TEC DEVICE AND ELECTRICAL DEVICE APPLYING THE TEC DEVICE

Abstract

A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No. PCT/CN2011/074881, filed on 30 May 20011, which claims priority to Chinese Patent Application No. 201010559094.8, filed with the Chinese Patent Office on Nov. 25, 2010 and entitled “TEC DEVICE AND ELECTRICAL DEVICE APPLYING THE TEC DEVICE”, which is incorporated herein by reference in its entirety.

FIELD

The present disclosure relates to a cooling device, and in particular, to a Thermoelectric Cooling (TEC) device and an electrical device applying the TEC device.

BACKGROUND

In the field of communications, electronic components have a high requirement on the temperature of a working environment. When a communication apparatus runs, the communication apparatus generally dissipates heat, and the dissipated heat gathers in a surrounding environment of an electronic apparatus, causing the temperature of the working environment of the electronic apparatus to rise. When the temperature rises to a certain degree, the electronic component cannot work normally. In order to ensure that the electronic component works normally, a cooling air conditioner usually needs to be installed for the electronic component. However, the size of the cooling air conditioner is large, which is inconsistent with the miniaturization trend of the apparatus at present. In addition, a refrigerant used in the cooling air conditioner seriously pollutes the environment, which is inconsistent with the environmental protection concept at present.

Therefore, a TEC module, being small in size and not requiring the refrigerant, has become an ideal substitute of the cooling air conditioner. The TEC module generally includes a cold end and a hot end. In order to improve the cooling efficiency of the TEC module, a fan is respectively disposed at the cold end and the hot end of the TEC module, and the heat dissipation efficiency of the TEC module is controlled through a rotation speed of the fan. However, the TEC module with such structure makes loud noises and has great power consumption, which is inconsistent with the environmental protection concept. Therefore, how to decrease the energy consumption of the TEC module has become an urgent problem to be solved.

SUMMARY

Embodiments of the present disclosure provide an environmental-friendly TEC device with low energy consumption, and an electrical device applying the TEC device.

A TEC device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module. The second heat exchange device includes an evaporation end and a condensation end. The evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end. A cooling medium is disposed in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.

An electrical device includes a cabinet and a TEC device disposed on the cabinet, in which the cabinet includes a cabinet body. The TEC device includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end. The first heat exchange device is disposed at the cold end of the TEC module and is connected to the cabinet body. The second heat exchange device is disposed at the hot end of the TEC module. The second heat exchange device includes an evaporation end and a condensation end. The evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end. A cooling medium is disposed in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.

In the embodiments of the present disclosure, the TEC device and the electrical device applying the TEC device adopt the second heat exchange device, which is capable of performing fast heat dissipation, to accelerate heat exchange with the hot end of the TEC module, thereby increasing the heat exchange rate. Meanwhile, a fan does not need to be disposed at the hot end of the TEC module, thereby saving the energy, and achieving the objective of environmental protection.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of an electrical device according to a first embodiment of the present disclosure; and

FIG. 2 is a schematic diagram of an electrical device according to a second embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

An embodiment of the present disclosure provides a TEC device, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to perform heat exchange with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module. The second heat exchange device includes an evaporation end and a condensation end. A cooling medium is disposed in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner, in which the evaporation end adjoins the hot end of the TEC module.

The TEC device provided in the embodiment of the present disclosure adopts the second heat exchange device, which is capable of performing fast heat dissipation, to accelerate heat exchange with the hot end of the TEC module, thereby improving the heat exchange efficiency, so as to achieve the objectives of energy saving and environmental protection. The present disclosure is hereinafter described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of an electrical device 10 according to a first embodiment of the present disclosure. The electrical device 10 includes a cabinet 100 and a TEC device 200 disposed on the cabinet 100.

The cabinet 100 includes a cabinet body 120, multiple electrical components 140 disposed in the cabinet body 120, and a protection cover 130 disposed at a side of the cabinet body 120.

The TEC device 200 is disposed on the cabinet body 120, and is configured to cool the electrical components 140 in the cabinet body 120. The protection cover 130 covers the TEC device 200, so as to protect the TEC device 200.

The TEC device 200 includes a TEC module 210, a first heat exchange device 220, and a second heat exchange device 230.

The TEC module 210 is a cooling element, which includes a cold end 212 and a hot end 214 corresponding to the cold end 212. The cold end 212 is capable of absorbing heat in a surrounding environment, and the hot end 214 is configured to dissipate heat to the surrounding environment.

