Abstract: A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Abstract: A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Abstract: A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.

Abstract: A method of producing an LTCC substrate having improved cavity bondability is disclosed that involves providing a stack of green ceramic tape sheets having a cavity, placing a template having an opening corresponding to the cavity over the stack, placing a stretchable sheet of material coated with graphite or zinc stearate over the template, isostatically laminating the stack to produce an LTCC substrate having a cavity, and removing the template and sheet of stretchable material from the stack.

Abstract: Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tape sheet to the substructure to form an intermediate structure, and laminating at least a fourth ceramic tape sheet to the intermediate structure to form an LTCC structure.

Abstract: A fixture attached to the rear of the base plate of a semi-automatic screen printer includes an element holder having a vertical recess or pocket for receiving an assembly, such as a substrate, of LTCC laminate material lengthwise therein so as to expose only one side surface to the printing head which would otherwise be prevented because of the height restrictions imposed by the printer head.

Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract: Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.0 and a TCE of 2.0-4.0 ppm/c. The composition is formed from a mixture comprising 25-50 weight percent of a low temperature glass selected from the group consisting of borosilicate glass, zinc borate glass and combinations thereof, 50-75 weight percent of a high temperature glass selected from the group consisting of high silica glass, titanium silicate glass and combinations thereof, and 1-10 weight percent of ceramic material having a particle size of less than about 3 microns. The mixture can be combined with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium. A preferred ceramic material is colloidal alumina.

Abstract: A ceramic composition for forming ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 5.0 ppm/.degree.C. The composition comprises a mixture of finely divided particles of 10-90 vol. % borosilicate glass and 10-90 vol. % of a material selected from the group consisting of Ga.sub.2 O.sub.3, Ga.sub.2 SiO.sub.5, Ga.sub.2 TiO.sub.5, GaAs, GaPO.sub.4 and any gallium-contained compounds to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 3.5 ppm/.degree.C. The composition comprises a mixture of finely divided particles of 20-80 vol. % borosilicate glass and 20-80 vol. % of Al.sub.x B.sub.y O.sub.z wherein x is in the range of 4 to 22, y is in the range of 2 to 5, and z is in the range of 9 to 36. The Al.sub.x B.sub.y O.sub.z inhibits the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 and a TCE of less than about 4.0 ppm/c. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass and sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: The composite insulation coating consists of a mixture of glass and ceramic oxide(s), coated onto a wire by conventional wire enameling techniques followed by heat treatment at 600.degree.-850.degree. C. The enamel when initially applied, the "green" coat slurry, consists of four components: (1) the glass, (2) an inorganic filler (ceramic oxide powder, (3) an organic binder and (4) an organic solvent. The glasses can be selected from several commercial glasses (Corning 7570 and 7050) as well as Westinghouse glasses A-508, M 3072 and M 3073. None of these glasses contain lead or boron, allowing for nuclear applications. Suitable ceramic fillers are alumina, and the CeramPhysics, Inc. ceramics SC1C and SC1A. Organic binder materials and solvents are used. It is preferable that a copper wire to be coated with Ni, Inconel or Cr prior to coating with the subject insulation. For superconductors, the brittle nature of Nb.sub.3 Sn wire and the high reaction temperature (.about.700.degree. C.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 4.5 ppm/.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass 40-75 vol. % silica glass and 1-40 wt. % of a material selected from the group consisting of Ga.sub.2 O.sub.3, Ga.sub.2 SiO.sub.5, Ga.sub.2 TiO.sub.5, GaAs, GaPO.sub.4 and any gallium-contained compounds to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: The need for high current, high field, low loss, stable superconductors has led to the development of multifilamentary Nb.sub.3 Sn as the most promising candidate for use in superconducting machines. However, the brittle nature of Nb.sub.3 Sn and the high reaction temperature (.about.700.degree. C.) required to form it preclude the use of standard organic insulation systems. A recently developed class of high temperature dielectric materials which are characterized by unusually large specific heats and thermal conductivities at cryogenic temperatures offers the opportunity of providing increased enthalpy stabilization in a superconducting winding, as well as the required dielectric strength. The inorganic insulation system consists of a composite glass and ceramic powder vitrified at a temperature which coincides with the superconducting formation temperature of 600.degree.-800.degree. C.

Abstract: A glass-ceramic composition for forming a glass-ceramic dielectric body having a dielectric constant of less than about 4.5, a firing temperature of less than about 950.degree. C. and a sintered density of greater than 95% theoretical density. The composition is formed from a mixture consisting essentially of finely divided particles of 40-50 vol. % borosilicate glass and 50-60 vol. % cordierite. The borosilicate glass comprises approximately 20-35 wt. % B.sub.2 O.sub.3 and approximately 60-75 wt. % SiO.sub.2. The exact particle size ratio of the cordierite to borosilicate glass that is used will depend on the proportions of the components, the desired fired density and the firing temperature. The mixture is fired at a temperature of less than 1000.degree. C.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.5 and a TCE of less than about 4.0 ppm/c. The composition comprises a mixture of 20-50 wt. % borosilicate glass 40-75 wt. % of a glass selected from the group consisting of glass containing 95-98 wt. % silica, titanium silicate glass and combinations thereof and sufficient amounts of gallium to inhibit the formation of crystalline forms of silica. The composition can be combined with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree.C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 20-50 wt. % borosilicate glass, 40-75 wt. % titanium silicate glass and sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Abstract: A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree. C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.