Patents by Inventor Taro Hirai
Taro Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11183918Abstract: In an abnormality determination system, when a drive signal is input and no shutdown signal for stopping gate drive of switching elements is input, a signal switching section outputs the drive signal to a bridge circuit. When a shutdown signal is input, the signal switching section stops output of the drive signal and activates a shutdown function of an inverter. An abnormality determination section determines an abnormality in the shutdown function. When a power source relay is opened, a control unit drives the bridge circuit to start a discharge process of discharging electric charge from a smoothing capacitor, and activates the shutdown function during execution of the discharge process. When it is determined that a directly or indirectly detected voltage of the smoothing capacitor has dropped during operation of the shutdown function, the abnormality determination section determines that the shutdown function is abnormal.Type: GrantFiled: July 11, 2019Date of Patent: November 23, 2021Assignee: DENSO CORPORATIONInventors: Masanori Yamamura, Taro Hirai
-
Patent number: 11108152Abstract: An antenna-integrated wireless module comprises a substrate having a first surface and including a wireless region and an antenna region. A wireless functional section is in the wireless region and includes an RF circuit on the first surface or in the substrate. An antenna section is in the antenna region and includes an antenna conductor. A resin sealing layer covers at least a part of the first surface. A thickness of the resin sealing layer in a portion overlapping the antenna region may be thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region such that the resin sealing layer may have a step at a location between the wireless region and the antenna region; or the substrate may have a step at a boundary between the wireless region and the antenna region, and the resin sealing layer may not the cover the step.Type: GrantFiled: December 30, 2019Date of Patent: August 31, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuichi Ito, Taro Hirai, Katsuhiko Fujikawa
-
Publication number: 20200144715Abstract: An antenna-integrated wireless module comprises a substrate having a first surface and including a wireless region and an antenna region. A wireless functional section is in the wireless region and includes an RF circuit on the first surface or in the substrate. An antenna section is in the antenna region and includes an antenna conductor. A resin sealing layer covers at least a part of the first surface. A thickness of the resin sealing layer in a portion overlapping the antenna region may be thinner than a thickness of the resin sealing layer in a portion overlapping the wireless region such that the resin sealing layer may have a step at a location between the wireless region and the antenna region; or the substrate may have a step at a boundary between the wireless region and the antenna region, and the resin sealing layer may not the cover the step.Type: ApplicationFiled: December 30, 2019Publication date: May 7, 2020Inventors: Yuichi ITO, Taro HIRAI, Katsuhiko FUJIKAWA
-
Patent number: 10581157Abstract: An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.Type: GrantFiled: December 21, 2017Date of Patent: March 3, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yuichi Ito, Taro Hirai, Katsuhiko Fujikawa
-
Publication number: 20200021185Abstract: In an abnormality determination system, when a drive signal is input and no shutdown signal for stopping gate drive of switching elements is input, a signal switching section outputs the drive signal to a bridge circuit. When a shutdown signal is input, the signal switching section stops output of the drive signal and activates a shutdown function of an inverter. An abnormality determination section determines an abnormality in the shutdown function. When a power source relay is opened, a control unit drives the bridge circuit to start a discharge process of discharging electric charge from a smoothing capacitor, and activates the shutdown function during execution of the discharge process. When it is determined that a directly or indirectly detected voltage of the smoothing capacitor has dropped during operation of the shutdown function, the abnormality determination section determines that the shutdown function is abnormal.Type: ApplicationFiled: July 11, 2019Publication date: January 16, 2020Applicant: DENSO CORPORATIONInventors: Masanori YAMAMURA, Taro HIRAI
-
