability of releasing performance. The above release sheet comprises a rubber base release agent layer provided on a substrate directly or via an undercoat layer, wherein a central line average roughness (Ra) of a substrate surface or an undercoat layer surface which is brought into contact with the rubber base release agent layer is 0.06 ?m or less, and the rubber base release agent layer has a thickness of 0.01 to 5 ?m.