During a process of using, the cold end 212 of the TEC module 210 needs to correspond to or contact a heat source, so as to absorb heat of the heat source, thereby cooling the heat source. The hot end 214 is configured to dissipate heat absorbed by the cold end 212 to the outside.

In this embodiment, in order to increase the heat dissipation efficiency of the hot end 214 of the TEC module 210, a heat conducting plate 216 may be disposed on the hot end 214, and the heat conducting plate 216 is preferentially made of a material with high thermal conductivity such as copper, aluminum, alloy, or heat conducting graphite. A heat conducting stuffing material may be filled between contact interfaces of the heat conducting plate 216 and the hot end 214, so as to increase a contact area between the heat conducting plate 216 and the hot end 214, thereby reducing the thermal resistance and increasing the heat conducting efficiency.

The first heat exchange device 220 is disposed at the cold end 212 of the TEC module 210, and is connected to the cabinet body 120. In this embodiment, the first heat exchange device 220 is located inside the cabinet 100, and is configured to increase a heat exchange area of the cold end 212 of the TEC module 210, so as to increase the heat exchange efficiency.

In this embodiment, the first heat exchange device 220 may be a heat sink fin array made of a material with high thermal conductivity (such as copper, aluminum, or heat conducting graphite). The first heat exchange device 220 may also be a device with high thermal conductivity such as a heat pipe, a thermal siphon, or a vapor cavity.

The second heat exchange device 230 is disposed at the hot end 214 of the TEC module 210, and is configured to accelerate diffusion of heat that is at the hot end 214 of the TEC module 210.

In this embodiment, the second heat exchange device 230 includes an evaporation end 232, a condensation end 234, and a cooling medium 236 which is disposed in the second heat exchange device 230 and is configured to perform heat exchange at the evaporation end 232 and the condensation end 234 in a phase transition manner.

The evaporation end 232 adjoins or contacts the hot end 214 of the TEC module 210, and the condensation end 234 is away from the evaporation end 232.

In this embodiment, the evaporation end 232 inserts in and is fitted on the heat conducting plate 216 of the TEC module 210.

In order to further improve the heat exchange rate of the second heat exchange device 230 with a surrounding environment, multiple heat dissipation plates 238 may be disposed on the second heat exchange device 230. The heat dissipation plates 238 are disposed between the evaporation end 232 and the condensation end 234 with uniform intervals, and are configured to increase a contact area between the second heat exchange device 230 and the surrounding space, so that heat collected by the second heat exchange device 230 is carried away through natural convection of air.

The second heat exchange device 230 is located at an external side of the cabinet body 120 and is in thermal insulation with the internal space of the cabinet body 120. The protection cover 130 accommodates the second heat exchange device 230.

In this embodiment, the second heat exchange device 230 may be a device with high thermal conductivity such as a heat pipe, a thermal siphon, or a vapor cavity.

During the process of using, the TEC device 200 cools the internal space of the cabinet body 120 through the cold end 212 of the TEC module 210, thereby ensuring that the electrical components 140 disposed in the cabinet body 120 work at an appropriate temperature. The evaporation end 232 of the second heat exchange device 230 disposed at the hot end 214 of the TEC module 210 absorbs the heat dissipated by the hot end 214, so that the cooling medium 236 at the evaporation end 232 is vaporized. The vaporized cooling medium 236 moves towards the condensation end 234 of the second heat exchange device 230, and is condensed at the condensation end 234 to release heat. The second heat exchange device 230 performs fast heat transfer and dissipation through circular phase transition of the cooling medium 236 between the condensation end 234 and the evaporation end 232, so as to achieve an objective of cooling the internal space of the cabinet 100.

The TEC device 200 accelerates heat exchange with the hot end 214 of the TEC module 210 through the second heat exchange device 230 that is capable of performing fast heat dissipation, thereby improving the heat exchange rate. Meanwhile, a fan does not need to be disposed at the hot end 214 of the TEC module 210, therefore saving the energy and resources and reducing the noises, so as to achieve the objective of environmental protection.

In order to cool the internal space of the cabinet 100 uniformly, the TEC device 200 may further include a cold end fan 240. The cold end fan 240 is disposed at an external side of the first heat exchange device 220, so as to accelerate a convection speed of media in the space where the first heat exchange device 220 is located, thereby achieving the objective of uniform cooling of the TEC device 220.

FIG. 2 is a schematic diagram of an electrical device 20 according to a second embodiment of the present disclosure. The electrical device 20 includes a cabinet 300 and a TEC device 400 disposed on the cabinet 300.

