Abstract: An object is to provide a mask formation method, which can curtail a manufacturing cost. A method of forming a film of predetermined pattern on the front surface of a member to-be-processed is so constructed as to carry out the step (S178) of improving the adherence of a pattern material solution to the member to-be-processed, the step (S180) of filling up a pattern forming recess provided in a mask on the surface of the member to-be-processed with a pattern material solution, the step (S186) of improving the film quality of the pattern film to-be-formed by processing the pattern material solution, the step (S188) of removing the pattern material solution having adhered on the mask, the step (S190) of drying the pattern material solution, and the step (S196) of subjecting the pattern film to annealing processing.

Abstract: To provide a coating apparatus which can surely prevent a coating solution from spreading to simplify a manufacturing process and reduce the manufacturing cost and provide a coating method using the same. The coating apparatus includes a holding table holding a plate having a through hole penetrating in a thickness direction; and a coating head including a slit-shaped nozzle orifice which discharges a coating solution, the nozzle orifice being opposed to a coating surface opposite to a holding surface held on the holding table. The coating apparatus applies the coating solution to the coating surface of the plate by moving the plate and the coating head relative to each other in an in-plane direction of the coating surface. In addition, the coating apparatus includes coating preventing means which prevents the coating solution from entering the through hole of the plate.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of fluorocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfluorocarbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of fluorocarbon resin obtained by subjecting the perfluorocarbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of fluorocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfluorocarbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of fluorocarbon resin obtained by subjecting the perfluorocarbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of fluorocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfluorocarbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of fluorocarbon resin obtained by subjecting the perfluorocarbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of fluorocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfluorocarbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of fluorocarbon resin obtained by subjecting the perfluorocarbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of flourocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfloro carbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of flourocarbon resin obtained by subjecting the perfloro carbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: A method for forming a transparent electrode film is provided. The method includes: forming an insulating film on a substrate material, forming a contact hole in the insulating film, and coating a region where a transparent conductive film is to be formed with a liquid containing a precursor of the transparent conductive film. The liquid coats any unnecessary insulating film formed on the substrate material inside the contact hole when the contact hole is formed. The liquid is a solvent containing fluorine capable of dissolving the unnecessary insulating film. By annealing the liquid to volatilize the components of the unnecessary insulating film dissolved in the precursor substance of the transparent conductive film, the unnecessary insulating film is removed.

Abstract: A method is provided for forming a pattern of a transparent conductive film. The method includes a sensitizing step for coating a surface of a substrate with a solution where a platinum group element is dispersed in accordance with a given pattern, an annealing step for fixing the platinum group element on the surface of the substrate, a film forming step for depositing a tin conductive film on the portion for which the sensitizing is implemented by immersing the substrate in a tin plating bath for a given time, and an oxidizing step for oxidizing the tin conductive film to form a transparent conductive film.

Abstract: A pattern material supply unit (300) has a shower head (310) for producing a particle mist from the liquid pattern material (312) and discharging the mist. A process stage (318) on which the workpiece (20) is placed is disposed below the shower head (310). A hydrophobic processed mask with pattern forming openings is disposed on the surface of the workpiece (20). A voltage is applied by a dc power source (328) to the workpiece (20) by way of the intervening process stage (318) so that particles of the liquid pattern material (312) are attracted thereto by static attraction. The liquid pattern material adhering to the mask surface fills in the pattern forming openings disposed in the mask as a result of the process stage (318) rotating, and the liquid pattern material can be heated and solidified by an internal heater (326).

Abstract: A metal element formation method includes a seed layer formation step for forming a seed layer on a treatment surface of a substrate, and a plating formation step for forming a plating layer on the seed layer, wherein in the seed layer formation step, a liquid repellent section is formed on the treatment surface, and a liquid phase method is used to form the seed layer in a region outside the liquid repellent section.

Abstract: A porous insulating layer-forming apparatus includes a solution-applying portion, a solidified layer-forming portion, a vacuum drying portion, a firing portion, and an airtight treatment portion. The solution-applying portion applies a solution in which an insulating material is dissolved, onto a workpiece. In the solidified layer-forming portion, a cooling plate cools the solution applied onto the workpiece to a temperature less than or equal to the melting point of the solvent in the solution to yield a solidified layer. In the vacuum drying portion, a decompression chamber is decompressed by a vacuum pump to vaporize the solvent in the solidified layer, thereby changing the solidified layer into a porous solidified layer. In the firing potion, the porous solidified layer is hardened by firing on a hot plate to yield a porous insulating layer.

Abstract: An object is to provide a mask formation method, which can curtail a manufacturing cost.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: The present invention provides a mask forming method that can reduce manufacturing cost.

Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of flourocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfloro carbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of flourocarbon resin obtained by subjecting the perfloro carbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.

Abstract: Gas discharge is caused in a predetermined discharging gas at atmospheric pressure or a pressure close to atmospheric pressure, and an organic material which is liquid at room temperature and which is previously contained in the discharging gas or applied to a surface of a treated member is dissociated or excited by a plasma caused by the gas discharge to generate activated species. By using these excited activated species, a polymerized film of organic material is formed on the surface of the treated member. By variously selecting the organic material or the kind of the discharging material and variously combining them, a water repellent film, a hydrophilic film or a film having a high hardness can easily be formed on the surface of the treated member according to use, or the polymerization speed of the organic material can be increased, or the polymerization can be limited.

Abstract: A carbide dispersed, strengthened copper alloy includes copper as a major constituent, carbide particles, and a dispersing agent. The carbide particles consist of one or more carbides selected from chromium carbide, tungsten carbide, molybdenum carbide, and tantalum carbide. The dispersing agent consists of one or more elements selected from magnesium, chromium, silicon, and aluminum.

Abstract: An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and generating an excited active species of the discharge gas as a result of the gas discharge. Then, at least one of a connecting surface of an electrode formed of a piezoelectric piece on a piezoelectric resonator and a connecting portion of a lead terminal are exposed to the excited active species, whereby the exposed connecting portions are surface treated. Finally, the electrode and the lead terminal are connected together, and at least the electrode and the lead terminal are sealed in a case. The improved piezoelectric element is formed by this process and uses less solder and is more stable than prior art piezoelectric elements.