Patents by Inventor Takuya Takahashi

Takuya Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150115282
    Abstract: A semiconductor device includes an insulating substrate, a semiconductor element secured to a top surface of the insulating substrate, a case formed of a resin and having a frame portion surrounding the semiconductor element, a metal support located above the insulating substrate and having an end secured to the frame portion, a holding-down portion extending downward from the metal support so as to prevent upwardly convex bending of the insulating substrate, and an adhesive bonding the insulating substrate and the case together.
    Type: Application
    Filed: June 5, 2014
    Publication date: April 30, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takuya TAKAHASHI, Yoshitaka OTSUBO
  • Publication number: 20150012582
    Abstract: There is provided an information processing apparatus including an existing place information acquisition part and a my-spot information registration part. The existing place information acquisition part is configured to acquire existing place information which specifies an existing place. The my-spot information registration part is configured to acquire spot information related to a spot, which spot information is provided from a plurality of information provider devices, based on the existing place information; and to register spot information specified by a user as my-spot information, out of the acquired spot information.
    Type: Application
    Filed: May 30, 2014
    Publication date: January 8, 2015
    Applicant: SONY CORPORATION
    Inventors: Toru MASANO, Seiji TATEMATSU, Naoshi KOBUYA, Hiroaki AKIYAMA, Tadashi YOKOYAMA, Tomohiro NAITO, Kaoru NAKAMURA, Takuya TAKAHASHI, Yuichi UEDA
  • Publication number: 20140367737
    Abstract: A semiconductor device includes a substrate of a first conductivity type, a first impurity region of a second conductivity type formed on a top surface side of the substrate, a second impurity region of the second conductivity type formed on the top surface side of the substrate and in contact with the first impurity region, the second impurity region laterally surrounding the first impurity region and having a greater depth than the first impurity region, as viewed in cross-section, and a breakdown voltage enhancing structure of the second conductivity type formed to laterally surround the second impurity region. A boundary between the first and second impurity regions has a maximum impurity concentration equal to or less than that of the second impurity region, and a current is applied between a top surface and a bottom surface of the substrate.
    Type: Application
    Filed: April 1, 2014
    Publication date: December 18, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takuya TAKAHASHI, Atsushi NARAZAKI, Tetsuo TAKAHASHI
  • Patent number: 8882544
    Abstract: Provided is a connector that can be firmly mounted on the substrate. A plug connector is mounted on a plug substrate while making a metal plate function as a plurality of contacts by an insulting layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer. A plurality of protrusions that protrude toward the plug substrate are formed on a substrate opposing surface, which is a surface opposite to the plug substrate. The plurality of conductive patterns are formed to respectively overlap the plurality of protrusions.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: November 11, 2014
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Tetsuya Komoto, Osamu Hashiguchi, Takuya Takahashi, Ryuzo Shimeno
  • Publication number: 20140296357
    Abstract: Provided are a support for supporting a metal, a metal-supported catalyst, a methanation reaction apparatus, and a method relating thereto that realize effective methanation of carbon monoxide. The support for supporting a metal includes a carbonized material obtained by carbonizing raw materials containing an organic substance and a metal, in which the support is used for supporting a metal that exhibits a catalytic activity for a methanation reaction of carbon monoxide. The metal-supported catalyst includes: a support formed of a carbonized material obtained by carbonizing raw materials containing an organic substance and a metal; and a metal that exhibits a catalytic activity for a methanation reaction of carbon monoxide, the metal being supported on the support.
    Type: Application
    Filed: November 1, 2012
    Publication date: October 2, 2014
    Applicant: National University Corporation gunma University
    Inventors: Jun-ichi Ozaki, Hiroki Takahashi, Takuya Takahashi, Naokatsu Kannari, Rieko Kobayashi, Naoto Saito
  • Publication number: 20140160471
    Abstract: An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.
    Type: Application
    Filed: February 3, 2012
    Publication date: June 12, 2014
    Inventors: Taketo Ueno, Toshihiko Nakata, Yukihiro Shibata, Shun'ichi Matsumoto, Atsushi Taniguchi, Hiroshi Toshiyoshi, Takuya Takahashi, Kentaro Motohara
  • Patent number: 8647129
    Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: February 11, 2014
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takuya Takahashi, Ryuzo Shimeno, Tetsuya Komoto, Osamu Hashiguchi
  • Patent number: 8625197
    Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 7, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinji Makikawa, Toshiaki Watanabe, Tomohiro Koyama, Hisaya Oda, Takuya Takahashi, Akio Yamanaka
  • Publication number: 20140004745
    Abstract: A board-to-board connector includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of beam parts having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the plurality of beam parts. The plug connector includes a beam contact part having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the beam contact part. A beam projection is formed between the adjacent conductive patterns of the plug connector, and the beam projection is inserted between the adjacent beam parts of the receptacle connector when the receptacle connector and the plug connector are mated.