The cabinet 300 includes a cabinet body 310, multiple electrical components 320 disposed in the cabinet body 310, and a protection cover 330 disposed at a side of the cabinet body 300

The TEC device 400 includes a TEC module 410, a first heat exchange device 440, and a second heat exchange device 430.

The TEC module 410 includes a cold end 412 and a hot end 414 corresponding to the cold end.

The first heat exchange device 440 and the second heat exchange device 430 are respectively disposed at the cold end 412 and the hot end 414 of the TEC module 410.

In this embodiment, the TEC module 410 further includes a heat conducting plate 416 disposed between the hot end 414 and the second heat exchange device 430 for conducting heat.

The first heat exchange device 440 includes a heat dissipation block 422, a first heat conducting member 424, a temperature control phase transition module 426, and a second heat conducting member 428.

The heat dissipation block 422 is disposed at the cold end 412 of the TEC module 410. An end of the first heat conducting member 424 is disposed on the heat dissipation block 422 and contacts the heat dissipation block 422. Another end of the first heat conducting member 424 is connected to the temperature control phase transition module 426.

In this embodiment, the first heat conducting member 424 may be a device with high thermal conductivity such as a heat pipe, a thermal siphon, or a vapor cavity, and includes an evaporation end 424a and a condensation end 424b. The condensation end 424b is disposed at the heat dissipation block 422, and the evaporation end 424a is connected to the temperature control phase transition module 426.

The temperature control phase transition module 426 is disposed on the cabinet body 310 of the cabinet 300, and the temperature control phase transition module 426 may be made of a phase transition material such as a paraffin material. The temperature control phase transition module 426 appears in different phases at different temperatures, so as to accumulate certain amount of heat or cold energy, thereby ensuring that an internal temperature of the cabinet 300 does not change violently to affect the operation of the electrical components 320.

An end of the second heat conducting member 428 is disposed on the temperature control phase transition module 426, and another end stretches into the cabinet body 310. In this embodiment, the second heat conducting member 428 may be the same device of high thermal conductivity as the first heat conducting member 424, and includes an evaporation end 428a and a condensation end 428b. The condensation end 428b of the second heat conducting member 428 is disposed on the temperature control phase transition module 426, and the evaporation end 428a stretches into the cabinet body 310.

It can be understood that the evaporation end and the condensation end of the first heat conducting member 424 and the evaporation end and the condensation end of the second heat conducting member 428 are not unchangeable. The condensation end and the evaporation end are defined according to a temperature difference of two ends of the heat conducting member, for example, an end with a higher temperature is the evaporation end, and correspondingly, an end with a relatively lower temperature is the condensation end.

The second heat exchange device 430 is disposed at the hot end 414 of the TEC module 410. In this embodiment, the second heat exchange device 430 includes an evaporation end 432, a condensation end 434, and a cooling medium 436 which is disposed in the second heat exchange device 430 and is configured to perform heat exchange at the evaporation end 432 and the condensation end 434 through a phase transition manner.

The evaporation end 432 adjoins or contacts the hot end 414 of the TEC module 410, and the condensation end 434 is away from the evaporation end 432. In this embodiment, the evaporation end 432 inserts in and is fitted on the heat conducting plate 416 of the TEC module 410.

In order to further improve the heat exchange rate of the second heat exchange device 430 with a surrounding environment, multiple heat dissipation plates 438 may be disposed on the second heat exchange device 430. The heat dissipation plates 438 are disposed between the evaporation end 432 and the condensation end 434 with uniform intervals, and are configured to increase a contact area between the second heat exchange device 430 and the surrounding space, so that heat collected by the second heat exchange device 430 is carried away through natural convection of air.

The second heat exchange device 430 is located at an external side of the cabinet body 310, and is in thermal insulation with the internal space of the cabinet body 310. The protection cover 330 accommodates the second heat exchange device 430.

In this embodiment, the second heat exchange device 430 may be a device with high thermal conductivity such as a heat pipe, a thermal siphon, or a vapor cavity.

The TEC device 400 provided in this embodiment adopts the second heat exchange device 430, which is capable of performing fast heat dissipation, to accelerate heat exchange with the hot end 414 of the TEC module 410, thereby improving the heat exchange rate. Meanwhile, a fan does not need to be disposed at the hot end 414 of the TEC module 410, therefore saving the energy and resources and reducing the noises, so as to achieve the objective of environmental protection. In addition, certain amount of heat or cold energy is stored through the temperature control phase transition module 426 of the first heat exchange device 420, so as to maintain an internal temperature of the cabinet 300 in a certain range, so that the TEC device 400 and the electrical device 20 that applies the TEC device 400 can maintain a relatively stable working temperature in an environment with a great temperature difference.