Publication number: 20180115061Abstract: An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.Type: ApplicationFiled: December 21, 2017Publication date: April 26, 2018Inventors: Yuichi Ito, Taro Hirai, Katsuhiko Fujikawa
-
Patent number: 9887454Abstract: An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.Type: GrantFiled: January 28, 2016Date of Patent: February 6, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Yuichi Ito, Taro Hirai, Katsuhiko Fujikawa
-
Patent number: 9614271Abstract: A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.Type: GrantFiled: August 27, 2013Date of Patent: April 4, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Morihiro Nakano, Yuichi Ito, Taro Hirai, Hidetaka Kuwahara
-
Publication number: 20160149300Abstract: An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.Type: ApplicationFiled: January 28, 2016Publication date: May 26, 2016Inventors: Yuichi Ito, Taro Hirai, Katsuhiko Fujikawa
-
Patent number: 9200552Abstract: In an apparatus for controlling supply power to a conductive porous carrier of a catalyst converter for cleaning an emission, a moisture determiner determines whether moisture is contained in and/or on the conductive porous carrier. A power controller controls supply power to the conductive porous carrier for energization of the conductive porous carrier such that a value of the supply power to the conductive porous carrier when it is determined that the moisture is contained in and/or on the conductive porous carrier is lower than a value of the supply power to the conductive porous carrier when it is determined that the moisture is not contained in and/or on the conductive porous carrier.Type: GrantFiled: April 28, 2011Date of Patent: December 1, 2015Assignee: DENSO CORPORATIONInventors: Taro Hirai, Noriaki Ikemoto, Takeshi Harada, Naoyuki Kamiya, Hisashi Iida
-
Patent number: 8775051Abstract: An apparatus is used for diagnosing the temperature state of a catalyst converter. The catalyst converter includes a catalyst for cleaning an emission, and a conductive carrier for carrying the catalyst. The conductive carrier is energized for temperature rise of the catalyst, and the conductive carrier has a characteristic in which resistance drops with temperature increase. In the apparatus, a first obtaining unit obtains a first parameter having a first correlation with supply power to the conductive carrier for energization of the conductive carrier. A second obtaining unit obtains a second parameter having a second correlation with a temperature of the conductive carrier. A diagnosing unit diagnoses the temperature state of the conductive carrier based on a comparison between the first parameter and the second parameter.Type: GrantFiled: April 28, 2011Date of Patent: July 8, 2014Assignee: Denso CorporationInventors: Taro Hirai, Noriaki Ikemoto, Takeshi Harada, Naoyuki Kamiya, Hisashi Iida
-
Patent number: 8751187Abstract: In an apparatus, a temperature obtainer obtains, in a learning mode of the apparatus during a conductive carrier being deenergized a, value of a carrier temperature based on a physical parameter correlative with the carrier temperature and different from a carrier resistance. A resistance obtainer instantaneously energizes, in the learning mode, the conductive carrier to obtain a value of the carrier resistance during the instant energization. A calculator obtains, in a normal operation mode of the apparatus after the learning mode, a value of the carrier resistance, and calculates, in the normal operation mode, a value of the carrier temperature based on: the obtained value of the carrier resistance in the normal operation mode, and a pair of the value of the carrier temperature and the value of the carrier resistance obtained in the learning mode.Type: GrantFiled: April 28, 2011Date of Patent: June 10, 2014Assignee: Denso CorporationInventors: Taro Hirai, Noriaki Ikemoto, Takeshi Harada, Naoyuki Kamiya
-
Publication number: 20140125540Abstract: An RF signal input and output to and from a communication unit is extracted to outside of an antenna module before the RF signal is routed through a matching circuit unit and an antenna unit and a variation occurs, and the RF signal is accurately measured and inspected using a high-frequency wave measuring instrument such as a network analyzer. When the characteristics of the antenna unit have fluctuated or been deteriorated after the antenna module has been installed in a communication device, a measure is implemented by connecting an external matching circuit unit or an external antenna unit to a signal extraction unit.Type: ApplicationFiled: October 28, 2013Publication date: May 8, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Hiroyuki TETSUNO, Taro HIRAI
