Patents by Inventor Takuya Takahashi

Takuya Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8647129
    Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: February 11, 2014
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takuya Takahashi, Ryuzo Shimeno, Tetsuya Komoto, Osamu Hashiguchi
  • Patent number: 8625197
    Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 7, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji Makikawa, Toshiaki Watanabe, Tomohiro Koyama, Hisaya Oda, Takuya Takahashi, Akio Yamanaka
  • Publication number: 20140004745
    Abstract: A board-to-board connector includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of beam parts having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the plurality of beam parts. The plug connector includes a beam contact part having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the beam contact part. A beam projection is formed between the adjacent conductive patterns of the plug connector, and the beam projection is inserted between the adjacent beam parts of the receptacle connector when the receptacle connector and the plug connector are mated.
    Type: Application
    Filed: May 16, 2013
    Publication date: January 2, 2014
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventors: Tetsuya KOMOTO, Yu Tatebe, Takuya Takahashi, Ryuzo Shimeno
  • Patent number: 8602811
    Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: December 10, 2013
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Takuya Takahashi
  • Patent number: 8599352
    Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: December 3, 2013
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takaaki Suzuki, Takuya Takahashi
  • Patent number: 8450858
    Abstract: A method of manufacturing a semiconductor device having a first wiring layer, a first interlayer insulating film, a second interlayer insulating film, a third interlayer insulating film, and a second wiring layer, in which the method includes depositing the second wiring layer on the third interlayer insulating film and, where the widths of first wiring layer and the second wiring layer are 10.0 ?m or greater, executing one of etching the second wiring layer to set a width of 1.0 ?m or greater in a portion where the first wiring layer and the second wiring layer overlap and etching the second wiring layer to seta horizontal distance of 2.0 ?m or greater between adjacent portions of the first wiring layer and the second wiring layer.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: May 28, 2013
    Assignee: Ricoh Company, Ltd.
    Inventors: Takuya Takahashi, Fumihiro Fuchino, Yuuichi Kohno, Masanori Miyata
  • Publication number: 20130072037
    Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
    Type: Application
    Filed: July 18, 2012
    Publication date: March 21, 2013
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takuya TAKAHASHI, Ryuzo SHIMENO, Tetsuya KOMOTO, Osamu HASHIGUCHI
  • Publication number: 20120320300
    Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 20, 2012
    Inventors: Takaaki SUZUKI, Takuya TAKAHASHI
  • Patent number: 8259275
    Abstract: Provided is a liquid crystal display device capable of significantly reducing occurrence of a failure such as an interlayer short-circuit. In the liquid crystal device, a first layer formed of a copper film having a purity of 99.5% or more and a second layer formed of an alloy film containing copper as a main component are successively formed on a glass substrate or a substrate on which a transparent conductive film containing indium is formed. The alloy film serving as the second layer is made of an alloy containing copper as a main component, which has a higher etching rate in a wet etching process compared with that of copper. Accordingly, a patterned cross-section of the copper film having a large film thickness can be etched in a tapered shape, to thereby improve coverage of an insulating film or the like laminated on a wiring pattern.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: September 4, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takaaki Suzuki, Takuya Takahashi
  • Patent number: 8099964
    Abstract: A magnetic refrigerating device includes: a magnetic refrigerating unit including a magnetic material “A” exhibiting a magneto-caloric effect that the temperature of the material “A” is increased by the application of a magnetic field and the temperature of the material “A” is decreased by the removal of a magnetic field, a magnetic material “B” exhibiting a magneto-caloric effect that the temperature of the material “B” is decreased by the application of a magnetic field and the temperature of the material “B” is increased by the removal of a magnetic field, a heat conductive material “a” exhibiting higher heat conductivity under the application of a magnetic field and lower heat conductivity under the removal of a magnetic field, and a heat conductive material “b” exhibiting lower heat conductivity under the application of a magnetic field and higher heat conductivity under the removal of a magnetic field, wherein the magnetic refrigerating unit is configured so as to include at least one layered structure
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: January 24, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akiko Saito, Tadahiko Kobayashi, Hideyuki Tsuji, Hideo Iwasaki, Katsumi Hisano, Akihiro Koga, Akihiro Kasahara, Takuya Takahashi
  • Publication number: 20110244711
    Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 6, 2011
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Takuya TAKAHASHI
  • Publication number: 20110181950
    Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.
