Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: A light-receiving device array in which a plurality of light-receiving devices are one- or two-dimensionally arranged on a substrate, a scintillator layer is deposited on the light-receiving devices and provided with columnar crystals, and an organic film is formed over the scintillator layer and there outside region of the substrate and it intrudes into gaps among the top part of the columnar crystals to cover the scintillator layer.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.

Abstract: A radiation image sensor has a scintillator panel and an imaging device, and the scintillator panel comprises a radiation-transparent substrate, a deliquescent scintillator formed on the substrate, and an elastic organic film covering the scintillator, the scintillator panel and imaging device being bonded to each other with a matching oil interposed therebetween, whereas side wall portions of the scintillator panel and imaging device are firmly attached to each other with a resin.

Abstract: Light-receiving devices are two-dimensionally arranged on a substrate, bonding pads electrically connected to the light-receiving devices in the respective rows or columns via signal lines are arranged on the outer periphery of the substrate, and a protective passivation film is disposed on the light-receiving devices and signal lines, thereby forming a light-receiving device array. A scintillator made of columnar crystals of CsI is deposited on the light-receiving surface of the light-receiving device array, whereas a protective film in which an Al inorganic film is held between organic films, made of Parylene is laminated thereon. The outer periphery of the protective film is cut at a position where the bonding pads are exposed, and is brought into close contact with the passivation film with the aid of the coating resin.

Abstract: Light-receiving devices are two-dimensionally arranged on a substrate, bonding pads electrically connected to the light-receiving devices in the respective rows or columns via signal lines are arranged on the outer periphery of the substrate, and a protective passivation film is disposed on the light-receiving devices and signal lines, thereby forming a light-receiving device array. On the light-receiving surface of the light-receiving device array, a scintillator made of columnar crystals of CsI is deposited. On the other hand, a resin frame formed like an elongated frame is disposed inside the bonding pads. Inside this frame, a protective film in which an inorganic film is held between organic films made of Parylene is laminated. The outer periphery of the protective film is in close contact with the resin frame with the aid of the coating resin.

Abstract: A scintillator having a columnar structure adapted to convert incident radiation into visible light is formed on one surface of a substrate made of Al in a scintillator panel. All surfaces of the substrate and scintillator are covered with a first polyparaxylylene film, whereas an SiO2 film is formed on the surface of polyparaxylylene film on the scintillator side. Further, a second polyparaxylylene film is formed on the surface of SiO2 film and the surface of polyparaxylylene film on the substrate side, so that all surfaces are covered with the second polyparaxylylene film.