Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: An organic film vapor deposition method includes a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from the vapor deposition table; a second step of introducing the vapor deposition table having the substrate supported by the target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of the substrate, provided with the scintillator, introduced into the vapor deposition chamber.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1 having external connection electrodes 12 and electrode pads 11 electrically connected to them. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element 2. The electrodes pads 11 and 22 are electrically connected by wiring lines 4. An electrical insulating organic film 51 tightly seals the scintillator 3 and covers the electrode pads 11 and 22 and the wiring lines 4. A metal thin film 52 is formed on the organic film 51.

Abstract: A scintillator panel 1 uses a glass substrate 5, having heat resistance, as a base member for forming a scintillator 10. Glass substrate 5 also functions as a radiation entry window. Also, a dielectric multilayer film mirror 6 is disposed as a light-reflecting film between the scintillator 10 and the glass substrate 5. Furthermore, a light-absorbing film 7 is disposed on the radiation entry surface of glass substrate 5 and this absorbs the light that has been emitted from scintillator 10 and has passed through the dielectric multilayer film mirror 6 and the glass substrate 5. Light components that are reflected by the radiation entry surface, etc., and return to the dielectric multilayer film mirror 7 and the scintillator 10 therefore do not occur and the optical output of the scintillator panel 1 is not subject to degrading effects.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: In a scintillator panel comprising a deliquescent scintillator formed on an FOP and a polyparaxylylene film covering over the scintillator, the FOP comprises a protective film peeling prevention rough at a side wall portion thereon coming into contact with the polyparaxylylene film.

Abstract: The surfaces of an amorphous carbon substrate of a scintillator panel have undergone sandblasting, and an Al film 1 serving as a reflecting film is formed on one surface, and a columnar scintillator for converting incident radiation into visible light is formed on the surface of the Al film.

Abstract: An organic film vapor deposition method includes a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from the vapor deposition table; a second step of introducing the vapor deposition table having the substrate supported by the target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of the substrate, provided with the scintillator, introduced into the vapor deposition chamber.

Abstract: Scintillator panel (1) comprises a radiation transmitting substrate (5), which has heat resistance, a dielectric multilayer film mirror (6), as a light reflecting film and is formed on the radiation transmitting substrate (5), and a scintillator (10), disposed on the dielectric multilayer film mirror (6) and emits light by conversion of the radiation (30) that has been made to enter the radiation transmitting substrate (5) and has passed through the dielectric multilayer film mirror (6). Since the radiation transmitting substrate (5) has heat resistance, the dielectric multilayer film mirror (6) can be vapor deposited at a high temperature and, as a result, can be formed in a state of high reflectance. Also, unlike a metal film, the dielectric multilayer film mirror (6) will not corrode upon reacting with the scintillator (10).

Abstract: A radiation image sensor comprises (1) an image sensor 1 having a plurality of light receiving elements arranged one or two dimensionally, (2) scintillator 2 having columnar structure formed on the light-receiving surface of this image sensor 1 to convert radiation into light including wavelengths that can be detected by the image sensor 1, (3) a protective film 3 formed so as to cover and adhere to the columnar structure of the scintillator 2, and (4) a radiation-transmittable reflective plate 4 that has a reflective surface 42 disposed to face the image sensor across the protective film 3.

Abstract: An organic film vapor deposition method includes a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from the vapor deposition table; a second step of introducing the vapor deposition table having the substrate supported by the target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of the substrate, provided with the scintillator, introduced into the vapor deposition chamber.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: A light-receiving device array in which a plurality of light-receiving devices are one- or two-dimensionally arranged on a substrate, a scintillator layer is deposited on the light-receiving devices and provided with columnar crystals, and an organic film is formed over the scintillator layer and there outside region of the substrate and it intrudes into gaps among the top part of the columnar crystals to cover the scintillator layer.

Abstract: A scintillator panel (2) comprises a radiation-transparent substrate(10), aflat resin film (12) formed on the substrate (10), a reflecting film (14) formed on the flat resin film (12), a deliquescent scintillator (16) formed on the reflecting film (14), and a transparent organic film (18) covering the scintillator (16).

Abstract: Light-receiving devices are two-dimensionally arranged on a substrate, bonding pads electrically connected to the light-receiving devices in the respective rows or columns via signal lines are arranged on the outer periphery of the substrate, and a protective passivation film is disposed on the light-receiving devices and signal lines, thereby forming a light-receiving device array. On the light-receiving surface of the light-receiving device array, a scintillator made of columnar crystals of CsI is deposited. On the other hand, a resin frame formed like an elongated frame is disposed inside the bonding pads. Inside this frame, a protective film in which an inorganic film is held between organic films made of Parylene is laminated. The outer periphery of the protective film is in close contact with the resin frame with the aid of the coating resin.

Abstract: A scintillator panel 1 uses a glass substrate 5, having heat resistance, as a base member for forming a scintillator 10. Glass substrate 5 also functions as a radiation entry window. Also, a dielectric multilayer film mirror 6 is disposed as a light-reflecting film between the scintillator 10 and the glass substrate 5. Furthermore, a light-absorbing film 7 is disposed on the radiation entry surface of glass substrate 5 and this absorbs the light that has been emitted from scintillator 10 and has passed through the dielectric multilayer film mirror 6 and the glass substrate 5. Light components that are reflected by the radiation entry surface, etc., and return to the dielectric multilayer film mirror 7 and the scintillator 10 therefore do not occur and the optical output of the scintillator panel 1 is not subject to degrading effects.