Patents by Inventor Takuya JODA

Takuya JODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing method, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
    Patent number: 9502239
    Abstract: There is provided a substrate processing method, including: (a) loading a substrate into a processing vessel having a pre-baked film containing a silazane bond; (b) heating the substrate to a first temperature and supplying a process gas to the heated substrate; and (c) heating the substrate to which the process gas has been supplied, to a second temperature which is higher than the first temperature and less than or equal to a temperature at which the pre-bake has been performed.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: November 22, 2016
    Assignees: HITACHI KOKUSAI ELECTRIC INC., AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
    Inventors: Masahisa Okuno, Tooru Kakuda, Hideto Tateno, Takuya Joda, Masamichi Kurokawa
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
    Publication number: 20160203976
    Abstract: To improve the characteristics of a film formed on a substrate, a method of manufacturing a semiconductor device includes: loading a substrate into a processing container, the substrate being provided with a film having a silazane bond, the film being subjected to pre-baking; supplying oxygen-containing gas at a first temperature not higher than the temperature of the pre-baking; and supplying processing gas containing at least any one of steam and hydrogen peroxide at a second temperature higher than the first temperature.
    Type: Application
    Filed: March 23, 2016
    Publication date: July 14, 2016
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Takuya JODA, Toru KAKUDA, Masahisa OKUNO, Hideto TATENO
  • SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
    Publication number: 20150262817
    Abstract: There is provided a substrate processing method, including: (a) loading a substrate into a processing vessel having a pre-baked film containing a silazane bond; (b) heating the substrate to a first temperature and supplying a process gas to the heated substrate; and (c) heating the substrate to which the process gas has been supplied, to a second temperature which is higher than the first temperature and less than or equal to a temperature at which the pre-bake has been performed.
    Type: Application
    Filed: May 8, 2015
    Publication date: September 17, 2015
    Inventors: Masahisa OKUNO, Tooru KAKUDA, Hideto TATENO, Takuya JODA, Masamichi KUROKAWA
  • Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
    Publication number: 20150147894
    Abstract: Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit.
    Type: Application
    Filed: February 5, 2015
    Publication date: May 28, 2015
    Inventors: Katsuyoshi HAMANO, Atsushi UMEKAWA, Takuya JODA, Akinori ISHII, Masahisa OKUNO
  • SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20110217852
    Abstract: Provided is technology for preventing breakage of an induction target part of a substrate processing apparatus using an induction heating method.
    Type: Application
    Filed: March 3, 2011
    Publication date: September 8, 2011
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Kenichi SUZAKI, Takuya JODA
  • Vaporizer for substrate processing apparatus
    Patent number: D741823
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: October 27, 2015
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hideto Tateno, Daisuke Hara, Masahisa Okuno, Takuya Joda