Abstract: A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.

Abstract: A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.

Abstract: A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the leads includes a groove formed on an upper surface thereof partially below the side wall. The first lead includes an additional groove provided on an upper surface thereof along a side of the first lead positioned opposite a side of the second lead.

Abstract: A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded resin part. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the two leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the two leads includes a groove at an upper surface threreof. The groove is filled with a part of the molded resin part. The part of the molded resin part includes a first portion and a second portion. The first portion is exposed from the bottom surface of the recess. The second portion connects with a bottom surface of the side wall.

Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.

Abstract: The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.

Abstract: A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract: A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a light emitting component. The lead is partially exposed from a bottom surface of the recess portion of the molded resin to be electrically connected to the light emitting component and extends below a side wall of the recess portion. The lead has a groove formed on a surface of the lead at least partially along the side wall. The groove has an inside upper edge and an outside upper edge and is filled with the molded resin so that the inside upper edge is exposed from the bottom surface of the recess portion and the outside upper edge is embedded within the molded resin.

Abstract: A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

Abstract: A light emitting device including; a base body having a base material that includes a first main face that has a lengthwise direction and a short-side direction that is perpendicular to the lengthwise direction, a second main face on the opposite side from the first main face, a first end face that extends in the lengthwise direction, and a second end face that extends in the short-side direction, and connection terminals that are provided on the first main face of the base material; and a light emitting element that is installed on the first main face and is connected to the connection terminals, the first end face of the base material has a recess that is contiguous with the first main face and the second end face and/or is contiguous with the second main face and the second end face, a length of the recess in a lengthwise direction is greater than a depth in a short-side direction, and the connection terminals are provided extending over the recess.

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.

Abstract: The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.

Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.

Abstract: A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

Abstract: A semiconductor device mounting structure includes a semiconductor device and a mounting substrate. The semiconductor device includes a first external connection terminal and a device-side mounting insulating region. The first external connection terminal is provided at a first end and has a metal region on a semiconductor mounting surface of the semiconductor device. The device-side mounting insulating region is defined by the metal region on the semiconductor mounting surface. The semiconductor mounting surface faces a substrate mounting surface. The mounting substrate has on the substrate mounting surface a land pattern made of an electrically conductive material to be electrically connected to the first external connection terminal. The land pattern is provided in a first shape to surround the device-side mounting insulating region and includes a land-side insulating region which has a second shape to correspond to a periphery of the device-side mounting insulating region.

Abstract: A light emitting device including; a base body having a base material that includes a first main face that has a lengthwise direction and a short-side direction that is perpendicular to the lengthwise direction, a second main face on the opposite side from the first main face, a first end face that extends in the lengthwise direction, and a second end face that extends in the short-side direction, and connection terminals that are provided on the first main face of the base material; and a light emitting element that is installed on the first main face and is connected to the connection terminals, the first end face of the base material has a recess that is contiguous with the first main face and the second end face and/or is contiguous with the second main face and the second end face, a length of the recess in a lengthwise direction is greater than a depth in a short-side direction, and the connection terminals are provided extending over the recess.