Abstract: A semiconductor device includes an insulating substrate, a semiconductor element secured to a top surface of the insulating substrate, a case formed of a resin and having a frame portion surrounding the semiconductor element, a metal support located above the insulating substrate and having an end secured to the frame portion, a holding-down portion extending downward from the metal support so as to prevent upwardly convex bending of the insulating substrate, and an adhesive bonding the insulating substrate and the case together.

Abstract: There is provided an information processing apparatus including an existing place information acquisition part and a my-spot information registration part. The existing place information acquisition part is configured to acquire existing place information which specifies an existing place. The my-spot information registration part is configured to acquire spot information related to a spot, which spot information is provided from a plurality of information provider devices, based on the existing place information; and to register spot information specified by a user as my-spot information, out of the acquired spot information.

Abstract: A semiconductor device includes a substrate of a first conductivity type, a first impurity region of a second conductivity type formed on a top surface side of the substrate, a second impurity region of the second conductivity type formed on the top surface side of the substrate and in contact with the first impurity region, the second impurity region laterally surrounding the first impurity region and having a greater depth than the first impurity region, as viewed in cross-section, and a breakdown voltage enhancing structure of the second conductivity type formed to laterally surround the second impurity region. A boundary between the first and second impurity regions has a maximum impurity concentration equal to or less than that of the second impurity region, and a current is applied between a top surface and a bottom surface of the substrate.

Abstract: Provided is a connector that can be firmly mounted on the substrate. A plug connector is mounted on a plug substrate while making a metal plate function as a plurality of contacts by an insulting layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer. A plurality of protrusions that protrude toward the plug substrate are formed on a substrate opposing surface, which is a surface opposite to the plug substrate. The plurality of conductive patterns are formed to respectively overlap the plurality of protrusions.

Abstract: Provided are a support for supporting a metal, a metal-supported catalyst, a methanation reaction apparatus, and a method relating thereto that realize effective methanation of carbon monoxide. The support for supporting a metal includes a carbonized material obtained by carbonizing raw materials containing an organic substance and a metal, in which the support is used for supporting a metal that exhibits a catalytic activity for a methanation reaction of carbon monoxide. The metal-supported catalyst includes: a support formed of a carbonized material obtained by carbonizing raw materials containing an organic substance and a metal; and a metal that exhibits a catalytic activity for a methanation reaction of carbon monoxide, the metal being supported on the support.

Abstract: An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.

Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.

Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.

Abstract: A board-to-board connector includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of beam parts having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the plurality of beam parts. The plug connector includes a beam contact part having a metal plate and an insulating layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer of the beam contact part. A beam projection is formed between the adjacent conductive patterns of the plug connector, and the beam projection is inserted between the adjacent beam parts of the receptacle connector when the receptacle connector and the plug connector are mated.

Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.

Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.

Abstract: A method of manufacturing a semiconductor device having a first wiring layer, a first interlayer insulating film, a second interlayer insulating film, a third interlayer insulating film, and a second wiring layer, in which the method includes depositing the second wiring layer on the third interlayer insulating film and, where the widths of first wiring layer and the second wiring layer are 10.0 ?m or greater, executing one of etching the second wiring layer to set a width of 1.0 ?m or greater in a portion where the first wiring layer and the second wiring layer overlap and etching the second wiring layer to seta horizontal distance of 2.0 ?m or greater between adjacent portions of the first wiring layer and the second wiring layer.

Abstract: Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.

Abstract: A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH.

Abstract: Provided is a liquid crystal display device capable of significantly reducing occurrence of a failure such as an interlayer short-circuit. In the liquid crystal device, a first layer formed of a copper film having a purity of 99.5% or more and a second layer formed of an alloy film containing copper as a main component are successively formed on a glass substrate or a substrate on which a transparent conductive film containing indium is formed. The alloy film serving as the second layer is made of an alloy containing copper as a main component, which has a higher etching rate in a wet etching process compared with that of copper. Accordingly, a patterned cross-section of the copper film having a large film thickness can be etched in a tapered shape, to thereby improve coverage of an insulating film or the like laminated on a wiring pattern.

Abstract: A magnetic refrigerating device includes: a magnetic refrigerating unit including a magnetic material “A” exhibiting a magneto-caloric effect that the temperature of the material “A” is increased by the application of a magnetic field and the temperature of the material “A” is decreased by the removal of a magnetic field, a magnetic material “B” exhibiting a magneto-caloric effect that the temperature of the material “B” is decreased by the application of a magnetic field and the temperature of the material “B” is increased by the removal of a magnetic field, a heat conductive material “a” exhibiting higher heat conductivity under the application of a magnetic field and lower heat conductivity under the removal of a magnetic field, and a heat conductive material “b” exhibiting lower heat conductivity under the application of a magnetic field and higher heat conductivity under the removal of a magnetic field, wherein the magnetic refrigerating unit is configured so as to include at least one layered structure

Abstract: A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts.

Abstract: An optical isolator including a Faraday rotator that has a high Faraday effect and a high transmission factor in a wavelength used is provided. An optical isolator comprises at least: a Faraday rotator; a polarizer arranged on a light incidence side of the Faraday rotator; and an analyzer arranged on a light exit side of the Faraday rotator, wherein the Faraday rotator consists of an oxide that contains an ytterbium oxide (Yb2O3) with a mass ratio of 30% or more.

Abstract: An electrical connector for electrically connecting conductive portions formed on edges of connection objects, respectively. The electrical connector comprises an electrode sheet and a press member. The electrode sheet comprises an insulation sheet and an electrode formed on the insulation sheet. The press member comprises a plurality of springs arranged to press the insulation sheet against the conductive portions of the connection objects to force the electrode to be brought into contact with the conductive portions.

Abstract: A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution between any two points of the solution is small, the solution being ejected onto the substrate so as to form the plane patterns by the liquid process.