-
Publication number: 20140091983Abstract: A wireless communication module includes a circuit board, and an antenna and a connection member mounted on a mounting surface of the circuit board. The antenna is mounted in a region along a first end edge of the circuit board, and the connection member is mounted in a region along a second end edge of the circuit board.Type: ApplicationFiled: August 27, 2013Publication date: April 3, 2014Applicant: Murata Manufacturing Co., Ltd.Inventors: Morihiro NAKANO, Yuichi ITO, Taro HIRAI, Hidetaka KUWAHARA
-
Patent number: 8431827Abstract: Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.Type: GrantFiled: June 8, 2011Date of Patent: April 30, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Hiroshi Nishikawa, Taro Hirai
-
Publication number: 20110268613Abstract: An apparatus is used for diagnosing the temperature state of a catalyst converter. The catalyst converter includes a catalyst for cleaning an emission, and a conductive carrier for carrying the catalyst. The conductive carrier is energized for temperature rise of the catalyst, and the conductive carrier has a characteristic in which resistance drops with temperature increase. In the apparatus, a first obtaining unit obtains a first parameter having a first correlation with supply power to the conductive carrier for energization of the conductive carrier. A second obtaining unit obtains a second parameter having a second correlation with a temperature of the conductive carrier. A diagnosing unit diagnoses the temperature state of the conductive carrier based on a comparison between the first parameter and the second parameter.Type: ApplicationFiled: April 28, 2011Publication date: November 3, 2011Applicant: DENSO CORPORATIONInventors: Taro HIRAI, Noriaki IKEMOTO, Takeshi HARADA, Naoyuki KAMIYA, Hisashi IIDA
-
Publication number: 20110265460Abstract: In an apparatus for controlling supply power to a conductive porous carrier of a catalyst converter for cleaning an emission, a moisture determiner determines whether moisture is contained in and/or on the conductive porous carrier. A power controller controls supply power to the conductive porous carrier for energization of the conductive porous carrier such that a value of the supply power to the conductive porous carrier when it is determined that the moisture is contained in and/or on the conductive porous carrier is lower than a value of the supply power to the conductive porous carrier when it is determined that the moisture is not contained in and/or on the conductive porous carrier.Type: ApplicationFiled: April 28, 2011Publication date: November 3, 2011Applicant: DENSO CORPORATIONInventors: Taro Hirai, Noriaki Ikemoto, Takeshi Harada, Naoyuki Kamiya, Hisashi Iida
-
Publication number: 20110270568Abstract: In an apparatus, a temperature obtainer obtains, in a learning mode of the apparatus during a conductive carrier being deenergized a, value of a carrier temperature based on a physical parameter correlative with the carrier temperature and different from a carrier resistance. A resistance obtainer instantaneously energizes, in the learning mode, the conductive carrier to obtain a value of the carrier resistance during the instant energization. A calculator obtains, in a normal operation mode of the apparatus after the learning mode, a value of the carrier resistance, and calculates, in the normal operation mode, a value of the carrier temperature based on: the obtained value of the carrier resistance in the normal operation mode, and a pair of the value of the carrier temperature and the value of the carrier resistance obtained in the learning mode.Type: ApplicationFiled: April 28, 2011Publication date: November 3, 2011Applicant: DENSO CORPORATIONInventors: Taro HIRAI, Noriaki IKEMOTO, Takeshi HARADA, Naoyuki KAMIYA
-
Publication number: 20110239457Abstract: Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area.Type: ApplicationFiled: June 8, 2011Publication date: October 6, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Hiroshi NISHIKAWA, Taro HIRAI
-
Publication number: 20030104184Abstract: A multiple mother board holding electronic components has frame-shaped reinforcing conductive films surrounding peripheries on both surfaces of the mother board. In the conductive films, plural minute openings are formed such that positions of the openings on both surfaces are shifted from each other.Type: ApplicationFiled: November 26, 2002Publication date: June 5, 2003Applicant: NEC ELECTRONICS CORPORATIONInventors: Taro Hirai, Shigekazu Hino, Gorou Ikegami, Yukitaka Tokumoto