Abstract: A housing cap for an optical ranging sensor and an electronic system for transmitting and receiving optical radiation while minimizing optical noise, such as ambient light, received at the reference sensor of the optical ranging sensor are provided. An example housing cap for an optical ranging sensor may include a barrier wall defining a transmission cavity and a receiving cavity. The transmission cavity including an optical radiation source positioned to direct ranging optical radiation through a transmission opening toward a target object, a reference sensor positioned to receive a portion of the ranging optical radiation, and an attenuation wall positioned between the optical radiation source and the reference sensor, defining an attenuation gap through which the portion of the ranging optical radiation passes. The receiving cavity including an optical radiation receiver positioned to receive ranging optical radiation reflected off the target object through a receiver opening.

Abstract: The present disclosure provides a substrate assembly for an optical sensor module. An example substrate assembly for an optical sensor module comprising: a light-emitting device mounted on a first region of a substrate; a metal shielding assembly comprising a first metal shielding assembled to the substrate over the first region; and wherein the first metal shielding comprises a first opening providing an optical path for light emitted by the light-emitting device, the first opening being dimensioned such that the light-emitting device can be inserted through the first opening inside the first metal shielding.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap comprising a metal casing and a molded part made of a molding material lining the inside surfaces of the metal casing.

Abstract: Example embodiments of the present disclosure provide an optical module sensor. An example optical module sensor may include an optical radiation-emitting device, a reference, an optical radiation receiver positioned, an electromagnetic interference shield, and a housing cap. The housing cap may include a barrier wall positioned such that the housing cap defines a transmission cavity and a receiving cavity. The optical radiation-emitting device and the reference sensor may be positioned within the transmission cavity and the optical radiation receiver may be positioned within the receiving cavity. The housing cap may include an attenuation wall positioned between the reference sensor and the optical radiation receiver.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module includes a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap being a molded cap, the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a substrate comprising first conductive pads; a module cap assembled on the substrate; a connecting flex incorporated in the module cap, the connecting flex being adapted to electrically couple at least one of the first conductive pads to at least one component mounted on and/or inside the module cap; and the connecting flex comprising at least one metal layer covered by, or encapsulated in, at least one dielectric layer.

Abstract: The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a module cap adapted to at least partially cover the light-emitting device, the module cap comprising a first opening located over the light-emitting device; at least a conductive strip assembled with, or included in, the module cap; a glass positioned in the first opening and/or covering the first opening, and adapted to transmit light signals emitted by the light-emitting device, the glass including a conductive trace; and at least a conductive wire formed by wire bonding, the at least one conductive wire electrically connecting the conductive trace to the at least one conductive strip.

Abstract: An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.

Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.