Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.

Abstract: An ESD protection device includes a PN diode formed in a semiconductor body. The PN diode has a first contact coupled to a metal structure on a front side of the semiconductor body and a second contact coupled to a metal structure on a back side of the semiconductor body. The metal coupled to the first contact is spaced apart from the metal coupled to the second contact by a thickness of the semiconductor body. This spacing greatly reduces the capacitance associated with the metal structures, which can substantially reduce the overall capacitance added to an I/O channel by the ESD protection device and thereby improve the performance of a high-speed circuit that uses the I/O channel.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

Abstract: The present disclosure discloses methods and systems for controlling a smart lock. The method may include establishing a secure connection with a network, obtaining security control information through the secure connection, obtaining an operation input; performing a security verification based on the security control information and the operation input, and performing a corresponding operation based on the operation input when the security verification is passed.

Abstract: A fluid texturing device is provided for use with a beverage brewing apparatus. In one embodiment, the fluid texturing device can include a housing a housing extending between a first end and a second end. The fluid texturing device can also include a hollow driveshaft arranged within the housing and having an air path extending from the first end to the second end of the housing. The hollow driveshaft can include a coupling arranged therein and axially movable within the hollow driveshaft such that the coupling can variably block the air path to prevent a flow of air through the air path. The fluid texturing device can also include a whisk assembly removably coupled to the second end of the housing and including a whisk mated to the driveshaft such that the driveshaft can rotate the whisk.

Abstract: A polymorphic network control system and a polymorphic network control system method supporting terminal mobile access. A network architecture is redesigned based on the idea of separation of an identifier from a locator. In this network mode, the three-layer protocol is no longer a traditional IP message, but a message carrying a locator and an identifier. The polymorphic SDN network controller is responsible for forwarding the data packet to a destination corresponding to a destination locator. When the network location of a mobile device is changed, the transmission connection established based on the identifier will suspend communication due to the disconnection of the physical link. When the mobile device is re-accessed and a new forwarding path is established, the transmission connection can recover communication.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.

Abstract: An information display method and an apparatus are described wherein a terminal obtains a first operation entered by a user. The terminal further obtains at least one key character based on the first operation. The terminal further determines that characteristic information associated with the key character is stored, and displays target information associated with the characteristic information. The target information is information that is in a set of information associated with the key character and that is associated with the characteristic information. The method can improve information display precision.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: Various exemplary agitators for a carbonation system, systems including an agitator for a carbonation system, and methods including an agitator for a carbonation system are provided. In general, an agitator is configured to rotate in a chamber to mix together a gas, such as carbon dioxide, and a liquid, such as water, to form a carbonated fluid. The agitator includes a plurality of paddles configured to encourage the mixing of the gas and the fluid by agitating the gas and the liquid during the agitator's rotation. Each of the arms has an angled outer tip to facilitate the efficient mixing. The agitator includes a hollow shaft through which the gas is configured to flow during the agitator's rotation. The agitator can be part of a carbonation system configured to dispense the carbonated fluid as a beverage.

Abstract: A heart rate detection method and an apparatus, where the method is applied to an electronic device, and the electronic device includes a heart rate sensor. The method includes detecting, by the electronic device, a current motion status of a user carrying the electronic device, determining, based on a prestored correspondence between a motion status, a startup period, and a sampling rate, a startup period and a sampling rate corresponding to the current motion status, where the startup period is a period in which the heart rate sensor is started to detect a heart rate of the user carrying the electronic device, and the sampling rate is a sampling rate of collecting heart rate data by the heart rate sensor, and starting the heart rate sensor at regular intervals based on the startup period to collect heart rate data at the sampling rate.

Abstract: A method for fabricating an integrated circuit is provided. The method includes etching a first recess in a semiconductor structure; forming a first doped epitaxial feature in the first recess; and forming a second doped epitaxial feature over the first doped epitaxial feature, wherein the second doped epitaxial feature has a conductive type opposite to a conductive type of the first doped epitaxial feature.

Abstract: An ESD clamp circuit has an ESD detection circuit connected between a first terminal and a second terminal, with a first output node and a second output node. The ESD detection circuit is configured to output respective first and second control signals at the first and second output nodes in response to an ESD event. A discharge circuit includes a p-type transistor having a source, a drain and a gate, with the gate connected to the first output node. An n-type transistor has a source, a drain and a gate, with the gate connected to the second output node. The drain is connected to the drain of the p-type transistor. The discharge circuit is configured to establish a first ESD discharge path from the first terminal, through the p-type transistor and the n-type transistor, to the second terminal, and to further establish a second ESD discharge path in parallel with the first ESD discharge path. The second ESD discharge path includes a parasitic silicon controlled rectifier (SCR).

Abstract: A semiconductor device is provided. The semiconductor device comprises a detection circuit electrically coupled between a first node and a second node. The semiconductor device comprises a discharge circuit electrically coupled between the first node and a third node. The semiconductor device comprises a biasing circuit electrically coupled between the second node and the third node. The discharge circuit and the biasing circuit are configured to electrically conduct the first node and the second node in response to receiving a first signal from the detection circuit through a fourth node. A first voltage difference exists between the third node and the fourth node.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus comprises: an internal circuit formed in a first wafer; an array of electrostatic discharge (ESD) circuits formed in a second wafer, wherein the ESD circuits include a plurality of ESD protection devices each coupled to a corresponding switch and configured to protect the internal circuit from a transient ESD event; and a switch controller in the second wafer, wherein the switch controller is configured to control, based on a control signal from the first wafer, each of the plurality of ESD protection devices to be activated or deactivated by the corresponding switch, and wherein the first wafer is bonded to the second wafer.

Abstract: An ESD protection device includes a PN diode formed in a semiconductor body. The PN diode has a first contact coupled to a metal structure on a front side of the semiconductor body and a second contact coupled to a metal structure on a back side of the semiconductor body. The metal coupled to the first contact is spaced apart from the metal coupled to the second contact by a thickness of the semiconductor body. This spacing greatly reduces the capacitance associated with the metal structures, which can substantially reduce the overall capacitance added to an I/O channel by the ESD protection device and thereby improve the performance of a high-speed circuit that uses the I/O channel.