Abstract: The present invention relates to an optical device package in which a deterioration in performance of an optical device is suppressed which deterioration may be caused by dust on a light path. An optical device package (10) including a case (13, 14) in which an optical device (11) is sealed includes a lid (13) having an optical window (13a) which transmits light, and the optical device (11) is connected to the lid (13) such that at least part of an effective region (Ae) of the optical device (11) overlaps with the optical window (13a).

Abstract: Transfer of desired monitoring data is enabled while restraining a data storage capacity and transfer capacity. A base system senses an alert and generates an index for specifying collection target data that is data present within a predetermined collection target time including an alert occurrence time point, records the collection target data in association with the index, into a time-series data table, and stores alert identification information in association with the index, into an index specifying table. A center system receives the alert identification information and transmits a data request for requesting the collection target data, to the base system. The base system, upon receipt of the data request, acquires the index associated with the designated alert identification information by searching the index specifying table, acquires the collection target data specified by the index from the time-series data table, and transmits the acquired data to the center system.

Abstract: An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Abstract: A delay in a configuration changing operation of a computer system including a manual procedure and an automatic procedure is detected. Based on actions of a setup tool or a configuration tool operated on IT resources, an event which occurs corresponding to the start and the end of a manual procedure is detected and the actual time of the manual procedure is calculated from the detection time points. Next, a delay rate is calculated from a scheduled time and the actual time of the manual procedure, and an end time point of an incomplete operation procedure is estimated from an estimated time required for the manual procedure with the calculated delay rate taken into account and from a time required for the automatic procedure to determine whether the scheduled operation will be finished within a period.

Abstract: A monitoring system for providing services to clients as an embodiment of the present invention is characterized in that upon determining whether or not termination times of the service-providing computers currently acquiring packets have been reached, service-providing computers that constitute a service-providing system other than the service-providing system constituted by the service-providing computers that have reached the termination times are selected as new packet acquisition destinations.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: A carbon nanotube sheet includes a carbon nanotube aggregate in which a plurality of carbon nanotubes are arrayed, a thermoplastic resin portion formed in a center area of the carbon nanotube aggregate, and an uncured thermosetting resin portion formed in an outer periphery area of the carbon nanotube aggregate so as to surround the thermoplastic resin portion.

Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Abstract: A monitoring system for providing services to clients as an embodiment of the present invention is characterized in that upon determining whether or not termination times of the service-providing computers currently acquiring packets have been reached, service-providing computers that constitute a service-providing system other than the service-providing system constituted by the service-providing computers that have reached the termination times are selected as new packet acquisition destinations.

Abstract: A delay in a configuration changing operation of a computer system including a manual procedure and an automatic procedure is detected. Based on actions of a setup tool or a configuration tool operated on IT resources, an event which occurs corresponding to the start and the end of a manual procedure is detected and the actual time of the manual procedure is calculated from the detection time points. Next, a delay rate is calculated from a scheduled time and the actual time of the manual procedure, and an end time point of an incomplete operation procedure is estimated from an estimated time required for the manual procedure with the calculated delay rate taken into account and from a time required for the automatic procedure to determine whether the scheduled operation will be finished within a period.

Abstract: A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: Using a service server list containing addresses of servers within a service system and an application list containing names of active applications within the service system, addresses of servers on which the active applications are running, and communication source addresses and communication destination addresses of the active applications, the following processes are carried out: specifying applications of a first layer in the service system from among applications lying within the service system; specifying applications of a second or subsequent layer in the service system from the application list and from addresses of servers on which the applications of the first layer are running; and judging applications having the same application name among applications belonging to the same layer as being of the same role for aggregation.

Abstract: A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.

Abstract: A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving as the TIM are arranged to stand side by side on a surface of the heat-spreading component in which the recessed portion is formed (or on an exposed surface of an electronic component). Then, the heat-spreading component is fixed onto a board in such a manner that the surface of the heat-spreading component in which the recessed portion is formed faces the board and that a clearance is adjusted between the electronic component and the heat-spreading component. Thereafter, the resin is heated to a softening point thereof into a fluidized state, and the resin is flowed and filled into the clearance between the electronic component and the heat-spreading component.

Abstract: Using a service server list containing addresses of servers within a service system and an application list containing names of active applications within the service system, addresses of servers on which the active applications are running, and communication source addresses and communication destination addresses of the active applications, the following processes are carried out: specifying applications of a first layer in the service system from among applications lying within the service system; specifying applications of a second or subsequent layer in the service system from the application list and from addresses of servers on which the applications of the first layer are running; and judging applications having the same application name among applications belonging to the same layer as being of the same role for aggregation.

Abstract: An operation management server, including an incident-job relation specifying unit, is responsive to the occurrence of an incident generated in an business system to refer to the incident table for relating the incident to hosts and the job group definition table from a job management server in order to specify the job and job group to be executed by the host on which the incident is generated, a job execution estimation unit for specifying the job to be reexecuted due to the occurrence of the incident and the unexecuted job in the job group, and an impact on job execution calculation unit for determining the impact on job execution which is the influence by the incident on the business system by relating the incident to the specified job.

Abstract: A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.