Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.

Abstract: Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (202), a fast connector (204), and a first interface (2011), where the fast connector (204) includes a first connector (2041) and a second connector (2042), where the first connector (2041) is fixedly connected to the cold plate (202); the first interface (2011) is configured to connect to a second interface (2012) corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (203), where the guide rail (203) is a moving rail of the second connector (2042), and when the first connector (2041) and the second connector (2042) are in a connected state and the second connector (2042) is located at an end on the guide rail (203) that is close to a board (201), a distance between the first interface (2011) and the second interface (2012) is greater than 0.

Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).

Abstract: A free cooling system apparatus applied to communication equipment includes: an air intake apparatus that is disposed at an air intake of the communication equipment, where the air intake apparatus includes an air intake duct, where the air intake duct has an opening below the air intake of the communication equipment to allow an airflow to enter the air intake duct through the opening, and a filtering module is disposed inside the air intake duct; and the filtering module includes a substrate and grass-like fibers, where the substrate is attached to a sidewall of the air intake duct, roots of the grass-like fibers are fixed onto the substrate, and tips of the grass-like fibers are suspended inside the air intake duct of the air intake apparatus and are transversely placed in the air intake duct along a direction of a cross section of the air intake duct.

Abstract: A heat dissipation apparatus comprises: one or more thermosiphon heat exchange units, one or more first partitions, and a frame having at least two lattices; wherein, each of the one or more thermosiphon heat exchange units is embedded in one lattice of the at least two lattices; each lattice of the at least two lattices having no thermosiphon heat exchange unit embedded is disposed with the first partition to partition the lattice into an upper portion and a lower portion, where the first partition is detachable. The outdoor communication device comprises the heat dissipation apparatus and one or more service board. Through a modular design, the number of the embedded thermosiphon heat exchange units can be increased or decreased at any time depending on heat dissipation performance that is required.

Abstract: The present invention relates to a communication device, and in particular, to a Remote Radio Unit (RRU). The RRU includes an RRU radiator structural member and a shell, where the shell includes an evaporator, radiating pipes and a shell body, the inside of the evaporator is in communication with the radiating pipes to form a loop for holding a phase change medium, and the radiating pipes are disposed on the shell body; and the evaporator is connected to a radiator of the RRU radiator structural member. By using the RRU according to the present invention, the radiating efficiency can be improved.

Abstract: Embodiments of the present invention disclose a heat dissipation device, including: a closed shell and a temperature control device. The temperature control device includes: a cold storage medium module, a first group of thermosiphons, and a second group thermosiphons; wherein the cold storage medium module is disposed at the outside of the closed shell, the first group thermosiphons are provided with a first group of evaporation ends and a first group of condensation ends, and the second group of thermosiphons are provided with a second group of evaporation ends and a second group of condensation ends. Embodiments of the present invention also disclose a communication device and a heat dissipation method for a communication device. The above technical solutions save electric energy and improve the effects of energy saving and emission reduction of the system.

Abstract: A heat exchanger, a heat dissipation method and a communication apparatus are provided. The heat exchanger includes a first and a second air passage separated from each other. The first air passage has a first fan unit and a first group of heat dissipation tubules. The second air passage has a second fan unit and a second group of heat dissipation tubules. The upper ends of the first and second group of heat dissipation tubules are communicated with each other via a steam manifold. The lower ends of the first and second group of heat dissipation tubules are communicated with each other via a liquid manifold. A closed pipeline filled with liquid vaporized when heated, is formed by the first and second group of dissipation tubules, the steam manifold and the liquid manifold. Heat dissipation fins are set among the first and second group of dissipation tubules.

Abstract: A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.

Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).