The above embodiments are merely exemplary embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the present disclosure shall fall within the protection scope of the present disclosure.

Claims

1. A Thermoelectric Cooling (TEC) device, comprising a TEC module, a first heat exchange device, and a second heat exchange device, wherein

the TEC module comprises a cold end and a hot end;

the first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module;

the second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device comprises an evaporation end and a condensation end; the evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end; and

a cooling medium is accommodated in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.

2. The TEC device according to claim 1, wherein the first heat exchange device is a heat sink fin array, and is made of copper, aluminum, or heat conducting graphite.

3. The TEC device according to claim 1, further comprising: a cold end fan, disposed at an external side of the first heat exchange device.

4. The TEC device according to claim 1, wherein the first heat exchange device comprises a heat dissipation block, a first heat conducting member, a temperature control phase transition module, and a second heat conducting member;

the heat dissipation block is disposed at the cold end of the TEC module;

an end of the first heat conducting member is disposed on the heat dissipation block, and another end of the first heat conducting member is connected to the temperature control phase transition module; and

the second heat conducting member is disposed on the temperature control phase transition module through an end.

5. The TEC device according to claim 4, wherein the first heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and

the first heat conducting member comprises an evaporation end and a condensation end, the condensation end of the first heat conducting member is disposed on the heat dissipation block, and the evaporation end of the first heat conducting member is connected to the temperature control phase transition module.

6. The TEC device according to claim 4, wherein the second heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and

the second heat conducting member comprises a vapor end and a condensation end, and the second heat conducting member is disposed on the temperature control phase transition module through the condensation end.

7. The TEC device according to claim 1, wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at the hot end of the TEC module, and the evaporation end of the second heat exchange device inserts in and is fitted on the heat conducting plate of the TEC module.

8. The TEC device according to claim 1, wherein the second heat exchange device further comprises multiple heat dissipation plates, and the heat dissipation plates are disposed between the evaporation end and the condensation end with uniform intervals.

9. An electrical device, comprising a cabinet and a Thermoelectric Cooling (TEC) device disposed on the cabinet, wherein the cabinet comprises a cabinet body, and the TEC device comprises a TEC module, a first heat exchange device, and a second heat exchange device;

the TEC module comprises a cold end and a hot end;

the first heat exchange device is disposed at the cold end of the TEC module and connected to the cabinet body, and is configured to exchange heat with a medium surrounding the cold end of the TEC module;

the second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device comprises an evaporation end and a condensation end; the evaporation end adjoins or contacts the hot end of the TEC module, and the condensation end is away from the evaporation end; and

a cooling medium is accommodated in the second heat exchange device, and the cooling medium is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner.

10. The electrical device according to claim 9, wherein the first heat exchange device is a heat sink fin array, and is made of copper, aluminum, or heat conducting graphite.

11. The electrical device according to claim 9, wherein the first heat exchange device comprises a heat dissipation block, a first heat conducting member, a temperature control phase transition module, and a second heat conducting member;

the heat dissipation block is disposed at the cold end of the TEC module;

an end of the first heat conducting member is disposed on the heat dissipation block, and another end of the first heat conducting member is connected to the temperature control phase transition module;

the temperature control phase transition module is disposed on the cabinet; and

an end of the second heat conducting member is disposed on the temperature control phase transition module, and another end of the second heat conducting member stretches into the cabinet.

12. The electrical device according to claim 11, wherein the first heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and

the first heat conducting member comprises an evaporation end and a condensation end, the condensation end of the first heat conducting member is disposed on the heat dissipation block, and the evaporation end of the first heat conducting member is connected to the temperature control phase transition module.

13. The electrical device according to claim 11, wherein the second heat conducting member is a heat pipe, a thermal siphon, or a vapor cavity; and

the second heat conducting member comprises an evaporation end and a condensation end, the second heat conducting member is disposed on the temperature control phase transition module through the condensation end, and the evaporation end of the second heat conducting member is located in the cabinet.

14. The electrical device according to claim 9, wherein the TEC module further comprises a heat conducting plate, the heat conducting plate is disposed at the hot end of the TEC module, and the evaporation end of the second heat exchange device is fixedly inserted on the heat conducting plate of the TEC module.

15. The electrical device according to claim 9, wherein the second heat exchange device further comprises multiple heat dissipation plates, and the heat dissipation plates are disposed between the evaporation end and the condensation end with uniform intervals.