Patents by Inventor TAL KUZI

TAL KUZI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11853140
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Specifically, a power manager circuit in an integrated circuit (e.g., a system on a chip) may modify power budgets for various components in the integrated circuit to reduce the amount of power control caused by external signaling that indicates a voltage regulator overload (e.g., a voltage droop).
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: December 26, 2023
    Assignee: Apple Inc.
    Inventors: Doron Rajwan, Karl Daniel Wulcan, Tal Kuzi, Inder M. Sodhi, Achmed R. Zahir
  • Patent number: 11822411
    Abstract: Systems, apparatuses, and methods for implementing telemetry push aggregation techniques are described. A computing system includes one or more input/output (I/O) agents interposed between functional units and a communication fabric. A given I/O agent receives a set of aggregation rules from a power management unit. The I/O agent monitors traffic from the functional units, and the I/O agent generates telemetry data from the traffic data based on the set of aggregation rules. The telemetry data is used by the power management unit to make adjustments to one or more power settings.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: November 21, 2023
    Assignee: Apple Inc.
    Inventors: Doron Rajwan, Karl Daniel Wulcan, Lital Levy-Rubin, Tal Kuzi
  • Patent number: 11822399
    Abstract: A temperature control apparatus is disclosed. An integrated circuit (IC) includes a plurality of temperature sensors, a first thermal control loop, and a second thermal control loop. The first thermal control loop is configured to control temperature of the IC by reducing a frequency of a clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a first temperature threshold. The second thermal control loop is configured to control temperature of the IC by dithering the clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a second temperature threshold that is greater than the first temperature threshold.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: November 21, 2023
    Assignee: Apple Inc.
    Inventors: Doron Rajwan, Tal Kuzi, Keith Cox, Yizhang Yang
  • Patent number: 11803471
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: Apple Inc.
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasa Rangan Sridharan
  • Publication number: 20230251985
    Abstract: An interrupt delivery mechanism for a system includes and interrupt controller and a plurality of cluster interrupt controllers coupled to respective pluralities of processors in an embodiment. The interrupt controller may serially transmit an interrupt request to respective cluster interrupt controllers, which may acknowledge (Ack) or non-acknowledge (Nack) the interrupt based on attempting to deliver the interrupt to processors to which the cluster interrupt controller is coupled. In a soft iteration, the cluster interrupt controller may attempt to deliver the interrupt to processors that are powered on, without attempting to power on processors that are powered off. If the soft iteration does not result in an Ack response from one of the plurality of cluster interrupt controllers, a hard iteration may be performed in which the powered-off processors may be powered on.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Jeffrey E. Gonion, Charles E. Tucker, Tal Kuzi, Richard F. Russo, Mridul Agarwal, Christopher M. Tsay, Gideon N. Levinsky, Shih-Chieh Wen, Lior Zimet
  • Patent number: 11693472
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: July 4, 2023
    Assignee: Apple Inc.
    Inventors: Ilya Granovsky, Doron Rajwan, Tal Kuzi, Nir Leshem, Lior Zimet
  • Patent number: 11630789
    Abstract: An interrupt delivery mechanism for a system includes and interrupt controller and a plurality of cluster interrupt controllers coupled to respective pluralities of processors in an embodiment. The interrupt controller may serially transmit an interrupt request to respective cluster interrupt controllers, which may acknowledge (Ack) or non-acknowledge (Nack) the interrupt based on attempting to deliver the interrupt to processors to which the cluster interrupt controller is coupled. In a soft iteration, the cluster interrupt controller may attempt to deliver the interrupt to processors that are powered on, without attempting to power on processors that are powered off. If the soft iteration does not result in an Ack response from one of the plurality of cluster interrupt controllers, a hard iteration may be performed in which the powered-off processors may be powered on.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: April 18, 2023
    Assignee: Apple Inc.