    Type: Application
    Filed: May 16, 2013
    Publication date: January 2, 2014
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventors: Tetsuya KOMOTO, Yu Tatebe, Takuya Takahashi, Ryuzo Shimeno
  • Patent number: 8602811
    Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: December 10, 2013
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Takuya Takahashi
  • Patent number: 8599352
    Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: December 3, 2013
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takaaki Suzuki, Takuya Takahashi
  • Patent number: 8450858
    Abstract: A method of manufacturing a semiconductor device having a first wiring layer, a first interlayer insulating film, a second interlayer insulating film, a third interlayer insulating film, and a second wiring layer, in which the method includes depositing the second wiring layer on the third interlayer insulating film and, where the widths of first wiring layer and the second wiring layer are 10.0 ?m or greater, executing one of etching the second wiring layer to set a width of 1.0 ?m or greater in a portion where the first wiring layer and the second wiring layer overlap and etching the second wiring layer to seta horizontal distance of 2.0 ?m or greater between adjacent portions of the first wiring layer and the second wiring layer.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: May 28, 2013
    Assignee: Ricoh Company, Ltd.
    Inventors: Takuya Takahashi, Fumihiro Fuchino, Yuuichi Kohno, Masanori Miyata
  • Publication number: 20130072037
    Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
    Type: Application
    Filed: July 18, 2012
    Publication date: March 21, 2013
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takuya TAKAHASHI, Ryuzo SHIMENO, Tetsuya KOMOTO, Osamu HASHIGUCHI
  • Publication number: 20120320300
    Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 20, 2012
    Inventors: Takaaki SUZUKI, Takuya TAKAHASHI
  • Patent number: 8259275
    Abstract: Provided is a liquid crystal display device capable of significantly reducing occurrence of a failure such as an interlayer short-circuit. In the liquid crystal device, a first layer formed of a copper film having a purity of 99.5% or more and a second layer formed of an alloy film containing copper as a main component are successively formed on a glass substrate or a substrate on which a transparent conductive film containing indium is formed. The alloy film serving as the second layer is made of an alloy containing copper as a main component, which has a higher etching rate in a wet etching process compared with that of copper. Accordingly, a patterned cross-section of the copper film having a large film thickness can be etched in a tapered shape, to thereby improve coverage of an insulating film or the like laminated on a wiring pattern.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: September 4, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takaaki Suzuki, Takuya Takahashi
  • Patent number: 8099964
    Abstract: A magnetic refrigerating device includes: a magnetic refrigerating unit including a magnetic material “A” exhibiting a magneto-caloric effect that the temperature of the material “A” is increased by the application of a magnetic field and the temperature of the material “A” is decreased by the removal of a magnetic field, a magnetic material “B” exhibiting a magneto-caloric effect that the temperature of the material “B” is decreased by the application of a magnetic field and the temperature of the material “B” is increased by the removal of a magnetic field, a heat conductive material “a” exhibiting higher heat conductivity under the application of a magnetic field and lower heat conductivity under the removal of a magnetic field, and a heat conductive material “b” exhibiting lower heat conductivity under the application of a magnetic field and higher heat conductivity under the removal of a magnetic field, wherein the magnetic refrigerating unit is configured so as to include at least one layered structure
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: January 24, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akiko Saito, Tadahiko Kobayashi, Hideyuki Tsuji, Hideo Iwasaki, Katsumi Hisano, Akihiro Koga, Akihiro Kasahara, Takuya Takahashi
  • Publication number: 20110244711
    Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 6, 2011
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Takuya TAKAHASHI
  • Publication number: 20110181950
    Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.
    Type: Application
    Filed: January 18, 2011
    Publication date: July 28, 2011
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shinji MAKIKAWA, Toshiaki WATANABE, Tomohiro KOYAMA, Hisaya ODA, Takuya TAKAHASHI, Akio YAMANAKA
  • Patent number: 7914293
    Abstract: An electrical connector for electrically connecting conductive portions formed on edges of connection objects, respectively. The electrical connector comprises an electrode sheet and a press member. The electrode sheet comprises an insulation sheet and an electrode formed on the insulation sheet. The press member comprises a plurality of springs arranged to press the insulation sheet against the conductive portions of the connection objects to force the electrode to be brought into contact with the conductive portions.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: March 29, 2011
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Mitsuo Koguchi, Takuya Takahashi, Ryuzo Shimeno
  • Patent number: 7892626
    Abstract: A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution between any two points of the solution is small, the solution being ejected onto the substrate so as to form the plane patterns by the liquid process.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: February 22, 2011
    Assignee: Future Vision Inc.
    Inventors: Makoto Abe, Hiroki Kaneko, Takuya Takahashi, Etsuko Nishimura, Yoshitaka Tsutsui, Takaaki Suzuki