Abstract: A method of making a light sensor module includes connecting a light sensing circuit to an interconnect on a substrate, and forming a cap. The cap is formed by producing a cap substrate from material opaque to light to have an opening formed therein, placing the cap substrate top-face down, dispensing a light transmissible material into the opening, compressing the light transmissible material using a hot tool to thereby cause the light transmissible material to fully flow into the opening to form at a light transmissible aperture, and placing the cap substrate into a curing environment. A bonding material is dispensed onto the substrate. The cap is picked up and placed onto the substrate positioned such that the light transmissible aperture is aligned with the light sensing circuit, with the bonding material bonding the cap to the substrate to thereby form the light sensor module.

Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.

Abstract: An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

Abstract: In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the cavity. The ball lens constraint is configured to cooperate with the constraining insert to constrain the ball lens in three dimensions within the cavity.

Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.

Abstract: In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the cavity. The ball lens constraint is configured to cooperate with the constraining insert to constrain the ball lens in three dimensions within the cavity.

Abstract: A pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.