    Inventors: Jeffrey E. Gonion, Charles E. Tucker, Tal Kuzi, Richard F. Russo, Mridul Agarwal, Christopher M. Tsay, Gideon N. Levinsky, Shih-Chieh Wen, Lior Zimet
  • Publication number: 20230109984
    Abstract: In an embodiment, a system may include a plurality of component circuits. The plurality of component circuits may include rate control circuits the control power consumption in the component circuits based on indications of power allocated to the component circuits. In an embodiment, the rate control circuits may transmit power requests for the component circuits and a floor request representing a minimum amount of power that may ensure reliable operation.
    Type: Application
    Filed: January 11, 2022
    Publication date: April 13, 2023
    Inventors: Doron Rajwan, Inder M. Sodhi, Keith Cox, Jung Wook Cho, Kevin I. Park, Tal Kuzi
  • Publication number: 20230101217
    Abstract: In an embodiment, a system may include a plurality of component circuits. The plurality of component circuits may include rate control circuits the control power consumption in the component circuits based on indications of power allocated to the component circuits. In an embodiment, the rate control circuits may transmit power requests for the component circuits and a floor request representing a minimum amount of power that may ensure reliable operation.
    Type: Application
    Filed: January 11, 2022
    Publication date: March 30, 2023
    Inventors: Doron Rajwan, Inder M. Sodhi, Keith Cox, Jung Wook Cho, Kevin I. Park, Tal Kuzi
  • Publication number: 20230063331
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
    Type: Application
    Filed: February 21, 2022
    Publication date: March 2, 2023
    Inventors: Ilya Granovsky, Doron Rajwan, Tal Kuzi, Nir Leshem, Lior Zimet
  • Publication number: 20230061898
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Specifically, a power manager circuit in an integrated circuit (e.g., a system on a chip) may modify power budgets for various components in the integrated circuit to reduce the amount of power control caused by external signaling that indicates a voltage regulator overload (e.g., a voltage droop).
    Type: Application
    Filed: February 21, 2022
    Publication date: March 2, 2023
    Inventors: Doron Rajwan, Karl Daniel Wulcan, Tal Kuzi, Inder M. Sodhi, Achmed R. Zahir
  • Publication number: 20230058989
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasan Rangan Sridharan
  • Publication number: 20230031415
    Abstract: A temperature control apparatus is disclosed. An integrated circuit (IC) includes a plurality of temperature sensors, a first thermal control loop, and a second thermal control loop. The first thermal control loop is configured to control temperature of the IC by reducing a frequency of a clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a first temperature threshold. The second thermal control loop is configured to control temperature of the IC by dithering the clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a second temperature threshold that is greater than the first temperature threshold.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 2, 2023
    Inventors: Doron Rajwan, Tal Kuzi, Keith Cox, Yizhang Yang
  • Publication number: 20220357784
    Abstract: Systems, apparatuses, and methods for implementing telemetry push aggregation techniques are described. A computing system includes one or more input/output (I/O) agents interposed between functional units and a communication fabric. A given I/O agent receives a set of aggregation rules from a power management unit. The I/O agent monitors traffic from the functional units, and the I/O agent generates telemetry data from the traffic data based on the set of aggregation rules. The telemetry data is used by the power management unit to make adjustments to one or more power settings.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 10, 2022
    Inventors: Doron Rajwan, Karl Daniel Wulcan, Lital Levy-Rubin, Tal Kuzi
  • Publication number: 20220083484
    Abstract: An interrupt delivery mechanism for a system includes and interrupt controller and a plurality of cluster interrupt controllers coupled to respective pluralities of processors in an embodiment. The interrupt controller may serially transmit an interrupt request to respective cluster interrupt controllers, which may acknowledge (Ack) or non-acknowledge (Nack) the interrupt based on attempting to deliver the interrupt to processors to which the cluster interrupt controller is coupled. In a soft iteration, the cluster interrupt controller may attempt to deliver the interrupt to processors that are powered on, without attempting to power on processors that are powered off. If the soft iteration does not result in an Ack response from one of the plurality of cluster interrupt controllers, a hard iteration may be performed in which the powered-off processors may be powered on.
