Abstract: One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.

Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.

Abstract: In one embodiment, an optical subassembly includes a housing, a ball lens, a constraining insert, and a ball lens constraint. The housing includes a fiber receptacle formed in a first end of the housing and a second receptacle formed in a second end of the housing opposite the first end. The fiber receptacle and second receptacle define a cavity through the housing from the first end to the second end of the housing. The ball lens and the constraining insert are disposed within the cavity. The ball lens constraint is configured to cooperate with the constraining insert to constrain the ball lens in three dimensions within the cavity.

Abstract: In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.

Abstract: One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.

Abstract: One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. Some embodiments also include a retaining cover and a boot. The retaining cover secures a second end of the latch to a module in which the latching mechanism is implemented. The boot is operatively connected to the slider and can be manipulated by a user to activate the slider.

Abstract: An integrated optical interconnect. The integrated optical interconnect includes a receptacle for connecting to a first external component. The receptacle includes an EMI shield with an aperture sized to allow transmission of an optical signal through the aperture while containing EMI within the receptacle. The integrated optical interconnect also includes a port injection molded around or within a portion of the receptacle, the port being configured to receive a second external component and a lens injection molded near a location of the aperture of the EMI shield.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, a plurality of arms extending radially outward from the central portion, and a substantially centrally located opening defined in the central portion. The perimeter of the central portion is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).

Abstract: In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: In one example embodiment, a pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.

Abstract: An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.

Abstract: Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell.

Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: In one example, an optical device includes a body having a first surface and a second surface. At least a portion of the body is formed from a material that is transmissible to light. The body is configured to be positioned in an optical sub-assembly along an axis defined between an optoelectronic transducer and a port configured to receive an optical fiber. The axis is defined between a point on an optically active portion of the optoelectronic transducer and a point on a surface of the optical fiber. The first surface of the body is positioned at a first angle relative to a plane that is perpendicular to the axis. The second surface of the body is positioned at a second angle relative to the plane. The first surface and the second surface are positioned at respective opposing ends of the body.

Abstract: In at least one example, an optical component includes a central optical surface proximate an optical axis, a peripheral portion extending radially from the central optical surface, and a stepped portion between the central optical surface and the peripheral portion. The stepped portion may be formed to raise the central optical surface above the peripheral portion.

Abstract: An integrated optical interconnect. The integrated optical interconnect includes a receptacle for connecting to a first external component. The receptacle includes an EMI shield with an aperture sized to allow transmission of an optical signal through the aperture while containing EMI within the receptacle. The integrated optical interconnect also includes a port injection molded around or within a portion of the receptacle, the port being configured to receive a second external component and a lens injection molded near a location of the aperture of the EMI shield.

Abstract: In at least one example, an optical component includes a central optical surface proximate an optical axis, a peripheral portion extending radially from the central optical surface, and a stepped portion between the central optical surface and the peripheral portion. The stepped portion may be formed to raise the central optical surface above the peripheral portion.