    Type: Application
    Filed: January 18, 2011
    Publication date: July 28, 2011
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shinji MAKIKAWA, Toshiaki WATANABE, Tomohiro KOYAMA, Hisaya ODA, Takuya TAKAHASHI, Akio YAMANAKA
  • Patent number: 7914293
    Abstract: An electrical connector for electrically connecting conductive portions formed on edges of connection objects, respectively. The electrical connector comprises an electrode sheet and a press member. The electrode sheet comprises an insulation sheet and an electrode formed on the insulation sheet. The press member comprises a plurality of springs arranged to press the insulation sheet against the conductive portions of the connection objects to force the electrode to be brought into contact with the conductive portions.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: March 29, 2011
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Mitsuo Koguchi, Takuya Takahashi, Ryuzo Shimeno
  • Patent number: 7892626
    Abstract: A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution between any two points of the solution is small, the solution being ejected onto the substrate so as to form the plane patterns by the liquid process.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: February 22, 2011
    Assignee: Future Vision Inc.
    Inventors: Makoto Abe, Hiroki Kaneko, Takuya Takahashi, Etsuko Nishimura, Yoshitaka Tsutsui, Takaaki Suzuki
  • Patent number: 7874867
    Abstract: In an electrical connection member having elasticity and adapted to be interposed between connection objects for electrically connecting them together, an inner member has a plurality of spring pieces each extending from a base plate portion, an outer member including a flexible insulating film and a plurality of conductive paths formed at the flexible insulating film. Each conductive path has a first and a second contact portion for connection to the connection objects. Each spring piece includes a root portion formed adjacent to the base plate portion and faced to a portion, corresponding to the second contact portion, of an inner surface of an intermediate portion of the insulating film. Each spring piece further includes an inclined spring portion extending obliquely from the root portion and faced to a portion, corresponding to the first contact portion, of the inner surface of the intermediate portion.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: January 25, 2011
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takuya Takahashi, Ryuzo Shimeno
  • Publication number: 20100295184
    Abstract: A method of manufacturing a semiconductor device having a first wiring layer, a first interlayer insulating film, a second interlayer insulating film, a third interlayer insulating film, and a second wiring layer, in which the method includes depositing the second wiring layer on the third interlayer insulating film and, where the widths of first wiring layer and the second wiring layer are 10.0 ?m or greater, executing one of etching the second wiring layer to set a width of 1.0 ?m or greater in a portion where the first wiring layer and the second wiring layer overlap and etching the second wiring layer to seta horizontal distance of 2.0 ?m or greater between adjacent portions of the first wiring layer and the second wiring layer.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 25, 2010
    Applicant: RICOH COMPANY, LTD.
    Inventors: Takuya Takahashi, Fumihiro Fuchino, Yuuichi Kohno, Masanori Miyata
  • Patent number: 7771211
    Abstract: The present invention provides a socket for an element with an element electrode. The socket comprises a base shell, a cover shell and a contact member. The cover shell is engaged with the base shell so that the base shell and the cover shell define a cavity. Each of the base shell and the cover shell is made of a high thermal-conductive material. The contact member comprises an elastic member and a contact electrode provided on the elastic member and are designed and arranged so that the element is mountable on the contact member within the cavity with the element electrode connected to the contact electrode.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: August 10, 2010
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Akira Kuwahara, Takuya Takahashi, Hiroshi Akimoto, Seiya Takahashi, Yoshiaki Ishiyama, Hiroshi Endo
  • Patent number: 7766661
    Abstract: A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed. The member may also include an electrical conduction metal film, whereby the member may serve as both a heat transfer member and as an electrical connector.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: August 3, 2010
    Assignee: Japan Aviation Electronics Industry Limited
    Inventors: Akira Kuwahara, Takuya Takahashi, Seiya Takahashi, Hiroshi Akimoto, Hiroshi Endo, Yoshiaki Ishiyama
  • Publication number: 20100151744
    Abstract: In an electrical connection member having elasticity and adapted to be interposed between connection objects for electrically connecting them together, an inner member has a plurality of spring pieces each extending from a base plate portion, an outer member including a flexible insulating film and a plurality of conductive paths formed at the flexible insulating film. Each conductive path has a first and a second contact portion for connection to the connection objects. Each spring piece includes a root portion formed adjacent to the base plate portion and faced to a portion, corresponding to the second contact portion, of an inner surface of an intermediate portion of the insulating film. Each spring piece further includes an inclined spring portion extending obliquely from the root portion and faced to a portion, corresponding to the first contact portion, of the inner surface of the intermediate portion.
    Type: Application
    Filed: November 24, 2009
    Publication date: June 17, 2010
    Inventors: Takuya Takahashi, Ryuzo Shimeno
  • Patent number: 7719626
    Abstract: Disclosed is a liquid crystal display device having a signal line of low electrical resistivity and high adhesion with an underlayer, wherein a copper alloy film is formed on an underlayer, and an oxide film, silicide film or nitride film, which are additive metal elements of the copper alloy, is formed at the boundary between the underlayer and the copper alloy film whereby the signal line is formed with a multi-layer film of the copper alloy film and the oxide film, the silicide film, or the nitride film.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: May 18, 2010
    Assignee: Hitachi Displays, Ltd.
    Inventors: Takuya Takahashi, Takaaki Suzuki