Patents by Inventor Tatsuhiko Ueki

Tatsuhiko Ueki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10379609
    Abstract: Provided are a line-of-sight measurement device and method, which perform automatic calibration of line-of-sight measurement for distance-gazing users. The device is provided with: an optical axis-calculating means for calculating the optical axes of both the left and right eyeballs when viewing two distant points; a discrepancy calculating means for calculating, with the visual axes of the left and right eyeballs during distance-gazing being parallel as a constraint, the discrepancies between the optical axes and the visual axes for both the left and right eyeballs; and a fixation point-calculating means for calculating the user's fixation point on the basis of the discrepancy between the optical axes and the visual axes. For the constraint, the outer product value of the respective vectors of the left and right eye visual axes is 0 or the inner product of the respective unit vectors of the left and right eye visual axes is 1.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: August 13, 2019
    Assignee: National University Corporation Kobe University
    Inventors: Takashi Nagamatsu, Tatsuhiko Ueki
  • Publication number: 20160086338
    Abstract: Provided are a line-of-sight measurement device and method, which perform automatic calibration of line-of-sight measurement for distance-gazing users. The device is provided with: an optical axis-calculating means for calculating the optical axes of both the left and right eyeballs when viewing two distant points; a discrepancy calculating means for calculating, with the visual axes of the left and right eyeballs during distance-gazing being parallel as a constraint, the discrepancies between the optical axes and the visual axes for both the left and right eyeballs; and a fixation point-calculating means for calculating the user's fixation point on the basis of the discrepancy between the optical axes and the visual axes. For the constraint, the outer product value of the respective vectors of the left and right eye visual axes is 0 or the inner product of the respective unit vectors of the left and right eye visual axes is 1.
    Type: Application
    Filed: May 22, 2014
    Publication date: March 24, 2016
    Inventors: Takashi NAGAMATSU, Tatsuhiko UEKI
  • Patent number: 7403347
    Abstract: An optical module including a temperature measurement module and an optical part having a temperature dependency. The module includes a temperature control part mounted directly or indirectly on the optical part and the temperature measurement part for controlling a temperature of the optical part and the measurement part by thermal contact. An adjustment system is also provided for adjusting a difference of the temperature of the optical part and the measurement part by controlling the heat flow into/out of the optical part or the measurement part.
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: July 22, 2008
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Tatsuya Kimoto, Hiroyuki Kobayashi, Toshikazu Mukaihara, Mamoru Shimada, Yuji Hiratani
  • Publication number: 20050139249
    Abstract: A thermoelectric module comprises an upper insulating substrate and a lower insulating substrate; an upper electric circuit metal layer and a lower electric circuit metal layer bonded respectively to the surfaces of said insulating substrates which are positioned face to face; an upper blast stopper layer and a lower blast stopper layer fabricated respectively on said electric circuit metal layers; an upper bonding layer and a lower bonding layer fabricated respectively on said blast stopper layers; and a plurality of -shaped elements consisting of a pair of the P-type semiconductor element and N-type semiconductor element which are fabricated between said upper and lower bonding layers and are electrically connected in series through said upper and lower blast stopper layers.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 30, 2005
    Inventors: Tatsuhiko Ueki, Yoshinori Nakamura, Yuji Hiratani
  • Publication number: 20050126759
    Abstract: A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.
    Type: Application
    Filed: October 27, 2004
    Publication date: June 16, 2005
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Masaaki Yamamoto, Yuichi Kimura
  • Publication number: 20050117231
    Abstract: An optical module including a temperature measurement module and an optical part having a temperature dependency. The module includes a temperature control part mounted directly or indirectly on the optical part and the temperature measurement part for controlling a temperature of the optical part and the measurement part by thermal contact. An adjustment system is also provided for adjusting a difference of the temperature of the optical part and the measurement part by controlling the heat flow into/out of the optical part or the measurement part.
    Type: Application
    Filed: October 4, 2004
    Publication date: June 2, 2005
    Applicant: The FURUKAWA ELECTRIC CO., LTD
    Inventors: Tatsuhiko Ueki, Tatsuya Kimoto, Hiroyuki Kobayashi, Toshikazu Mukaihara, Mamoru Shimada, Yuji Hiratani
  • Patent number: 6871701
    Abstract: A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: March 29, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Masaaki Yamamoto, Yuichi Kimura
  • Patent number: 6856475
    Abstract: An optical module of the present invention can stabilize e.g. the temperature of a wavelength monitor portion so that the oscillating wavelength of a laser diode is stabilized. The laser diode and the wavelength monitor portion for monitoring the wavelength of the laser diode are included in a package, and are mounted onto a thermo module. The wavelength monitor portion comprise at least an optical filter positioned to receive and filter at least a component of the laser beam and a light receiving device to receive the filtered light through the optical filter and monitor a wavelength of the laser beam. A heat shield member for reducing heat transmission from the package to the wavelength monitor portion is arranged in at least one portion of a peripheral area of the wavelength monitor portion.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 15, 2005
    Assignee: The Furukawa Electric Co., LTD
    Inventors: Hideyuki Nasu, Takehiko Nomura, Tatsuhiko Ueki, Mamoru Shimada
  • Patent number: 6837059
    Abstract: A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S1(mm2) and that an amount of generated heat of the heat generating element is Qd(mW), the relationship of 20?Qd/S1?200 is met.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: January 4, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Mamoru Shimada, Yuji Hiratani
  • Publication number: 20040211190
    Abstract: A temperature adjustment device has a first thermoelectric cooling module, a second thermoelectric cooling module on which the first thermoelectric cooling module is provided, and a heat generating element which is provided on the first thermoelectric cooling module and a temperature thereof is adjusted, where assuming that a substrate area of the first thermoelectric cooling module on which the heat generating element is provided is S1 (mm2) and that an amount of generated heat of the heat generating element is Qd (mW), the relationship of 20≦Qd/S1≦200 is met.
