Abstract: A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.

Abstract: An electronic component package is provided with a base on which an electronic component element is mounted and a lid that includes a conductive member and that is bonded to the base with a sealing member so as to hermetically seal the electronic component element. The base includes a bottom portion and a wall portion that extends from the bottom portion. A cavity in which the electronic component element is mounted is formed on a first main surface of the base by the bottom portion and the wall portion. The base also includes electrode pads electrically connected to electrodes of the electronic component element, external terminals electrically connected to outside and line patterns electrically connected to the electrode pads and the external terminals. The external terminals include a GND terminal for grounding.

Abstract: There are disposed a sealing member, a pair of electrode pads to electrically couple a piezoelectric resonator, a plurality of connection pads to electrically couple an integrated circuit element and the piezoelectric resonator, and wiring patterns to establish electrical continuity between the pair of electrode pads and the plurality of connection pads, and the piezoelectric resonator and the integrated circuit element are disposed side by side in plan view. An output wiring pattern establishes electrical continuity between one of the connection pads and an alternating current output terminal of an oscillation circuit, and a power source wiring pattern establishes electrical continuity between one of the connection pads and a direct current power source terminal of the oscillation circuit. The electrode pads are disposed closer to the power source wiring pattern than the output wiring pattern.

Abstract: A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.

Abstract: An electronic-component container is provided in which a metal lid is bonded with an insulating package. The container comprises the insulating package having a housing portion for housing an electronic component element having an electrical function, a metallized sealing portion formed around the housing portion and hermetically bonded with the metal lid, and a castellation having a terminal electrode formed at a side end portion thereof, and the metal lid formed in a shape as viewed from the top which is substantially equal to a shape as viewed from the top of the insulating package, wherein a brazing material is formed on a lower surface of the metal lid, and the brazing material is provided with a welding portion which is bonded with the metallized sealing portion inside the castellation when the metal lid is bonded with the insulating package.

Abstract: An electronic-component container is provided in which a metal lid is bonded with an insulating package. The container comprises the insulating package having a housing portion for housing an electronic component element having an electrical function, a metallized sealing portion formed around the housing portion and hermetically bonded with the metal lid, and a castellation having a terminal electrode formed at a side end portion thereof, and the metal lid formed in a shape as viewed from the top which is substantially equal to a shape as viewed from the top of the insulating package, wherein a brazing material is formed on a lower surface of the metal lid, and the brazing material is provided with a welding portion which is bonded with the metallized sealing portion inside the castellation when the metal lid is bonded with the insulating package.