    Type: Application
    Filed: April 30, 2021
    Publication date: March 17, 2022
    Inventors: Jeffrey E. Gonion, Charles E. Tucker, Tal Kuzi, Richard F. Russo, Mridul Agarwal, Christopher M. Tsay, Gideon N. Levinsky, Shih-Chieh Wen
  • Patent number: 11016556
    Abstract: A parallel multi-step power management flow apparatus and method for using the same are disclosed. In one embodiment, an integrated circuit comprises a plurality of processing entities to execute operations, a power controller coupled to the plurality of processing entities to control power management for the plurality of processing entities, and a plurality of agents, where each of the plurality of agents is operable to perform a power control flow for one of the processing entities by separately scheduling, using a scheduler, and executing a plurality of power control flow phases in response to a plurality of requests received from the power controller, and each agent is operable to send a plurality of acknowledgements, one acknowledgement for each phase, upon completion of the plurality of power control flow phases.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: May 25, 2021
    Assignee: Intel Corporation
    Inventors: Alexander Gendler, Doron Rajwan, Tal Kuzi, Dean Mulla, Ariel Szapiro, Nir Tell
  • Patent number: 10884483
    Abstract: Methods and apparatus relating to autonomous C state mechanism and computational engine alignment for improved processor power efficiency. are described. An embodiment determines whether a semiconductor package should enter a package C state based on energy consumption values for entry into and exit from the package C state, an amount of time the semiconductor package stayed in the package C state previously, and one or more breakeven time points between the various package C states. Another embodiment detects a delay by an imaging computational unit of a processor to enter a low power consumption state relative to one or more other computational units of the processor. The logic causes the imaging computational unit to enter the low power consumption state in response to detection of the delay. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: January 5, 2021
    Assignee: Intel Corporation
    Inventors: Jawad Haj-Yihia, Eliezer Weissmann, Vijay S. R. Degalahal, Nadav Shulman, Tal Kuzi, Itay Franko, Amit Gur, Efraim Rotem
  • Patent number: 10761594
    Abstract: In an embodiment, a processor includes a first core and a power management agent (PMA), coupled to the first core, to include a static table that stores a list of operations, and a plurality of columns each to specify a corresponding flow that includes a corresponding subset of the operations. Execution of each flow is associated with a corresponding state of the first core. The PMA includes a control register (CR) that includes a plurality of storage elements to receive one of a first value and a second value. The processor includes execution logic, responsive to a command to place the first core into a first state, to execute an operation of a first flow when a corresponding storage element stores the first value and to refrain from execution of an operation of the first flow when the corresponding element stores the second value. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Israel Diamand, Asaf Rubinstein, Arik Gihon, Tal Kuzi, Tomer Ziv, Nadav Shulman
  • Publication number: 20200110460
    Abstract: A parallel multi-step power management flow apparatus and method for using the same are disclosed. In one embodiment, an integrated circuit comprises a plurality of processing entities to execute operations, a power controller coupled to the plurality of processing entities to control power management for the plurality of processing entities, and a plurality of agents, where each of the plurality of agents is operable to perform a power control flow for one of the processing entities by separately scheduling, using a scheduler, and executing a plurality of power control flow phases in response to a plurality of requests received from the power controller, and each agent is operable to send a plurality of acknowledgements, one acknowledgement for each phase, upon completion of the plurality of power control flow phases.
    Type: Application
    Filed: July 16, 2019
    Publication date: April 9, 2020
    Inventors: Alexander Gendler, Doron Rajwan, Tal Kuzi, Dean Mulla, Ariel Szapiro, Nir Tell
  • Patent number: 10474216
    Abstract: A method and apparatus for providing power state information using in-band signaling are described. In one embodiment, an integrated circuit (IC) device comprises a controller operable to receive a command from a platform control bus, the command requesting data that is unrelated to information about a power state in which the IC resides; and control logic operable to obtain data for inclusion in a response to the command, wherein the controller is operable to send the response over a bus, the response containing at least a portion of the data responsive to the command and containing power state information for the IC.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: November 12, 2019
    Assignee: INTEL CORPORATION
    Inventors: Doron Rajwan, Dorit Shapira, Itai Feit, Nadav Shulman, Efraim (Efi) Rotem, Tal Kuzi, Eliezer Weissmann, Tomer Ziv, Nir Rosenzweig