    Type: Application
    Filed: September 16, 2003
    Publication date: October 28, 2004
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Mamoru Shimada, Yuji Hiratani
  • Patent number: 6807208
    Abstract: An optical filter is provided on a first thermo-module whose temperature is controlled to be constant, via a base. Accordingly, a wavelength discrimination characteristic of the optical filter and an optical isolator can be stabilized, thereby realizing more accurate wavelength locking. Further, a second thermo-module is provided on the first thermo-module whose temperature is controlled to be constant. Accordingly, the temperature control range of the second thermo-module can be expanded, and hence the wavelength variable range of a semiconductor laser device provided on the second thermo-module via a base and a submount can be expanded.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: October 19, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hideyuki Nasu, Takehiko Nomura, Tatsuhiko Ueki, Mamoru Shimada, Yuji Hiratani
  • Publication number: 20030173064
    Abstract: A plate-type heat pipe including a hermetically sealed container in which a working fluid is received, said container comprising a plate member on which at least one heat generating device is thermally connected and another plate member forming a cavity inside thereof in combination with said plate member, and said container being formed by pressure-bonding both peripheral portions of said plate member and said another plate member combined together.
    Type: Application
    Filed: March 26, 2002
    Publication date: September 18, 2003
    Inventors: Tatsuhiko Ueki, Masaaki Yamamoto, Yuichi Kimura
  • Publication number: 20030095346
    Abstract: An optical module of the present invention can stabilize e.g. the temperature of a wavelength monitor portion so that the oscillating wavelength of a laser diode is stabilized. The laser diode and the wavelength monitor portion for monitoring the wavelength of the laser diode are included in a package, and are mounted onto a thermo module. The wavelength monitor portion comprise at least an optical filter positioned to receive and filter at least a component of the laser beam and a light receiving device to receive the filtered light through the optical filter and monitor a wavelength of the laser beam. A heat shield member for reducing heat transmission from the package to the wavelength monitor portion is arranged in at least one portion of a peripheral area of the wavelength monitor portion.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 22, 2003
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hideyuki Nasu, Takehiko Nomura, Tatsuhiko Ueki, Mamoru Shimada
  • Publication number: 20030058907
    Abstract: An optical filter is provided on a first thermo-module whose temperature is controlled to be constant, via a base. Accordingly, a wavelength discrimination characteristic of the optical filter and an optical isolator can be stabilized, thereby realizing more accurate wavelength locking. Further, a second thermo-module is provided on the first thermo-module whose temperature is controlled to be constant. Accordingly, the temperature control range of the second thermo-module can be expanded, and hence the wavelength variable range of a semiconductor laser device provided on the second thermo-module via a base and a submount can be expanded.
    Type: Application
    Filed: August 21, 2002
    Publication date: March 27, 2003
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hideyuki Nasu, Takehiko Nomura, Tatsuhiko Ueki, Mamoru Shimada, Yuji Hiratani
  • Patent number: 6381845
    Abstract: A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: May 7, 2002
    Assignee: Furakawa Electric Co., Ltd.
    Inventors: Masami Ikeda, Masaaki Yamamoto, Tatsuhiko Ueki, Ken Sasaki
  • Publication number: 20020007555
    Abstract: A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.
    Type: Application
    Filed: May 16, 2001
    Publication date: January 24, 2002
    Inventors: Masami Ikeda, Masaaki Yamamoto, Tatsuhiko Ueki, Ken Sasaki
  • Patent number: 6317322
    Abstract: A plate type heat pipe having a hermetically sealed container installed so as to face a printed board on which at least one part to be cooled is mounted, wherein a block which passes through at least one main surface portion of the container is arranged within the container in a corresponding portion to the part(s) to be cooled.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: November 13, 2001
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tatsuhiko Ueki, Masaaki Yamamoto, Masami Ikeda
  • Patent number: 6263959
    Abstract: A plate type heat pipe comprises two plate members facing each other to form a hermetically sealed container, on either one of which plate members at least one heat generating parts are mounted, at least one heat transfer block having a cross sectional area equal to or larger than a cross sectional area of the heat generating part, the heat transfer block being disposed at a prescribed position within the hollow portion corresponding to a position of the plate member to which the heat generating part is thermally connected, and a working fluid enclosed in the container.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: July 24, 2001
    Assignee: Furukawa Electric Co. Ltd.
    Inventors: Masami Ikeda, Masaaki Yamamoto, Hitoshi Sho, Tatsuhiko Ueki
  • Patent number: 6256201
    Abstract: A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: July 3, 2001
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Masami Ikeda, Masaaki Yamamoto, Tatsuhiko Ueki, Ken Sasaki
  • Publication number: 20010004934
    Abstract: A compressed mesh wick prepared by bending for plurality of times at least one sheet of band type mesh wire to form a prescribed shape, thus preparing a bent layered mesh body, and pressing the bent layered mesh body.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 28, 2001
    Inventors: Masaaki Yamamoto, Tatsuhiko Ueki, Masami Ikeda