Abstract: A lead frame includes at least one row of a plurality of unit regions arranged in a first direction. Each of the unit regions includes: a first lead; a second lead; and an isolation region configured to isolate the first lead from the second lead, the isolation region including a bent portion that is located at an end part of the second lead. The first lead has an extending portion extending along the end part of the second lead. The plurality of unit regions includes a first unit region, and a second unit region that is adjacent to the first unit region in the first direction. The first lead of the first unit region is connected to the first lead or second lead of the second unit region via the extending portion.

Abstract: A light emitting device includes first and second light emitting elements, first and second color conversion material layers, a support member and a light reflective member. The first color conversion material layer has a first color conversion surface facing a first light extraction surface of the first light emitting element. The second color conversion material layer has a second color conversion surface facing a second light extraction surface of the second light emitting element. The support member supports the first and second color conversion material layers. The light reflective member covers a first side surface of the first light emitting element and a second side surface of the second light emitting element. At least a part of an upper surface of the light reflective member is positioned closer to the support member than the first color conversion material layer and the second color conversion material layer.

Abstract: A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles.

Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.

Abstract: A light emitting device includes a substrate, a light emitting element, a light transmissive member and a sealing member. The substrate has a first main surface, a second main surface that is opposite from the first main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material, and a pair of connection terminals. The insulating base material defines a concave component opening on the second main surface and the mounting surface. The connection terminals are disposed on the first main surface, and respectively have element connection sections with convex shapes. The light emitting element has a pair of electrodes which connect to the element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element.

Abstract: A light emitting apparatus includes a package having a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view. The package includes first and second leadframes and a resin portion. The first leadframe has a first leadframe main portion and a first leadframe extension portion which has narrower width than that of the first leadframe main portion. The second leadframe has a second leadframe main portion and a second leadframe extension portion which has narrower width than that of the second leadframe main portion. An inclined portion is formed between the first leadframe and the second leadframe as viewed in plan view. An upper end of the inclined portion is shifted from a lower end of the inclined portion.

Abstract: A light distribution method is for an adaptive driving beam headlamp system including a light emitting device, an on-board camera and an electronic control unit. The light distribution method includes: obtaining data indicative of a state in front of a vehicle by the on-board camera; computing one or more of: attributes of an object in front of the vehicle; attributes of a vehicle ahead; a speed of the vehicle ahead; a distance between vehicles; brightness of the object; and a road shape; determining a light distribution pattern; determining a control amount indicative of at least one of an ON or OFF state of each of the light emitting elements and an applied power to each of the light emitting elements according to the light distribution pattern determined; and controlling driving of the adaptive driving beam headlamp system based on the control amount determined.

Abstract: A light emitting device includes a plurality of light emitting elements, a light-transmissive member, and a covering member. The light emitting elements each has a pair of electrodes on a lower surface thereof. The light-transmissive member includes a plurality of recesses on a lower surface thereof with the light emitting elements being respectively accommodated in the recesses so that light from the light emitting elements transmits through the light-transmissive member. The covering member surrounds an outer periphery of each of the light emitting elements, and constitutes a part of a lower surface and a part of an outermost lateral surface of the light emitting device. The covering member is in contact with a part of each of the light emitting elements. Lower surfaces of the electrodes are exposed from the covering member at the lower surface of the light emitting device.

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A light emitting device includes a substrate, a light emitting element, a light transmissive member and a sealing member. The substrate has a first main surface, a second main surface that is opposite from the first main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material, and a pair of connection terminals. The insulating base material defines a concave component opening on the second main surface and the mounting surface. The connection terminals are disposed on the first main surface, and respectively have element connection sections with convex shapes. The light emitting element has a pair of electrodes which connect to the element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element.

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.

Abstract: A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

Abstract: A light emitting device includes a substrate, a light emitting element, and a light reflecting member. The substrate includes a base material having a rectangular planar shape, a connection terminal disposed on a first main surface of the base material, and an outer connection portion disposed on a second main surface of the base material opposite to the first main surface. The connection terminal includes a protruding portion, and the connection terminal is connected to the outer connection portion via a through hole defined in the base material. The light emitting element is connected to the connection terminal on the first main surface of the base material via a molten bonding material. The light reflecting member covers the light emitting element.

Abstract: A method of manufacturing a substrate for a light emitting device includes: forming wiring to form a plurality of first wiring parts and second wiring parts on/above an upper surface of a base member; forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least parts of the first wiring parts and the second wiring parts and etching the first metal film using a resist for forming projection part; and forming an alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist, wherein the resist for forming the projection part and the resist for forming alignment mark are exposed to light in an identical step of exposing to light.

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.

Abstract: A light emitting device includes a plurality of light emitting elements, a light transmissive member, a first member and a second member. Each of the light emitting elements has a pair of electrodes on a lower surface thereof. The light-transmissive member is disposed on an upper surface of each of the light emitting elements to transmit light from the light emitting elements. The first member is disposed on one or more lateral surfaces of the light-transmissive member and constitutes part of an upper surface of the light emitting device. The second member surrounds an outer periphery of each of the light emitting elements and constitutes part of a lower surface of the light emitting device. Lower surfaces of the electrodes are exposed from the second member.

Abstract: A light emitting device includes a substrate, light emitting elements, a sealing member, a light transmissive member and a heat dissipation terminal. The sealing member is in contact with at least a part of a side surface of each of the light emitting elements, is formed substantially in the same plane as the substrate, and a width of the sealing member between adjacent ones of the light emitting elements is larger than a width of the sealing member on an outside of an outermost one of the light emitting elements. The light transmissive member covers upper surfaces of the light emitting elements and a part of an upper surface of the sealing member, side surfaces of the light transmissive member being covered with the sealing member. The heat dissipation terminal is arranged generally in the center on a second main surface of the substrate and has a recess portion.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.